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| 2012 | Serial 100 Gb/s connectivity based on polymer photonics and InP-DHBT electronics
Katopodis, V.; Kouloumentas, C.; Konczykowska, A.; Jorge, F.; Groumas, P.; Zhang, Z.Y.; Beretta, A.; Dede, A.; Dupuy, J.Y.; Nodjiadjim, V.; Cangini, G.; Buren, G. von; Miller, E.; Dinu, R.; Choi, J.H.; Pech, D.; Keil, N.; Bach, H.G.; Grote, N.; Vannucci, A.; Avramopoulos, H. | Journal Article |
| 2010 | Co-packaged 107 Gb/s photoreceiver for direct detection comprising InP-based pinTWA and DEMUX
Mekonnen, G.G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M. | Conference Paper |
| 2010 | InP HBT demultiplexing ICs for over 100 Gb/s optical transmission
Konczykowska, A.; Jorge, F.; Dupuy, J.; Riet, M.; Godin, J.; Scavennec, A.; Bach, H.; Mekonnen, G.G.; Pech, D.; Schubert, C. | Conference Paper |
| 2009 | 107 Gbit/s demultiplexing photoreceivers comprising pin- and pinTWA frontends
Bach, H.-G.; Mekonnen, G.G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M. | Conference Paper |
| 2009 | The Fraunhofer decision modeler
Pech, Daniel; John, Isabel | Conference Paper |
| 2009 | Hybrid co-packaged receiver module with pin-photodiode chip and DEMUX-IC for 107 Gb/s data rates
Mekonnen, G.G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M. | Conference Paper |
| 2009 | Multiuser product line variability management support
Hörning, Andreas
: Rombach, H. Dieter (Supervisor); Pech, Daniel (Supervisor); Silva, Adeline de Sousa (Supervisor); John, Isabel (Supervisor) | Bachelor Thesis |
| 2009 | Scalable variability instantiation strategies
John, Isabel; Pech, Daniel | Conference Paper |
| 2009 | Variability management in small development organizations - experiences and lessons learned from a case study
Pech, Daniel; Knodel, Jens; Carbon, Ralf; Schitter, Clemens; Hein, Dirk | Research Report |
| 2009 | Variability management in small development organizations - experiences and lessons learned from a case study
Pech, Daniel; Knodel, Jens; Carbon, Ralf; Schitter, Clemens; Hein, Dirk | Conference Paper |
| 2008 | Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications
Jiang, C.; Krozer, V.; Johansen, T.K.; Bach, H-G.; Mekonnen, G-G.; Zhang, R.; Pech, D. | Conference Paper |
| 2008 | InP waveguide-integrated pin-photodiode hybrid packaged with an HBT-DEMUX-chip for receiver modules of 80-100 Gb/s data rates
Mekonnen, G.G.; Hüttl, B.; Bach, H.-G.; Pech, D.; Rosin, T.; Schubert, C.; Konczykowska, A.; Jorge, F.; Riet, M. | Conference Paper |
| 2008 | Integration potential of waveguide-integrated photodiodes
Bach, H.-G.; Kunkel, R.; Mekonnen, G.G.; Pech, D.; Rosin, T.; Schmidt, D.; Gärtner, T.; Zhang, R. | Conference Paper |
| 2008 | Model-based design of product line components in the automotive domain
Yoshimura, Kentaro; Forster, Thomas; Muthig, Dirk; Pech, Daniel | Conference Paper |
| 2008 | Understanding decision models - visualization and complexity reduction of software variability
Forster, Thomas; Muthig, Dirk; Pech, Daniel | Conference Paper |
| 2007 | Experimenting with software testbeds for evaluating new technologies
Lindvall, M.; Rus, I.; Donzelli, P.; Memon, A.; Zelkowitz, M.V.; Ackermann, B.; Anders, S.; Asgari, S.; Basili, V.; Costa, P.; Fellmann, J.; Hirschbach, D.; Hochstein, L.; Shull, F.; Tvedt, R.; Pech, D. | Journal Article |
| 2007 | Variability management support for large-scale software product lines
Pech, Daniel
: Knauber, Peter (Supervisor); Muthig, Dirk (Supervisor); Forster, Thomas (Supervisor) | Master Thesis |
| 2005 | An evolutionary testbed for software technology evaluation
Lindvall, M.; Rus, I.; Shull, F.; Zelkowitz, M.; Donzelli, P.; Memon, A.; Basili, V.; Costa, P.; Tvedt, R.; Hochstein, L.; Asgari, S.; Ackermann, C.; Pech, D. | Journal Article |
| 2000 | New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Eckhardt, T.; Mekonnen, G.G.; Jacumeit, G. | Journal Article |
| 1999 | A new fiber-chip coupling concept for reusable multipurpose packaging suitable for up to 45 GHz bandwidth
Fischer, U.H.P.; Eckhardt, T.; Jacumeit, G.; Kilk, A.; Mekonnen, G.G.; Pech, D.; Ziegler, R. | Conference Paper |
| 1999 | Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Mekonnen, G.G.; Jacumeit, G. | Conference Paper |
| 1996 | In situ observation of the self-alignment during FC-bonding under vacuum with and without H2
Kuhmann, J.F.; Pech, D. | Journal Article |
| 1996 | Self-aligned, fluxless flip-chip bonding technology for photonic devices
Kuhmann, J.F.; Hensel, H.-J.; Pech, D.; Harde, P.; Bach, H.-G. | Conference Paper |