Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization
Septriani, B.; Pleguezuelo, P.R.; Beckert, E.; Eberhardt, R.; Tünnermann, A.
Conference Paper
2016High-precision optomechanical lens system for space applications assembled by a local soldering technique
Pleguezuelo, P.R.; Koechlin, C.; Hornaff, M.; Kamm, A.; Beckert, E.; Fiault, G.; Eberhardt, R.; Tünnermann, A.
Journal Article