Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2009Advancements in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2008Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Lee, J.-S.; Chu, K.-M.; Patzelt, R.; Manessis, D.; Ostmann, A.; Jeon, D.Y.
Journal Article
2008Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
Lee, J.-S.; Chu, K.-M.; Jeon, D.Y.; Patzelt, R.; Manessis, D.; Ostmann, A.
Conference Paper
2006Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2006Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R.
Patent
2006Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R.
Patent
2005High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer bumping technology
Pudas, M.; Manessis, D.; Patzelt, R.; Hagberg, J.; Leppävuori, S.; Vähäkangas, J.; Ostmann, A.; Reichl, H.
Conference Paper
2005Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Stencil printing technology for 100m flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.
Journal Article
2004Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2003Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper