Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2012Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2011High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A.
Conference Paper
2010Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Low-temperature contacts through SixNy-antireflection coatings for inverted a-Si:H/c-Si hetero-contact solar cells
Wünsch, F.; Klein, D.; Podlasly, A.; Ostmann, A.; Schmidt, M.; Kunst, M.
Conference Paper, Journal Article