Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Journal Article, Conference Paper
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Conference Paper
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Conference Paper
2017Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Conference Paper
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Conference Paper
2017Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Conference Paper
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Conference Paper
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Conference Paper
2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Conference Paper
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Conference Paper
2016DSC investigation of the undercooling of SnAgCu solder alloys
Mueller, M.; Türke, A.; Panchenko, I.
Conference Paper
2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2012Effects of bonding pressure on quality of SLID interconnects
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2012Elastic anisotropy of Cu and its impact on stress management for 3D IC
Yeap, K.B.; Zschech, E.; Hangen, U.D.; Wyrobek, T.; Kong, L.W.; Karmakar, A.; Xu, X.P.; Panchenko, I.
Journal Article
2011The creep behaviour and microstructure of ultra small solder joints
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Wolter, K.-J.
Conference Paper
2011Solidification processes in the Sn-rich part of the SnCu system
Panchenko, I.; Mueller, M.; Wiese, S.; Schindler, S.; Wolter, K.-J.
Conference Paper
2010The scaling effect on microstructure and creep properties of Sn-based solders
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Roellig, M.; Wolter, K.-J.
Conference Paper