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| 2011 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2011 | Embedding technology for manufacturing of high density SiP
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A. | Conference Paper |
| 2011 | Entwicklungsrichtungen für das Leistungshalbleiter Packaging
Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias | Journal Article |
| 2011 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2011 | Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Conference Paper |
| 2011 | Modular microelectronics by system-in-packages with embedded components
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D. | Conference Paper |
| 2011 | Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A. | Conference Paper |
| 2011 | Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Conference Paper |
| 2011 | System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf | Conference Paper |
| 2011 | System-in-Packages with embedded components for modular systems
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D. | Conference Paper |
| 2010 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2010 | Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U. | Conference Paper |
| 2010 | Module miniaturization by ultra thin package stacking
Löher, T.; Schütze, D.; Ostmann, A.; Aschenbrenner, R. | Conference Paper |
| 2010 | Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert | Conference Paper |
| 2010 | Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert | Conference Paper, Journal Article |
| 2010 | Stretchable electronics manufacturing and application
Löher, T.; Seckel, M.; Ostmann, A. | Conference Paper |
| 2009 | Advancements in Bumping Technologies for Flip Chip and WLCSP Packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2009 | Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages
Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H. | Conference Paper |
| 2009 | Chip embedding technology - New technological challenges for a reliable System-in-Package realization
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H. | Conference Paper |
| 2009 | Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Embedded Chip Packages Technology and Applications
Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2009 | Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H. | Conference Paper |
| 2009 | Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H. | Conference Paper |
| 2009 | Flexibel bleiben: dehnbare elektronische Systeme
Löher, T.; Seckel, M.; Ostmann, A. | Journal Article |
| 2009 | Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2009 | Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2009 | Low-temperature contacts through SixNy-antireflection coatings for inverted a-Si:H/c-Si hetero-contact solar cells
Wünsch, F.; Klein, D.; Podlasly, A.; Ostmann, A.; Schmidt, M.; Kunst, M. | Conference Paper, Journal Article |
| 2009 | Photovoltaikmodul und Verfahren zur Herstellung eines Photovoltaikmoduls
Löher, T.; Ostmann, A.; Seckel, M. | Patent |
| 2009 | Realisation of Embedded-Chip QFN Packages - Technological Challenges and Achievements
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H. | Conference Paper |
| 2009 | Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2009 | Stretchable circuit board technology in textile applications
Ostmann, A.; Vieroth, R.; Seckel, M.; Löher, T.; Reichl, H. | Conference Paper |
| 2009 | Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformflaeche mit einem solchen System, sowie elektronisches System und Freiformflaechen mit einem solchen System
Loeher, T.; Ostmann, A.; Seckel, M. | Patent |
| 2009 | Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung
Schmidt, R.; Zwanzig, M.; Fiedler, S.; Ostmann, A.; Aschenbrenner, R. | Patent |
| 2009 | Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S. | Patent |
| 2008 | Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Lee, J.-S.; Chu, K.-M.; Patzelt, R.; Manessis, D.; Ostmann, A.; Jeon, D.Y. | Journal Article |
| 2008 | Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H. | Conference Paper |
| 2008 | Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H. | Conference Paper |
| 2008 | Embedding technologies for SiP manufacturing
Manessis, D.; Ostmann, A. | Journal Article |
| 2008 | Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2008 | Industrial and technical aspects of chip embedding technology
Ostmann, A.; Manessis, D.; Stahr, J.; Beesley, M.; Cauwe, M.; Baets, J. de | Conference Paper |
| 2008 | Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2008 | Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H. | Conference Paper |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Stacking of ultra-thin film packages
Ko, C.-T.; Shih, Y.-C.; Chang, J.-Y.; Kuo, T.-Y.; Chen, Y.-H.; Ostmann, A.; Manessis, D. | Conference Paper |
| 2008 | Stretchable electronic systems for wearable and textile applications
Löher, T.; Vieroth, R.; Seckel, M.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2008 | Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M. | Conference Paper |
| 2007 | Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N. | Conference Paper |
| 2007 | Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R. | Conference Paper |
| 2007 | Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2007 | Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M. | Conference Paper |
| 2007 | Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R. | Conference Paper |
| 2007 | Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D. | Patent |
| 2007 | Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H. | Conference Paper |
| 2007 | Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H. | Presentation |
| 2006 | Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H. | Conference Paper |
| 2006 | Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2006 | Embedding of active and passive components into printed wiring boards
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H. | Presentation |
| 2006 | Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | First results of the European project hiding dies
Aschenbrenner, R.; Ostmann, A. | Presentation |
| 2006 | Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
Lee, J.-S.; Chu, K.-M.; Jeon, D.Y.; Patzelt, R.; Manessis, D.; Ostmann, A. | Conference Paper |
| 2006 | Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H. | Conference Paper |
| 2006 | Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H. | Journal Article |
| 2006 | Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A. | Journal Article |
| 2006 | Stapelbare Funktionsschicht fuer ein modulares mikroelektronisches System
Niedermayer, M.; Ostmann, A.; Morgenstern, H.; Guttowski, S. | Patent |
| 2006 | Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H. | Conference Paper |
| 2006 | Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Verfahren zum Herstellen einer Durchkontaktierung zwischen zwei Oberflaechen eines Halbleitersubstrats
Böttcher, L.; Ostmann, A.; Manessis, D. | Patent |
| 2006 | Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R. | Patent |
| 2006 | Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R. | Patent |
| 2005 | Buried components in printed circuit boards
Ostmann, A.; Neumann, A.; Sommer, P.; Reichl, H. | Journal Article |
| 2005 | Chip embedding in printed circuit board production
Ostmann, A.; Kriechbaum, A.; Baets, J. de; Kostner, H. | Conference Paper |
| 2005 | Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M. | Journal Article |
| 2005 | Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E. | Journal Article |
| 2005 | Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Jeon, Y.D.; Paik, K.W.; Ostmann, A.; Reichl, H. | Journal Article |
| 2005 | Einbettung aktiver Chips in die flexible Leiterplatte
Ostmann, A. | Conference Paper |
| 2005 | Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer bumping technology
Pudas, M.; Manessis, D.; Patzelt, R.; Hagberg, J.; Leppävuori, S.; Vähäkangas, J.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2005 | Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Integration of active and passive components using chip in polymer technology
Böttcher, L.; Neumann, A.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2005 | Lead-free flip chip: A comparison between lead-free solder and adhesives
Vandecasteele, B.; Manessis, D.; Vanfleteren, J.; Ostmann, A.; Hagedorn, H.W.; Wiese, J. | Conference Paper |
| 2005 | A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2005 | The packaging and assembly of a waferscale system on chip
Veen, C. van; Samber, M. de; Bergveld, H.; Ackerveken, A.; Slob, C.; Manessis, D.; Ostmann, A.; Whitmore, M. | Conference Paper |
| 2005 | Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M.L.; Löher, T.; Ostmann, A.; Reichl, H. | Journal Article |
| 2005 | Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Verfahren zum Bearbeiten eines Halbleitersubstrats
Landesberger, C.; Ostmann, A. | Patent |
| 2005 | Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik
Manke, I.; Becker, K.; Ostmann, A.; Reichl, H. | Patent |
| 2004 | Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Process flow and manufacturing concept for embedded active devices
Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reich, H. | Conference Paper |
| 2004 | Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Stencil printing technology for 100m flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A. | Journal Article |
| 2004 | Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils
Manke, I.; Becker, K.; Ostmann, A.; Aschenbrenner, R.; Loeher, T. | Patent |
| 2003 | 3D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J. | Conference Paper |
| 2003 | Chip in polymer: 3D integration of active circuitry in polymeric substrate
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Kontakthoecker mit profilierter Oberflaechenstruktur sowie Verfahren zur Herstellung
Oppermann, H.; Ostmann, A.; Nieland, C. | Patent |
| 2003 | Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Stackable packages with integrated components
Ostmann, A.; Neumann, A.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Verfahren zur Erzeugung von erhabenen Strukturen, insbesondere Kontakthoeckern
Oppermann, H.; Ostmann, A. | Patent |
| 2003 | Vom Wafer zum System-in-Package
Braun, T.; Becker, K.-F.; Ostmann, A. | Journal Article |
| 2003 | Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Chip in polymer - Next step in miniaturization
Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H. | Journal Article |
| 2002 | Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H. | Conference Paper |
| 2002 | Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
Aschenbrenner, R.; Azdasht, G.; Zakel, E.; Ostmann, A.; Motulla, G. | Patent |
| 2002 | Verfahren zur Verbesserung der Druckqualitaet beim Einsatz von Druckschablonen
Coskina, P.; Jung, E.; Ostmann, A. | Patent |
| 2001 | Maßgeschneiderte Systemlösungen durch Packaging
Aschenbrenner, R.; Ostmann, A.; Becker, K.-F.; Jung, E.; Kallmeyer, C. | Journal Article |
| 2001 | Ultra thin chips for miniaturized applications
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A. | Patent |
| 2000 | Concepts for ultra thin packaging technologies
Aschenbrenner, R.; Ansorge, F.; Feil, M.; Landesberger, C.; Jung, E.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2000 | Immersion soldering - a new way for ultra fine pitch bumping
Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solders
Anhöck, S.; Ostmann, A.; Nieland, C.; Auerswald, E.; Reichl, H. | Conference Paper |
| 2000 | Low cost bumping by stencil printing
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2000 | A new approach for system integrated packaging
Aschenbrenner, R.; Jung, E.; Ostmann, A.; Landesberger, C.; Reichl, H. | Conference Paper |
| 2000 | Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications
Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Reliability of soldered nickel bumps for high temperature application
Anhöck, S.; Auerswald, E.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H. | Conference Paper |
| 1999 | Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
Zakel, E.; Ansorge, F.; Kasulke, P.; Ostmann, A.; Aschenbrenner, R.; Dietrich, L. | Patent |
| 1998 | Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A. | Conference Paper |
| 1998 | Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H. | Conference Paper |
| 1997 | Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Herstellung galvanisch abgeformter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P. | Patent |
| 1997 | Herstellung galvanisch/stromlos gestalteter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P. | Patent |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Low cost flip chip technologies on chemical nickel bumping and solder printing
Kloeser, J.; Gwiasda, J.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bechtold, F. | Journal Article |
| 1996 | Chiptraeger-Anordnung sowie Chiptraeger zur Herstellung einer Chip-Gehaeusung
Zakel, E.; Lin, D.; Gwiasda, J.; Ostmann, A. | Patent |
| 1996 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1995 | Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H. | Journal Article |
| 1995 | Flip chip soldering on printed wining boards using vapor phase reflow
Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Klebtechnologien für die Flip Chip Montage
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Reichl, H. | Conference Paper |
| 1994 | Cost effective flip chip interconnections on FR-4-boards
Klöser, J.; Zakel, E.; Ostmann, A.; Eldring, J.; Reichl, H. | Conference Paper |
| 1994 | Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H. | Conference Paper |
| 1994 | Flip-Chip-Kontaktierungen auf organischen Substrat-Materialien
Klöser, J.; Zakel, E.; Gwiasda, J.; Ostmann, A.; Reichl, H. | Conference Paper |