Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity
Brand, S.; Vogg, G.; Petzold, M.
Journal Article
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Conference Paper
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Conference Paper
2018Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
Conference Paper
2017Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
Journal Article
2017Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, G.; Tao, X.; Broas, M.; Mäntyoja, N.; Vuorinen, V.; Graff, A.; Altmann, F.; Petzold, M.; Paulasto-Kröckel, M.
Journal Article
2017On reproducing the copper extrusion of through-silicon-vias from the atomic scale
Liu, J.; Huang, Z.; Conway, P.P.; Altmann, F.; Petzold, M.; Naumann, F.
Conference Paper
2017XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.
Journal Article
2016Claudin-16 deficiency impairs tight junction function in ameloblasts, leading to abnormal enamel formation
Bardet, C.; Courson, F.; Wu, Y.; Khaddam, M.; Salmon, B.; Ribes, S.; Thumfart, J.; Yamaguti, P.M.; Rochefort, G.Y.; Figueres, M.L.; Breiderhoff, T.; Garcia-Castano, A.; Vallee, B.; Denmat, D. le; Baroukh, B.; Guilbert, T.; Schmitt, A.; Masse, J.M.; Bazin, D.; Lorenz, G.; Morawietz, M.; Hou, J.H.; Carvalho-Lobato, P.; Manzanares, M.C.; Fricain, J.C.; Talmud, D.; Demontis, R.; Neves, F.; Zenaty, D.; Berdal, A.; Kiesow, A.; Petzold, M.; Menashi, S.; Linglart, A.; Acevedo, A.C.; Vargas-Poussou, R.; Müller, D.; Houillier, P.; Chaussain, C.
Journal Article
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Innovative failure analysis techniques for 3-D packaging developments
Altmann, F.; Petzold, M.
Journal Article
2015Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.
Conference Paper
2015A descriptive in vitro electron microscopic study of acidic fluoride-treated enamel: Potential anti-erosion effects
Hjortsjö, C.; Young, A.; Kiesow, A.; Cismak, A.; Berthold, L.; Petzold, M.
Journal Article
2014EMMPRIN/CD147 deficiency disturbs ameloblast-odontoblast cross-talk and delays enamel mineralization
Khaddam, M.; Huet, E.; Vallée, B.; Bensidhoum, M.; Denmat, D. le; Filatova, A.; Jimenez-Rojo, L.; Ribes, S.; Lorenz, G.; Morawietz, M.; Rochefort, G.Y.; Kiesow, A.; Mitsiadis, T.A.; Poliard, A.; Petzold, M.; Gabison, E.E.; Menashi, S.; Chaussain, C.
Journal Article
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Conference Paper
2014Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies
Altmann, F.; Brand, S.; Höche, T.; Krause, M.; Petzold, M
Book Article
2014Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials
März, B.; Graff, A.; Klengel, R.; Petzold, M.
Journal Article
2014Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads
Merkle, L.; Sonner, M.; Petzold, M.
Journal Article
2014Mechanical characterization of bond wire materials in electronic devices at elevated temperatures
Lorenz, G.; Naumann, F.; Mittag, M.; Petzold, M.
Conference Paper
2014Novel failure diagnostic methods for smart card systems
Klengel, S.; Brand, S.; Große, C.; Altmann, F.; Petzold, M.
Conference Paper
2014Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies
Brand, S.; Lapadatu, A.; Djuric, T.; Czurratis, P.; Schischka, J.; Petzold, M.
Journal Article
2013Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P.
Conference Paper
2013Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.
Journal Article
2013Characterization and modeling of copper TSVs for silicon interposers
Malta, D.; Gregory, C.; Lueck, M.; Lannon, J.; Lewis, J.; Temple, D.; DiFonzo, P.; Naumann, F.; Petzold, M.
Conference Paper
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Conference Paper
2013Dental tribology at the microscale
Scherge, M.; Sarembe, S.; Kiesow, A.; Petzold, M.
Journal Article
2013Determination of hardness and Young's modulus for important III-V compound semiconductors
Klinger, V.; Roesener, T.; Lorenz, G.; Petzold, M.; Dimroth, F.
Journal Article
2013Differences in intermetallic phase growth in thermally aged alloyed gold bond interconnections on aluminium
Maerz, B.; Graff, A.; Klengel, R.; Petzold, M.
Conference Paper
2013Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration
Naumann, F.; Bernasch, M.; Siegert, J.; Carniello, S.; Petzold, M.
Conference Paper
2013Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M.
Conference Paper
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Conference Paper
2013Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Conference Paper
2012Characterizing the anisotropic hardening behavior of aluminum bonding wires
Altenbach, H.; Dresbach, C.; Petzold, M.
Conference Paper
2012Characterizing the chip damage potential during wafer probing of highly integrated devices
Lorenz, G.; Stephan, T.; Petzold, M.
Conference Paper
2012Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Merkle, L.; Sonner, M.; Petzold, M.
Journal Article
2012Emerging techniques for 3-D integrated system-in-package failure diagnostics
Altmann, F.; Petzold, M.
Journal Article
2012Failure analysis using scanning acoustic microscopy for diagnostics of electronic devices and 3D system integration technologies
Czurratis, P.; Hoffrogge, P.; Brand, S.; Altmann, F.; Petzold, M.
Conference Paper
2012Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M.
Conference Paper, Journal Article
2012High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
Conference Paper
2012The impact of material composition and process parameters on the cSi solar cell interconnection
Schindler, S.; Schneider, J.; Klengel, R.; Petzold, M.
Conference Paper
2012Low temperature fusion wafer bonding quality investigation for failure mode analysis
Dragoi, V.; Czurratis, P.; Brand, S.; Beyersdorfer, J.; Patzig, C.; Krugers, J.; Schrank, F.; Siegert, J.; Petzold, M.
Conference Paper, Journal Article
2012Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Conference Paper
2012A proper alternative: Ultra sonic bonding for thin film solar cell interconnections
Klengel, R.; Stephan, T.; Petzold, M.; Schindler, S.; Schneider, J.; Spira, K.
Conference Paper
2012Quality control of bond strength in low-temperature bonded wafers
Siegert, J.; Cassidy, C.; Schrank, F.; Gerbach, R.; Naumann, F.; Petzold, M.
Conference Paper, Journal Article
2012Reliability characterization of heavy wire bonding materials
Naumann, F.; Schischka, J.; Koetter, S.; Milke, E.; Petzold, M.
Conference Paper
2012Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M.
Conference Paper
2012A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.
Conference Paper, Journal Article
20113D Sensor application with open through silicon via technology
Kraft, J.; Schrank, F.; Teva, J.; Siegert, J.; Koppitsch, G.; Cassidy, C.; Wachmann, E.; Altmann, F.; Brand, S.; Schmidt, C.; Petzold, M.
Conference Paper
2011Acoustic inspection of high-density-interconnects for 3D-integration
Brand, S.; Petzold, M.; Czurratis, P.; Reed, J.D.; Lueck, M.; Gregory, C.; Huffman, A.; Lennon, J.M.; Temple, D.S.
Conference Paper
2011Analysis of chip damage risk in thermosonic wire bonding
Dresbach, C.; Lorenz, G.; Petzold, M.; Altenbach, H.
Conference Paper
2011Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution
Krause, M.; Altmann, F.; Schmidt, C.; Petzold, M.; Malta, D.; Temple, D.
Conference Paper
2011Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
Malta, D.; Gregory, C.; Lueck, M.; Temple, D.; Krause, M.; Altmann, F.; Petzold, M.; Weatherspoon, M.; Miller, J.
Conference Paper
2011Characterization of wafer-bonded joins using high-resolution transmission electron microscopy
Höche, T.; Graff, A.; Altmann, F.; Petzold, M.
Conference Paper, Journal Article
2011Determination of elastic strains using electron backscatter diffraction in the scanning electron microscope
Krause, M.; Petzold, M.; Wehrspohn, R.B.
Book Article
2011Electro- and thermomigration in micro bump interconnects for 3D integration
Meinshausen, L.; Weide-Zaage, K.; Petzold, M.
Conference Paper
2011Extending acoustic microscopy for comprehensive failure analysis applications
Brand, S.; Czurratis, P.; Hoffrogge, P.; Temple, D.; Malta, D.; Reed, J.; Petzold, M.
Journal Article
2011Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M.
Conference Paper
2011Finite element modeling and raman study of strain distribution in patterned device islands on strained silicon-on-insulator (sSOI) substrates
Gu, D.; Baumgart, H.; Naumann, F.; Petzold, M.
Conference Paper
2011High resolution acoustical imaging of high-density-interconnects for 3D-integration
Brand, S.; Petzold, M.; Czurratis, P.; Reed, J.D.; Lueck, M.; Gregory, C.; Huffman, A.; Lannon, J.M.; Temple, D.S.
Conference Paper
2011High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach
Klengel, S.; Böttge, B.; Petzold, M.; Schneider, W.
Conference Paper
2011Improved testing of soldered Busbar interconnects on silicon solar cells
Klengel, R.; Petzold, M.; Schade, D.; Sykes, B.
Conference Paper
2011Mechanical characterisation and modelling of thin chips
Schoenfelder, S.; Bagdahn, J.; Petzold, M.
Book Article
2011Observation of free surface-induced bending upon nanopatterning of ultrathin strained silicon layer
Moutanabbir, O.; Reiche, M.; Zakharov, N.; Naumann, F.; Petzold, M.
Journal Article
2011Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Dohle, R.; Petzold, M.; Klengel, R.; Schulze, H.; Rudolf, F.
Journal Article
2011Strain nano-engineering: SSOI as a playground
Moutanabbir, O.; Hähnel, A.; Reiche, M.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M.
Conference Paper
2010Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
Brand, S.; Czurratis, P.; Hoffrogge, P.; Petzold, M.
Conference Paper, Journal Article
2010Ceramic substrates with aluminum metallization for power application
Knoll, H.; Weidenauer, W.; Ingram, P.; Bennemann, S.; Brand, S.; Petzold, M.
Conference Paper
2010Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis
Altmann, F.; Petzold, M.; Schmidt, C.; Salzer, R.; Cassidy, C.; Tesch, P.; Smith, N.
Conference Paper
2010Elastic properties of bonding wires
Dresbach, C.; Mittag, M.; Petzold, M.
Conference Paper
2010Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale
Krause, M.; März, B.; Dresbach, C.; Petzold, M.
Conference Paper
2010Extending acoustic microscopy for comprehensive failure analysis applications
Brand, S.; Petzold, M.; Czurratis, P.; Hoffrogge, P.
Conference Paper
2010Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T.
Journal Article
2010Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M.
Conference Paper
2010Fehlermechanismen an Leiterplattenmetallisierungen für bleifrei gelötete Packageaufbauten
Bennemann, S.; Simon, M.; Petzold, M.; Altmann, F.
Conference Paper
2010Finite element modeling and Raman study of strain distribution in patterned device islands on strained Silicon-on-Insulator (sSOI) substrates
Gu, D.; Baumgart, H.; Naumann, F.; Petzold, M.
Conference Paper
2010Growth behaviour of gold-aluminum intermetallic phases (IMP) in temperature aged ball bonds observed by electron backscatter diffraction
März, B.; Scheibe, S.; Graff, A.; Petzold, M.
Conference Paper
2010High resolution analysis of intermetallic compounds in microelectronic interconnects using Electron Backscatter Diffraction and Transmission Electron Microscopy
Krause, M.; März, B.; Bennemann, S.; Petzold, M.
Conference Paper
2010Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F.
Conference Paper
2010Improved quality test method for solder ribbon interconnects on silicon solar cells
Wendt, J.; Träger, M.; Klengel, R.; Petzold, M.; Schade, D.; Sykes, R.
Conference Paper
2010Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
Lorenz, G.; Petzold, M.; Mittag, M.; Dresbach, C.; Milke, E.
Conference Paper
2010Micro structure analysis for system in package components - novel tools for fault isolation, target preparation, and high-resolution material diagnostics
Petzold, M.; Altmann, F.; Krause, M.; Salzer, R.; Schmidt, C.; Martens, S.; Mack, W.; Dömer, H.; Nowodzinski, A.
Conference Paper
2010Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding
Bennemann, S.; Dresbach, C.; Lorenz, G.; Berthold, L.; Petzold, M.
Conference Paper
2010Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
Naumann, F.; Moutanabbir, O.; Reiche, M.; Schriever, C.; Schilling, J.; Petzold, M.
Conference Paper
2010Numerische Analyse der Spannungsrelaxation nanostrukturierter sili-ziumbasierter optischer Wellenleiter zur Erzeugung nichtlinearer optischer Effekte
Naumann, F.; Schriever, C.; Bohley, C.; Schilling, J.; Petzold, M.
Conference Paper
2010On the intermetallic corrosion of Cu-Al wire bonds
Boettcher, T.; Rother, M.; Liedtke, S.; Ullrich, M.; Bollmann, M.; Pinkernelle, A.; Gruber, D.; Funke, H.-J.; Kaiser, M.; Lee, K.; Li, M.; Leung, K.; Li, T.; Farrugia, M.L.; O'Halloran, O.; Petzold, M.; März, B.; Klengel, R.
Conference Paper
2010Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.
Journal Article
2010Selbstausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen
Bräuer, J.; Böttge, B.; Wiemer, M.; Petzold, M.; Gessner, T.
Conference Paper
2010Strain stability in nanoscale patterned strained silicon-on-insulator
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M.
Journal Article, Conference Paper
2009Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M.
Conference Paper
2009Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2009The complex evolution of strain during nanoscale patterning of 60 nm thick strained silicon layer directly on insulator
Moutanabbir, O.; Reiche, M.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Journal Article
2009Ermittlung von mechanischen Defekten in Mikrosystemen anhand dynamischer Messungen für die Produktionsüberwachung
Gerbach, R.; Ebert, M.; Petzold, M.
Conference Paper
2009Investigation of strain relaxation in patterned strained silicon-on-insulator structures by Raman spectroscopy and computer simulation
Gu, D.; Naumann, F.; Petzold, M.; Zhu, M.; Baumgart, H.
Conference Paper
2009Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Dresbach, C.; Lorenz, G.; Mittag, M.; Petzold, M.; Milke, E.; Müller, T.
Conference Paper
2009Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
Dresbach, D.; Mittag, M.; Petzold, M.; Milke, M.; Müller, T.
Conference Paper
2009Probing the strain states in nanopatterned strained SOI
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Conference Paper
2009Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Petzold, M.; Klengel, R.; Dohle, R.; Schulze, H.; Rudolf, F.
Conference Paper
2008Assessment of a lasersingulation process for Si-wafers with metallized back side and small die size
Theuss, H.; Koller, A.; Kröninger, W.; Schoenfelder, S.; Petzold, M.
Conference Paper
2008Bewertung durch Zahnbürstenreinigung hervorgerufener Oberflächenveränderungen bei Prothesenkunststoffen
Gonser, F.; Kiesow, K.; Sarembe, S.; Petzold, M.
Journal Article
2008Effect of wafer bonding and layer splitting on nanomechanical properties of standard and strained SOI films
Tapily, K.; Baumgart, H.; Gu, D.; Elmustafa, A.; Krause, M.; Petzold, M.
Conference Paper
2008Elektronenoptische Untersuchungen der Bildung von CaF2-Fluoridreservoirs auf der Zahnoberfläche
Petzold, M.
Journal Article
2008III-V and III-Nitride engineered heterostructures: Wafer bonding, ion slicing and more
Moutanabbir, O.; Christiansen, S.; Senz, S.; Scholz, R.; Petzold, M.; Gösele, U.
Conference Paper
2008Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2008Scaling effects on grain size and texture of lead free interconnects - investigations by electron backscatter diffraction and nanoindentation
Krause, M.; Müller, M.; Petzold, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2008Strained silicon on wafer level by waferbonding: Materials processing, strain measurements and strain relaxation
Reiche, M.; Moutanabbir, O.; Himcinschi, C.; Christiansen, S.; Erfurth, W.; Gösele, U.; Mantl, S.; Buca, D.; Zhao, Q.; Loo, R.; Nguyen, D.; Muster, F.; Petzold, M.
Conference Paper
2007Elektronenoptische Untersuchungen - Bildung von CaF2-Fluoridreservoirs auf der Zahnoberfläche
Petzold, M.
Journal Article
2007Elektronenoptische Untersuchungen der Bildung von CaF2-Fluoridreservoirs auf der Zahnoberfläche
Petzold, M.
Journal Article
2007Identification of intermetallic compounds in microelectronic
Krause, M.; Petzold, M.
Conference Paper
2007Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B.
Conference Paper
2007The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M.
Conference Paper
2007Strain relaxation in nanopatterned strained silicon round pillars
Himcinschi, C.; Singh, R.; Radu, I.; Milenin, A.P.; Erfurth, W.; Reiche, M.; Gösele, U.; Christiansen, S.H.; Muster, F.; Petzold, M.
Journal Article
2007Uniaxially strained silicon by wafer bonding and layer transfer
Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S.H.
Conference Paper, Journal Article
2007Untersuchung der Biegebruchfestigkeit beschichteter Hartmetall-Mikrofräser
Muster, F.; Füting, M.; Theumer, T.; Petzold, M.
Conference Paper
2006Analyseverfahren, zerstörende Analyse und hochauflösende Diagnostik
Petzold, M.; Altmann, F.; Wilde, J.; Schneider-Ramelow, M.
Book Article
2006Analytical and mechanical methods for material property investigations of SnAgCu-solder
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2006Compositional effects on the creep properties of SnAgCu solder
Wiese, S.; Krämer, F.; Müller, M.; Röllig, M.; Wolter, K.-J.; Krause, M.; Bennemann, S.; Petzold, M.
Conference Paper
2006Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.
Conference Paper
2006Influence of intermetallic phases on reliability in thermosonic Au-Al wire bonding
Müller, T.; Schräpler, L.; Altmann, F.; Knoll, H.; Petzold, M.
Conference Paper
2006Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Journal Article
2006Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material
Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L.
Conference Paper
2006Methoden zur Zuverlässigkeitsqualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik
Wilde, J.; Schneider-Ramelow, M.; Petzold, M.
: Scheel, W.
Book
2006A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package
Bennemann, S.; Graff, A.; Schischka, J.; Petzold, M.; Theuss, H.; Dangelmaier, J.; Pressel, K.
Conference Paper
2006A SEM and TOF-SIMS study of CaF2-like precipitates after in vitro and in situ fluoridation
Cismak, A.; Kiesow, A.; Petzold, M.; Wirth, T.; Stiegler, S.; Schaller, H.-G.
Journal Article, Conference Paper
2006Test methods for characterizing the local plastic deformability of bonding wires
Dresbach, C.; Knoll, H.; Schischka, J.; Petzold, M.; Hosseini, K.; Schräpler, L.
Conference Paper
2005An electron microscope study of the in situ interaction between CaF2-like precipitates and dental enamel surfaces
Petzold, M.; Berthold, L.; Cismak, A.; Wohlfart-Zhou, J.; Schaller, H.-G.
Journal Article
2005A highly reliable flip chip solution based on electroplated AuSn bumps in a leadless package
Theuss, H.; Pressel, K.; Paulus, S.; Kilger, T.; Dangelmaier, J.; Lehner, R.; Eisener, B.; Kiendl, H.; Schischka, J.; Graff, A.; Petzold, M.
Conference Paper
2005Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C.
Conference Paper
2005Investigations on TS bondability of different Au wires down to room temperature
Schneider-Ramelow, M.; Petzold, M.; Knoll, H.; Wohnig, M.
Conference Paper
2005Konzepte für die Sicherung von Festigkeit und Zuverlässigkeit von Komponenten der Siliziummikromechanik
Bagdahn, J.; Petzold, M.
Conference Paper
2005Mechanical characterization of lead-free solders in FCIP devices
Krause, M.; Petzold, M.; Grau, P.
Conference Paper
2005Mechanical reliability of directly bonded silicon MEMS components
Bagdahn, J.; Wiemer, M.; Petzold, M.
Conference Paper
2005Thermosonic Drahtboden bei Verfahrenstemperaturen unter 100°C
Petzold, M.; Knoll, H.; Wohnig, M.; Rudolf, F.; Schneider-Ramelow, M.; Ferber, A.
Report
2005Untersuchungen zur TS-Ball/Wedge-Bondbarkeit von Au-Drähten bei Raumtemperatur
Schneider-Ramelow, M.; Petzold, M.; Knoll, H.; Wohning, M.
Journal Article
2004Bestimmung mechanischer Eigenschaften von Drahtbondkontaktierungen mittels instrumentierter Eindringprüfung
Knoll, H.; Schischka, J.; Petzold, M.
Conference Paper
2004Debonding of wafer-bonded interfaces for handling and transfer applications
Bagdahn, J.; Petzold, M.
Book Article
2004Ion beam polishing for embedded cross-sections and its advantages for FESEM analysis in electronic packaging
Mack, W.; Seidl, B.; Fischer, R.; Ort, T.; Walter, J.; Grünewald, J.; Berthold, L.; Petzold, M.
Conference Paper
2004A SEM and TEM study of the stability of CaF 2-like precipitates formed on dental enamel surfaces
Petzold, M.; Wohlfart-Zhou, J.; Berthold, L.; Cismak, A.; Schaller, H.-G.
Journal Article, Conference Paper
2004Strength and reliability testing for silicon based MEMS
Petzold, M.; Bagdahn, J.; Katzer, D.
Book Article
2003Debonding of directly wafer-bonded silicon after high temperature process steps
Bagdahn, J.; Knoll, H.; Petzold, M.; Wiemer, M.; Frömel,J.
Abstract
2003A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M.
Journal Article
2002Influence of the frequency on fatique of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Conference Paper
2002The microstructure of human dentine surfaces after topical fluoride treatment
Cismak, A.; Berthold, L.; Morawietz, K.; Petzold, M.
Conference Paper
2002Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J.
Conference Paper
2002Zahnoberfläche nach Fluoridierung
Petzold, M.; Berthold, L.; Cismak, A.; Morawietz, K.
Book
2001Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren
Wiemer, M; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Fatigue of directly wafer-bonded silicon under static and cyclic loading
Bagdahn, J.; Petzold, M.
Journal Article
2001Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, M.; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001The influence of different fluoride compounds and treatment conditions on dental enamel: A descriptive in vitro study of the CaF2 precipitation and microstructure
Petzold, M.; Berthold, L.; Cismak, A.; Morawietz, K.
Journal Article
2001Lifetime properties of wafer-bonded components under static and cyclic loading
Bagdahn, J.; Petzold, M.
Conference Paper
2001Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
Bagdahn, J.; Petzold, M.; Plößl, A.; Wiemer, M.
Conference Paper
2001A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Strength and fatigue investigations of polycrystalline silicon
Bagdahn, J.; Sharpe, W.N.; Schischka, J.; Petzold, M.
Conference Paper
2001Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
Petzold, M.; Knoll, H.; Bagdahn, J.
Conference Paper
2001Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2000Die Bildung von Fluoridglobuli auf Schmelz bei kurzzeitiger Einwirkung von AmF und NaF
Petzold, M.; Berthold, L.; Cismak, A.; Morawietz, K.
Conference Paper
2000The influence of surface oxide films on hardness and thermosonic wire bonding of Al bondpads
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D.
Conference Paper
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
2000Lifetime investigations of directly wafer-bonded samples under static and cyclic loading
Bagdahn, J.; Petzold, M.; Sommer, E.
Conference Paper
2000Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches
Bagdahn, J.; Petzold, M.; Seidel, H.
Conference Paper
2000A study of the microstructure of fluoride globuli formed after AmF and NaF treatment of enamel surfaces
Petzold, M.; Berthold, L.; Cismak, A.; Morawietz, K.
Journal Article
2000Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D.
Journal Article
1999Einsatz von Elektronen- und Ionenstrahltechniken für die Diagnose an glasartigen Systemen
Füting, M.; Altmann, F.; Berthold, L.; Petzold, M.
Conference Paper
1999Festkörperanalytik und Fehlerdiagnostik in der Aufbau- und Verbindungstechnik
Petzold, M.; Rudolf, F.
Journal Article
1999Miniaturisierung von Baugruppen in Produktionsanlagen
Petzold, M.; Schäfer, W.
Journal Article
1999Prüfung der Schlagfestigkeit von Emails
Petzold, M.; Maschke, H.; Rödicker, B.
Conference Paper
1999Quality and mechanical reliability assessment of wafer-bonded micromechanical components
Petzold, M.; Bagdahn, J.; Katzer, D.
Journal Article
1999Rasterkraftmikroskopische Untersuchungen
Cismak, A.; Morawietz, K.; Petzold, M.
Journal Article
1998The effect of plasma pretreatment on the Si/Si bonding behaviour
Reiche, M.; Gutjahr, K.; Stolze, D.; Burczyk, D.; Petzold, M.
Conference Paper
1998Mechanical reliability of silicon wafer-bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1998Untersuchungen zum subkritischen Rißwachstum gebondeter Siliziumwafer
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1997Characterisation of directly bonded silicon wafers by means of the double cantilever crack opening method
Bagdahn, J.; Petzold, M.; Reiche, M.; Gutjahr, K.
Conference Paper
1997Identation testing of thin films and small components
Petzold, M.; Busch, M.
Conference Paper
1997The influence of sharp notches on the strength of directly bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.
Conference Paper
1997Mechanical reliability tests for bonded wafers
Bagdahn, J.; Petzold, M.; Reiche, M.; Wiemer, M.
Conference Paper
1997Prozessabläufe straffen - Europäische Werkzeugbauunternehmen der Spritzgiessbranche verbessern ihre technischen und organisatorischen Strukturen
Kreppenhofer, D.; Petzold, M.
Journal Article
1997TEM- und REM-Untersuchungen zur Fluoridierung von menschlichen Zahnoberflächen
Berthold, L.; Morawietz, K.; Petzold, M.
Journal Article
1996Biegeprüfung an Mikrobauteilen
Petzold, M.
Journal Article
1996Einsatz der Rasterkraftmikroskopie für die Härteprüfung
Petzold, M.; Hagendorf, C.
Conference Paper
1996Kalibration kleiner Kräfte und Wege
Petzold, M.; Schenuit, E.
Conference Paper
1996A TEM and SEM study of human dental enamel treated with fluorides
Petzold, M.; Berthold, L.; Morawietz, K.
Conference Paper
1995Application of atomic force microscopy for indentation testing
Petzold, M.; Landgraf, J.; Füting, M.; Olaf, J.M.
Journal Article
1995Application of indentation testing devices for determination of elastic properties of micromechanical components
Petzold, M.; Heinzelmann, M.; Billep, D.; Mehner, J.
Conference Paper
1995Atomare Rasterkraftmikroskopie von Indenterspitzen und Härteeindrücken
Petzold, M.; Hagendorf, C.; Füting, M.; Olaf, J.M.
Conference Paper
1995Charakterisierung mehrfach gebondeter Wafer für die Sensorik
Wiemer, M.; Hiller, K.; Hopfe, S.; Petzold, M.; Reiche, M.; Geßner, T.; Gösele, U.
Conference Paper
1995Interface strength characterization of bonded wafers
Petzold, M.; Petersilge, M.; Abe, T.; Reiche, M.
Conference Paper
1995Investigations of the interface strength of bonded silicon wafers
Bagdahn, J.; Heinzelmann, M.; Petzold, M.; Reiche, M.
Conference Paper
1995On the sensitivity of optical and mechanical characteristics of the Na+-Ag+ exchange process in soda-lime silicate glass
Berg, K.-J.; Grau, P.; Nowak-Wozny, D.; Petzold, M.; Suszynska, M.
Journal Article
1995Structural investigations and indentation testing of aluminium bondpads
Katzer, D.; Petzold, M.; Koch, T.; Grellmann, W.
Conference Paper
1994FEM analysis of microbeam bending experiments using ultra-micro-indentation
Heinzelmann, M.; Petzold, M.
Journal Article
1994Korrelation von mechanischem Verhalten und Mikrostruktur in Fügeverbindungen
Katzer, D.; Petzold, M.
Conference Paper
1993Crack-formation phenomena near vickers indentation in chemically and thermally pretreated sodium-silica glasses
Berg, K.-J.; Grau, P.; Petzold, M.; Suszynska, M.
Conference Paper
1992A study of in-situ radial crack initiation at hardness indentations in strengthened soda-lime silica glass
Petzold, M.
Journal Article