Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Advanced detection method for polymer residues on semiconductor substrates
Richter, H.; Pfitzner, L.; Pfeffer, M.; Bauer, A.; Siegert, J.; Bodner, T.
Conference Paper
2016Semiconductor equipment assessment - An enabler for production ready equipment
Pfeffer, M.; Pfitzner, L.; Bauer, A.
Conference Paper
2015Nanoelectronics research gaps and recommendations. Editorial
Galatsis, K.; Gargini, P.; Hiramoto, T.; Beernaert, D.; DeKeersmaecker, R.; Pelka, J.; Pfitzner, L.
Journal Article
2015Semiconductor equipment assessment - an enabler for production ready equipment
Pfeffer, M.; Pfitzner, L.; Bauer, A.
Conference Paper
2014The Factory Integration Roadmap in Semiconductor manufacturing
Moyne, J.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2014Feasibility evaluation of virtual metrology for the example of a trench etch process
Roeder, G.; Winzer, S.; Schellenberger, M.; Jank, S.; Pfitzner, L.
Journal Article
2014High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using thermal laser separation
Lewke, D.; Koitzsch, M.; Dohnke, K.O.; Schellenberger, M.; Zuehlke, H.-U.; Rupp, R.; Pfitzner, L.; Ryssel, H.
Conference Paper
2013Characterization of thin ZnO films by vacuum ultra-violet reflectometry
Gumprecht, T.; Petrik, P.; Roeder, G.; Schellenberger, M.; Pfitzner, L.; Pollakowski, B.; Beckhoff, B.
Conference Paper
2013Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images
Lewke, D.; Schellenberger, M.; Pfitzner, L.; Fries, T.; Tröger, B.; Muehlig, A.; Riedel, F.; Bauer, S.; Wihr, H.
Conference Paper
2013Improving electric behavior and simplifying production of Si-based diodes by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Kolb, R.; Zühlke, H.-U.
Conference Paper
2013Practical aspects of virtual metrology and predictive maintenance model development and optimization
Schöpka, U.; Roeder, G.; Mattes, A.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Scheibelhofer, P.
Conference Paper
2013Virtual metrology for prediction of etch depth in a trench etch process
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Winzer, S.; Jank, S.
Conference Paper
2012Der "Zauberspiegel" als Messprinzip
Tobisch, Alexander; Schellenberger, Martin; Pfitzner, Lothar
Journal Article
2012Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke Hans-Ulrich
Conference Paper
2012Assessment of a FOUP conditioning equipment for advanced semiconductor application
Otto, M.; Rioufrays, S.; Favre, A.; Leibold, A.; Altmann, R.; Gennaro, S.; Dell'Anna, R.; Canteri, R.; Pfitzner, L.
Conference Paper
2012Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Zühlke, H.U.
Conference Paper
2012Framework for integration of virtual metrology and predictive maintenance
Roeder, G.; Mattes, A.; Pfeffer, M.; Schellenberger, M.; Pfitzner, L.; Knapp, A.; Mühlberger, H.; Kyek, A.; Lenz, B.; Frisch, M.; Bichlmeier, J.; Leditzky, G.; Lind, E.; Zoia, S.; Fazio, G.
Conference Paper
2012IMPROVE - a joint European effort to boost efficiency in semiconductor manufacturing
Schellenberger, Martin; Koitzsch, Matthias; Roeder, Georg; Pfeffer, Markus; Schöpka, Ulrich; Mattes, Andreas; Pfitzner, Lothar
Presentation
2012Measurement strategy for dielectric ultra-thin film characterization by vacuum ultra-violet reflectometry
Gumprecht, T.; Roeder, G.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2012Predictive sampling approach to dynamically optimize defect density control operations
Pfeffer, M.; Oechsner, R.; Pfitzner, L.; Eckert, S.; Hartmann, A.; Gold, H.; Biebl, G.; Kaspar, J.
Conference Paper
2012Reference samples for ultra trace analysis of organic compounds on substrate surfaces
Nutsch, A.; Beckhoff, B.; Borionetti, G.; Codegoni, D.; Grasso, S.; Hoenicke, P.; Leibold, A.; Müller, M.; Otto, M.; Pfitzner, L.; Polignano, M.-L.
Conference Paper
2012Thermal laser separation and its applications
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article
2011Determination of the dill parameters of thick positive resist for use in modeling applications
Roeder, G.; Liu, S.; Aygun, G.; Evanschitzky, P.; Erdmann, A.; Schellenberger, M.; Pfitzner, L.
Conference Paper, Journal Article
2011Developing a framework for virtual metrology and predictive maintenance
Schellenberger, Martin; Roeder, Georg; Mattes, Andreas; Pfeffer, Markus; Pfitzner, Lothar; Knapp, Alexander; Mühlberger, Heribert; Bichlmeier, Josef; Valeanu, Christian; Kyek, Andreas; Lenz, Benjamin; Frisch, Markus; Leditzky, Günther
Journal Article
2010Highly sensitive wavefront sensor for visual inspection of bare and patterned silicon wafers
Lazareva, I.; Nutsch, A.; Schellenberger, M.; Pfitzner, L.; Frey, L.
Conference Paper
2010Impact of temperature increments on tunneling barrier height and effective electron mass for plasma nitrided thin SiO2 layer on a large wafer area
Aygun, G.; Roeder, G.; Erlbacher, T.; Wolf, M.; Schellenberger, M.; Pfitzner, L.
Journal Article
2010Optical inspection of flat reflective surfaces by a wave front sensor
Lazareva, I.; Nutsch, A.; Pfitzner, L.; Frey, L.
Conference Paper
2010Virtual equipment engineering: A continuous simulation chain leveraging development of new semiconductor manufacturing equipment
Mattes, A.; Koitzsch, M.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2010Virtual equipment engineering: A novel approach for the integrated development of semiconductor manufacturing equipment
Koitzsch, M.; Mattes, A.; Schellenberger, M.; Pfitzner, L.; Frey, L.
Conference Paper
2010Yield model for estimation of yield impact of semiconductor manufacturing equipment
Nutsch, A.; Oechsner, R.; Schoepka, U.; Pfitzner, L.
Conference Paper
2009Characterization of organic contamination in semiconductor manufacturing processes
Nutsch, A.; Beckhoff, B.; Bedana, G.; Borionetti, G.; Codegoni, D.; Grasso, S.; Guerinoni, G.; Leibold, A.; Müller, M.; Otto, M.; Pfitzner, L.; Polignano, M.; Simone, D. de; Frey, L.
Conference Paper
2009Complementary metrology within a European joint laboratory
Nutsch, A.; Beckhoff, B.; Altmann, R.; Berg, J.A. van den; Giubertoni, D.; Hoenicke, P.; Bersani, M.; Leibold, A.; Meirer, F.; Müller, M.; Pepponi, G.; Otto, M.; Petrik, P.; Reading, M.; Pfitzner, L.; Ryssel, H.
Conference Paper
2009Highly sensitive wavefront sensor for characterization of micro- to nanometer-scale surface flatness deviations
Lazareva, I.; Nutsch, A.; Pfitzner, L.; Frey, L.
Conference Paper
2009Monitoring system for airborne molecular contamination (AMC) in semiconductor manufacturing areas and micro-environments
Otto, M.; Leibold, A.; Wulf, L.; Hurlebaus, M.; Pfitzner, L.
Conference Paper
2009Performance optimization of semiconductor manufacturing equipment by the application of discrete event simulation
Pfeffer, M.; Pfitzner, L.; Ocker, B.; Öchsner, R.; Ryssel, H.; Verdonck, P.
Conference Paper
2009Properties of TaN thin films produced using PVD linear dynamic deposition technique
Kozlowska, M.; Oechsner, R.; Pfeffer, M.; Bauer, A.J.; Meissner, E.; Pfitzner, L.; Ryssel, H.; Maass, W.; Langer, J.; Ocker, B.; Schmidbauer, S.; Gonchond, J.-P.
Journal Article, Conference Paper
2009Wave front sensor for highly accurate characterization of flatness on wafer surfaces
Nutsch, A.; Bucourt, S.; Grandin, T.; Lazareva, I.; Pfitzner, L.
Conference Paper
2008Characterization of Ru and RuO2 thin films prepared by pulsed metal organic chemical vapor deposition
Roeder, G.; Manke, C.; Baumann, P.K.; Petersen, S.; Yanev, V.; Gschwandtner, A.; Ruhl, G.; Petrik, P.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.
Conference Paper, Journal Article
2008Determination of flatness on patterned wafer surfaces using wavefront sensing methods
Nutsch, A.; Pfitzner, L.; Grandin, T.; Levecq, X.; Bucourt, S.
Conference Paper
2007Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites
Oechsner, R.; Pfeffer, M.; Frickinger, J.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Journal Article
2007Chemical mechanical planarization (CMP) metrology for 45/32 nm technology generations
Nutsch, A.; Pfitzner, L.
Conference Paper
2007Control of flatness for chemical mechanical planarization
Nutsch, A.; Pfitzner, L.
Conference Paper
2007Detection and review of crystal originated surface and sub surface defects on bare silicon
Nutsch, A.; Funakoshi, T.; Pfitzner, L.; Steffen, R.; Supplieth, F.; Ryssel, H.
Conference Paper
2007Metrology, analysis and characterization in micro- and nanotechnologies
Pfitzner, L.; Nutsch, A.; Öchsner, R.; Pfeffer, M.; Don, E.; Wyon, C.; Hurlebaus, M.
Conference Paper
2007Process optimization by means of integrated monitoring tools in the semiconductor industry
Pfitzner, L.H.; Nutsch, A.; Roeder, G.; Schellenberger, M.
Conference Paper
2006Approach for a standardized methodology for mulit-site processing of 300 mm wafers at R&D-sites
Öchsner, R.; Frickinger, J.; Pfeffer, M.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Conference Paper
2006Creation of e-learning content for microelectronics manufacturing
Öchsner, R.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Beer, K.; Boldin, M.; Mey, B. de; Engelhard, M.; O'Murchu, C.; Ditmar, J.; Colson, P.; Madore, M.; Krahn, L.; Kempe, W.; Luisman, E.
Conference Paper
2006Creation of e-learning content for microelectronics manufacturing
Öchsner, R.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Beer, K.; Boldin, M.; Mey, B. de; Engelhard, M.; O'Murchu, C.; Ditmar, J.; Colson, P.; Madore, M.; Krahn, L.; Kempe, W.; Luisman, E.
Conference Paper
2006Flying Wafer - A standardised methodology for multi-site processing of 300 mm wafers at R&D-sites
Frickinger, J.; Oechsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claeys, C.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Flying wafer - A standardised methodology for multi-site processing Of 300 Mm wafers at research and development-sites
Frickinger, J.; Öchsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Geraet zur schnellen Messung winkelabhaengiger Beugungseffekte an feinstrukturierten Oberflaechen
Benesch, N.; Schneider, C.; Pfitzner, L.
Patent
2006Prospects for the realization of APC in a distributed 300 mm R&D-line
Roeder, G.; Schellenberger, M.; Öchsner, R.; Pfeffer, M.; Frickinger, J.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.
Conference Paper
2006Standardization of integrated ellipsometry for semiconductor manufacturing
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Richter, U.; Stehle, J.L.; Piel, J.-P.
Conference Paper
2006Trends in European R&D - Advanced process control down to atomic scale for micro- and nanotcchnologies
Pfitzner, L.; Schellenberger, M.; Oechsner, R.; Roeder, G.; Pfeffer, M.
Conference Paper
2006VORRICHTUNG ZUR SCHNELLEN, QUANTITATIVEN, KONTAKTLOSEN TOPOGRAFISCHEN UNTERSUCHUNG VON HALBLEITERSCHEIBEN ODER SPIEGELAEHNLICHEN OBERFLAECHEN
Lukacs, E.; Makai, J.; Riesz, F.; Szentpali, B.; Pfitzner, L.
Patent
2005Reliable matching of 300 mm defect inspection tools @ sub 60 nm defect size
Nutsch, A.; Supplieth, F.; Pfitzner, L.; Ryssel, H.
Conference Paper
2005SEA-Net - Semiconductor equipment assessment (SEA) migrates to nano electronic technology (NET)
Bruchez, J.; Pfitzner, L.
Book Article
2005Unit process aspects for APC-software implementation
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Spitzlsperger, G.
Conference Paper
2004E-Learning for microelectronics manufacturing
Oechsner, R.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Beer, K.; Boldin, M.
Conference Paper
2004Effective-medium model for fast evaluation of scatterometric measurements on gratings
Weidner, A.; Slodowski, M.; Halm, C.; Schneider, C.; Pfitzner, L.
Conference Paper
2004Measurement data evaluation for in situ single-wavelength ellipsometry during reactive ion etching
Roeder, G.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Presentation
2004Polierverfahren in der Halbleiterfertigung
Pfitzner, L.; Bär, E.; Frickinger, J.; Nguyen, H.; Nutsch, A.
Conference Paper
2004Qualitaetsueberwachung bei einer Fertigung mit breitem Produktspektrum
Oechsner, R.; Tschaftary, T.; Strzyzewski, P.; Pfitzner, L.; Schneider, C.; Hennig, P.
Patent
2003Anordnung zur Bestimmung der Konzentration kontaminierender Teilchen in einem Be- und Entladebereich eines Geraetes zur Verarbeitung wenigstens eines scheibenfoermigen Objektes
Trunk, R.; Schneider, C.; Pfitzner, L.; Storbeck, O.
Patent
2003Defect inspection method for quality control in a reclaim line
Nutsch, A.; Fritsche, M.; Dudenhausen, H.-M.; Pfitzner, L.; Ryssel, H.
Conference Paper
2003Partikelmessgeraetanordnung sowie Geraet zur Prozessierung von Halbleiterscheiben mit einer solchen Anordnung
Trunk, R.; Schmid, H.; Schneider, C.; Pfitzner, L.
Patent
2003VORRICHTUNG ZUR UEBERWACHUNG VON ABSICHTLICHEN ODER UNVERMEIDBAREN SCHICHTABSCHEIDUNGEN UND VERFAHREN
Ziegler, J.; Waller, R.; Pfitzner, L.; Schneider, C.; Ryssel, H.; Tegeder, V.
Patent
2003Wafer reclaim in semiconductor manufacturing
Frickinger, J.; Nutsch, A.; Pfitzner, L.; Ryssel, H.; Zielonka, G.
Book Article
2002From overall equipment efficiency (OEE) to overall Fab effectiveness (OFE)
Oechsner, R.; Pfeffer, M.; Pfitzner, L.; Binder, H.; Müller, E.; Vonderstrass, T.
Conference Paper, Journal Article
2002HandMon-ISPM: Handling monitoring in a loading stations of a furnaces
Trunk, R.; Schmid, H.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Bernhardt, H.; Marx, E.
Conference Paper
2002Phi-scatterometry for integrated linewidth and process control in DRAM manufacturing
Hettwer, A.; Benesch, N.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Journal Article
2002A roadmap towards cost efficient 300mm equipment
Pfitzner, L.; Küchner, P.
Journal Article
2001Control of organic contamination in CMOS manufacturing
Bügler, J.; Frickinger, J.; Zielonka, G.; Pfitzner, L.; Ryssel, H.; Schottler, M.
Conference Paper
2001Cost reduction strategies for wafer expenditure
Pfitzner, L.; Benesch, N.; Öchsner, R.; Schmidt, C.; Schneider, C.; Tschaftary, T.; Trunk, R.; Dudenhausen, H.-M.
Journal Article
2001Development of sensors for the measurement of chamber wall depositions
Schneider, C.; Pfitzner, L.; Ryssel, H.; Marx, E.; Schneider, T.
Conference Paper
2001In Situ Particle Measurement System in Loading Stations of Furnaces
Trunk, R.; Schmid, H.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Bernhardt, H.; Marx, E.
Conference Paper
2001In-situ particle measurement in loading stations of furnaces
Trunk, R.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Storbeck, O.
Conference Paper
2001Integrated metrology. An enabler for advanced process control (APC)
Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
2001Organic Contamination Workshop 2001. Proceedings
Pfitzner, L.; Bügler, J.; Frickinger, J.
Conference Proceedings
2001Trace analysis for 300 mm wafers and processes with total- reflection x-ray-fluorescence
Nutsch, A.; Erdmann, V.; Zielonka, G.; Pfitzner, L.; Ryssel, H.
Journal Article
2000Feed-forward control for a lithography/etch sequence
Öchsner, R.; Tschaftary, T.; Sommer, S.; Pfitzner, L.; Ryssel, H.; Gerath, H.; Baier, C.; Hafner, M.
Conference Paper
2000In-production monitoring and control of in situ-chamber clean processes
Roeder, G.; Andrian-Werburg, M. von; Tschaftary, T.; Schneider, C.; Pfitzner, L.; Ryssel, H.; John, P.; Tegeder, V.
Conference Paper
2000Organic Contamination Workshop, SEMICON Europa 2000. Proceedings
: Pfitzner, L.; Bügler, J.
Conference Proceedings
2000Phi-scatterometry for on-line process control
Benesch, N.; Hettwer, A.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Broermann, O.; Marx, E.; Tegeder, V.
Conference Paper
2000Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers. The influence of material properties
Frickinger, J.; Bügler, J.; Zielonka, G.; Pfitzner, L.; Ryssel, H.; Hollemann, S.; Schneider, H.
Journal Article
2000SEMICON Europa 2000. Proceedings
: Pfitzner, L.; Bügler, J.
Conference Proceedings
2000Verfahren und Vorrichtung zur optischen Kontrolle von Fertigungsprozessen feinstrukturierter Oberflaechen in der Halbleiterfertigung
Benesch, N.; Schneider, C.; Pfitzner, L.
Patent
2000Verfahren und Vorrichtung zur Ueberfuehrung eines Fluessigkeitsstromes in einen Gasstrom
Strzyzewski, P.; Roeder, G.; Pfitzner, L.; Ryssel, H.
Patent
1999Application and cost analysis of scatterometry for integrated metrology
Benesch, N.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
1999Equipment and wafer modeling of batch furnaces by neural networks
Benesch, N.; Schneider, C.; Lehnert, W.; Pfitzner, L.; Ryssel, H.
Conference Paper
1999Novel process control strategies for 300 mm semiconductor production
Pfitzner, L.; Oechsner, R.; Schneider, C.; Ryssel, H.; Riemer, M.; Podewils, M. von
Journal Article
1998In situ layer characterization by spectroscopic ellipsometry at high temperatures
Lehnert, W.; Petrik, P.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
1998In situ spectroscopic ellipsometry for advanced process control in vertical furnaces
Lehnert, W.; Berger, R.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Stehle, J.L.; Piel, J.-P.; Neumann, W.
Conference Paper
1998Productronica 97. Proceedings HLF. Semiconductor equipment and materials contamination control and defect reduction
Ryssel, H.; Pfitzner, L.; Trunk, R.
Book
1997Integrated process control for cluster tools using an in-line analytical module
Kasko, I.; Oechsner, R.; Froeschle, B.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
1997Metrology and analytics for the optimization of CMP processing
Huber, A.; Erdmann, V.; Zielonka, G.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Rohde, A.
Conference Paper
1997Modular metrology tools for productivity enhancement in wafer fabs
Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
1997Monitoring strategies for yield enhancement
Pfitzner, L.; Oechsner, R.; Scheider, C.; Ryssel, H.; Riemer, M.; Treiber, T.; Podewils, M. von
Conference Paper
1997A novel XPS system for integration into advanced semiconductor equipment for in-line process control
Kasko, I.; Oechsner, R.; Schneider, C.; Pfitzner, L.; Ryssel, H.; Trubitsyn, A.A.; Kratenko, V.I.
Conference Paper
1996Advanced process control system for vertical furnaces
Berger, R.; Schneider, C.; Lehnert, W.; Pfitzner, L.; Ryssel, H.
Book Article
1996The challenge of multi-component, multi-vendor clustertools
Pfitzner, L.; Schneider, C.; Ryssel, H.
Conference Paper
1994Applications of single-beam photothermal analysis
Schork, R.; Krügel, S.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Journal Article
1990Meßtechnik und Analytik für Halbleiterfertigungsgeräte
Eichinger, P.; Pfitzner, L.; Ryssel, H.; Schneider, C.
Conference Paper
1990Sicherheit bei Halbleiterfertigungsgeräten
Streckfuß, N.; Pfitzner, L.; Ryssel, H.; Ryzlewicz, C.
Conference Proceedings
1990Untersuchungen über Regelparameter in einer Lithographiezelle
Pfitzner, L.; Ryssel, H.; Temmel, G.; Zielonka, G.
Conference Paper
1989Entwicklung von Prozessmodulen und in-situ-Meßmethoden für ein Flexibles Fotolithografisches Prozeßzentrum
Temmel, G.; Zielonka, G.; Olbrich, H.; Mann, R.; Pfitzner, L.; Ryssel, H.
Conference Paper
1989Internal process control and automation for semiconductor manufacturing equipment
Pfitzner, L.; Ryssel, H.; Schneider, C.
Conference Paper
1989International process control and automation for semiconductor manufacturing equipment
Pfitzner, L.; Ryssel, H.; Schneider, C.
Conference Paper
1989Prozeßtechnische Aspekte fortschrittlicher Halbleiterfertigungsgeräte
Pfitzner, L.; Ryssel, H.; Schmutz, W.
Journal Article
1987Prozeßüberwachung bei Halbleiterfertigungsgeräten
Ryssel, H.; Pfitzner, L.
Conference Paper
1987Studie über den Stand der Technik und zukünftige Anforderungen an Fertigungseinrichtungen zur Herstellung von Halbleiterbauelementen unter Berücksichtigung verschiedener Herstellungsverfahren
Aderhold, W.; Frühauf, W.; Herz, R.; Kahlden, T. von; Pfitzner, L.; Ryssel, H.; Sauter, K.-D.; Schmutz, W.; Schraft, R.D.
Study
1986Anforderungen an den Reinraum aus der Sicht der Halbleitertechnologie
Ryssel, H.; Pfitzner, L.
Conference Paper
1986Studie ueber den Stand der Technik und zukuenftige Anforderungen an Fertigungseinrichtunen zur Herstellung von Halbleiterbauelementen unter Beruecksichtigungen verschiedener Herstellungsverfahren
Aderhold, W.; Fruehauf, W.; Herz, R.; Kahlden, T. von; Pfitzner, L.; Ryssel, H.; Sauter, K.-D.; Schmutz, W.; Schraft, R.D.
Study