Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Conference Paper
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Presentation
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Conference Paper
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Conference Paper
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Journal Article, Conference Paper
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2016Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter
Journal Article
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Conference Paper
2016Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.
Conference Paper
2015Development of a microcamera with embedded image processor using panel level packaging
Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D.
Conference Paper
2015Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.
Conference Paper
2015Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2015Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Journal Article
2014A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2014A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance
Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A.
Conference Paper
2014Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Embedding of power semiconductors for innovative packages and modules
Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Conference Paper
2014Next generation high power electronic module based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Conference Paper
2014Packaging very fast switching semiconductors
Hoene, E.; Ostmann, A.; Marczok, C.
Conference Paper
2014Power electronics packages with embedded components - recent trends and developments
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Journal Article
2014Stretchable and deformable electronic systems in thermoplastic matrix materials
Löher, T.; Ostmann, A.; Seckel, M.
Conference Paper
2014Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Ostmann, A.
: Lang, K.-D.; Vanfleteren, J.; Nowottnick, M.
Dissertation
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2013Modular microsystems with embedded components
Böhme, Christian; Ostmann, A.; Schneider-Ramelow, M.
Conference Paper
2013Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas
Conference Paper
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Conference Paper
2013Power modules with embedded chips for automotive applications
Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.
Conference Paper
2013Power modules with embedded components
Ostmann, A.; Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Lang, K.-D.
Conference Paper
2013Ultra-low-inductance power module for fast switching semiconductors
Hoene, E.; Ostmann, A.; Lai, B.T.; Marczok, C.; Müsing, A.; Kolar, J.W.
Conference Paper
2012Development of embedded power electronics modules
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2012Embedded power electronics for automotive applications
Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.
Conference Paper
2012Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.
Conference Paper
2012Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2011Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2011Embedding technology for manufacturing of high density SiP
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Conference Paper
2011Entwicklungsrichtungen für das Leistungshalbleiter Packaging
Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias
Journal Article
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Modular microelectronics by system-in-packages with embedded components
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
Conference Paper
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Conference Paper
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2011Realization of power modules by chip embedding technology
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Conference Paper
2011System-in-Packages with embedded components for modular systems
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
Conference Paper
2010Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Conference Paper
2010Module miniaturization by ultra thin package stacking
Löher, T.; Schütze, D.; Ostmann, A.; Aschenbrenner, R.
Conference Paper
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper, Journal Article
2010Stretchable electronics manufacturing and application
Löher, T.; Seckel, M.; Ostmann, A.
Conference Paper
2009Advancements in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2009Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages
Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Chip embedding technology - New technological challenges for a reliable System-in-Package realization
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Embedded Chip Packages Technology and Applications
Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2009Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Flexibel bleiben: dehnbare elektronische Systeme
Löher, T.; Seckel, M.; Ostmann, A.
Journal Article
2009Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H.
Conference Paper
2009Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2009Low-temperature contacts through SixNy-antireflection coatings for inverted a-Si:H/c-Si hetero-contact solar cells
Wünsch, F.; Klein, D.; Podlasly, A.; Ostmann, A.; Schmidt, M.; Kunst, M.
Conference Paper, Journal Article
2009Photovoltaikmodul und Verfahren zur Herstellung eines Photovoltaikmoduls
Löher, T.; Ostmann, A.; Seckel, M.
Patent
2009Realisation of embedded-chip QFN packages - technological challenges and achievements
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology in textile applications
Ostmann, A.; Vieroth, R.; Seckel, M.; Löher, T.; Reichl, H.
Conference Paper
2009Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformflaeche mit einem solchen System, sowie elektronisches System und Freiformflaechen mit einem solchen System
Loeher, T.; Ostmann, A.; Seckel, M.
Patent
2009Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung
Schmidt, R.; Zwanzig, M.; Fiedler, S.; Ostmann, A.; Aschenbrenner, R.
Patent
2009Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.
Patent
2008Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Lee, J.-S.; Chu, K.-M.; Patzelt, R.; Manessis, D.; Ostmann, A.; Jeon, D.Y.
Journal Article
2008Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding technologies for SiP manufacturing
Manessis, D.; Ostmann, A.
Journal Article
2008Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H.
Conference Paper
2008Industrial and technical aspects of chip embedding technology
Ostmann, A.; Manessis, D.; Stahr, J.; Beesley, M.; Cauwe, M.; Baets, J. de
Conference Paper
2008Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H.
Conference Paper
2008Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H.
Conference Paper
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Realization of system-in-package modules by embedding of chips
Boettcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2008Stacking of ultra-thin film packages
Ko, C.-T.; Shih, Y.-C.; Chang, J.-Y.; Kuo, T.-Y.; Chen, Y.-H.; Ostmann, A.; Manessis, D.
Conference Paper
2008Stretchable electronic systems for wearable and textile applications
Löher, T.; Vieroth, R.; Seckel, M.; Ostmann, A.; Reichl, H.
Conference Paper
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2007Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N.
Conference Paper
2007Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R.
Conference Paper
2007Cost modelling for embedded component technology
Baets, J. de; Willems, G.; Ostmann, A.; Kriechbaum, A.; Kostner, H.
Conference Paper
2007Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H.
Conference Paper
2007Lamination process studies for realisation of chip embedding technologies-current applications and technical challenges
Manessis, D.; Ostmann, A.; Yen, S.-F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R.
Conference Paper
2007Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D.
Patent
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Conference Paper
2007Realization of large area stretchable electronic systems using lamination processes
Loeher, T.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2007Reliability aspects of embedded chips
Ostmann, A.; Manessis, D.; Cauwe, M.; Sommer, J.-P.
Conference Paper
2007Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2006Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H.
Presentation
2006A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Conference Paper
2006Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2006Embedding of active and passive components into printed wiring boards
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H.
Presentation
2006Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H.
Conference Paper
2006First results of the European project hiding dies
Aschenbrenner, R.; Ostmann, A.
Presentation
2006Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
Lee, J.-S.; Chu, K.-M.; Jeon, D.Y.; Patzelt, R.; Manessis, D.; Ostmann, A.
Conference Paper
2006Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.
Conference Paper
2006Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2006Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A.
Journal Article
2006Stapelbare Funktionsschicht fuer ein modulares mikroelektronisches System
Niedermayer, M.; Ostmann, A.; Morgenstern, H.; Guttowski, S.
Patent
2006Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H.
Conference Paper
2006Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H.
Conference Paper
2006Verfahren zum Herstellen einer Durchkontaktierung zwischen zwei Oberflaechen eines Halbleitersubstrats
Böttcher, L.; Ostmann, A.; Manessis, D.
Patent
2006Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R.
Patent
2006Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R.
Patent
2005Buried components in printed circuit boards
Ostmann, A.; Neumann, A.; Sommer, P.; Reichl, H.
Journal Article
2005Chip embedding in printed circuit board production
Ostmann, A.; Kriechbaum, A.; Baets, J. de; Kostner, H.
Conference Paper
2005Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.
Journal Article
2005Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E.
Journal Article
2005Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Jeon, Y.D.; Paik, K.W.; Ostmann, A.; Reichl, H.
Journal Article
2005Einbettung aktiver Chips in die flexible Leiterplatte
Ostmann, A.
Conference Paper
2005Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer bumping technology
Pudas, M.; Manessis, D.; Patzelt, R.; Hagberg, J.; Leppävuori, S.; Vähäkangas, J.; Ostmann, A.; Reichl, H.
Conference Paper
2005Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Integration of active and passive components using chip in polymer technology
Böttcher, L.; Neumann, A.; Ostmann, A.; Reichl, H.
Conference Paper
2005Lead-free flip chip: A comparison between lead-free solder and adhesives
Vandecasteele, B.; Manessis, D.; Vanfleteren, J.; Ostmann, A.; Hagedorn, H.W.; Wiese, J.
Conference Paper
2005A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2005The packaging and assembly of a waferscale system on chip
Veen, C. van; Samber, M. de; Bergveld, H.; Ackerveken, A.; Slob, C.; Manessis, D.; Ostmann, A.; Whitmore, M.
Conference Paper
2005Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M.L.; Löher, T.; Ostmann, A.; Reichl, H.
Journal Article
2005Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Verfahren zum Bearbeiten eines Halbleitersubstrats
Landesberger, C.; Ostmann, A.
Patent
2005Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik
Manke, I.; Becker, K.; Ostmann, A.; Reichl, H.
Patent
2004Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Process flow and manufacturing concept for embedded active devices
Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reich, H.
Conference Paper
2004Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Stencil printing technology for 100m flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.
Journal Article
2004Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils
Manke, I.; Becker, K.; Ostmann, A.; Aschenbrenner, R.; Loeher, T.
Patent
20033D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.
Conference Paper
2003Chip in polymer: 3D integration of active circuitry in polymeric substrate
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Kontakthoecker mit profilierter Oberflaechenstruktur sowie Verfahren zur Herstellung
Oppermann, H.; Ostmann, A.; Nieland, C.
Patent
2003Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Stackable packages with integrated components
Ostmann, A.; Neumann, A.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2003Verfahren zur Erzeugung von erhabenen Strukturen, insbesondere Kontakthoeckern
Oppermann, H.; Ostmann, A.
Patent
2003Vom Wafer zum System-in-Package
Braun, T.; Becker, K.-F.; Ostmann, A.
Journal Article
2003Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Chip in polymer - Next step in miniaturization
Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H.
Journal Article
2002Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H.
Conference Paper
2002Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
Aschenbrenner, R.; Azdasht, G.; Zakel, E.; Ostmann, A.; Motulla, G.
Patent
2002Verfahren zur Verbesserung der Druckqualitaet beim Einsatz von Druckschablonen
Coskina, P.; Jung, E.; Ostmann, A.
Patent
2001Maßgeschneiderte Systemlösungen durch Packaging
Aschenbrenner, R.; Ostmann, A.; Becker, K.-F.; Jung, E.; Kallmeyer, C.
Journal Article
2001Ultra thin chips for miniaturized applications
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A.
Patent
2000Concepts for ultra thin packaging technologies
Aschenbrenner, R.; Ansorge, F.; Feil, M.; Landesberger, C.; Jung, E.; Ostmann, A.; Reichl, H.
Conference Paper
2000Immersion soldering - a new way for ultra fine pitch bumping
Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solders
Anhöck, S.; Ostmann, A.; Nieland, C.; Auerswald, E.; Reichl, H.
Conference Paper
2000Low cost bumping by stencil printing
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000A new approach for system integrated packaging
Aschenbrenner, R.; Jung, E.; Ostmann, A.; Landesberger, C.; Reichl, H.
Conference Paper
2000Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications
Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Reliability of soldered nickel bumps for high temperature application
Anhöck, S.; Auerswald, E.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Conference Paper
1999Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
Zakel, E.; Ansorge, F.; Kasulke, P.; Ostmann, A.; Aschenbrenner, R.; Dietrich, L.
Patent
1998Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1997Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1997Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Journal Article
1997Herstellung galvanisch abgeformter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P.
Patent
1997Herstellung galvanisch/stromlos gestalteter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P.
Patent
1997The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H.
Journal Article
1997Low cost flip chip technologies on chemical nickel bumping and solder printing
Kloeser, J.; Gwiasda, J.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bechtold, F.
Journal Article
1996Chiptraeger-Anordnung sowie Chiptraeger zur Herstellung einer Chip-Gehaeusung
Zakel, E.; Lin, D.; Gwiasda, J.; Ostmann, A.
Patent
1996Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Conference Paper
1996The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A.
Conference Paper
1995Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H.
Journal Article
1995Flip chip soldering on printed wining boards using vapor phase reflow
Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J.
Conference Paper
1995Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J.
Conference Paper
1995Klebtechnologien für die Flip Chip Montage
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1994Cost effective flip chip interconnections on FR-4-boards
Klöser, J.; Zakel, E.; Ostmann, A.; Eldring, J.; Reichl, H.
Conference Paper
1994Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H.
Conference Paper
1994Flip-Chip-Kontaktierungen auf organischen Substrat-Materialien
Klöser, J.; Zakel, E.; Gwiasda, J.; Ostmann, A.; Reichl, H.
Conference Paper