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| 2011 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2010 | Carbon nanotubes for nanoscale low temperature flip chip connections
Hermann, S.; Pahl, B.; Ecke, R.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2008 | Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, W.; Löher, T.; Pahl, B.; Feil, M.; Vandevelde, B.; Vanfleteren, J. | Journal Article |
| 2008 | Flex Technology for Foldable Medical Flip Chip Devices
Pahl, B.; Löher, T.; Burkhard, H.; Link, J.; Aschenbrenner, R. | Conference Paper |
| 2008 | Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2008 | Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Verfahren zur Kontaktierung, Zusammensetzung fuer die Chipkontaktierung sowie deren Verwendung
Bauer, J.; Kallmayer, C.; Pahl, B. | Patent |
| 2006 | Development of a nano-structure based interconnection technology
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Presentation |
| 2006 | Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2006 | Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A. | Journal Article |
| 2006 | Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Ultrathin assemblies on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Long-time reliability study of soldered flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Long time reliability of flip chip interconnections on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | A thermode bonding process for fine pitch flip chip applications down to 40 micron
Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |