Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Highly Integrated Traction Inverter for a Modular Drive Concept
Schümann, U.; Schnack, J.; Eisele, R.; Hilper, D.; Mertens, C.; Heumann, P.; Schliwinski, H.-J.; Päsler, M.; Hinz, J.; Kamprath, M.; Zastrow, A.; Beer, H.; Osterwald, F.; Ebel, T.; Brückner, S.; Wolff, H.; Reese, H.; Schikowski, S.
Conference Paper
2015Bottom up research and development for a low-voltage three level NPC converter
Benkendorff, B.; Fuchs, F.W.; Friedrich, D.; Hinz, J.; Poech, M.; Kohlmann, K.; Reese, H.; Letas, H.-H.; Weber, C.; Eisele, R.; Mueller, Z.; Berger, M.; Rudzki, J.; Osterwald, F.; Mono, T.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015New IGBT power module concept for wind power application in NPC topology with extended reliability
Lenz, K.; Rudzki, J.; Osterwald, F.; Pandey, U.; Poech, M.
Conference Paper
2014Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers
Rudzki, J.; Osterwald, F.; Becker, M.; Eisele, R.; Poech, M.H.
Conference Paper
2012Competence center for power electronics, development of an advanced, modular frequency converter for traction control
Dudde, R.; Friedrich, D.; Kohlmann, K.; Taube, S.; Eggert, N.; Solmecke, H.; Zitzelsberger, J.; Osterwald, F.; Isernhagen, R.; Fuchs, F.W.; Eisele, R.; Weber, C.; Berger, M.
Conference Paper
2012Quality evaluation for silver sintering layers in power electronic modules
Rudzki, J.; Jensen, L.; Poech, M.; Schmidt, L.; Osterwald, F.
Conference Paper
1998Bondability check using enhanced evolutionary strategy (EES)
Bremer, J.; Herrmann, J.; Osterwald, F.; Lang, K.-D.
Conference Paper
1998How to influence bondability of different metallization systems using methods of mechanical pre-treatment
Osterwald, F.; Schmidt, R.; Lang, K.-D.; Schilde, B.; Reichl, H.
Conference Paper
1997Rißentstehung und -entwicklung in Dickdrahtbonds auf IGBT-Chips bei aktiven elektrischen Lastwechseln
Osterwald, F.; Lang, K.-D.; Bierwirth, R.; Zietz, H.-J.; Reichl, H.; Farokhzad, B.
Conference Paper
1996Aktive Qualitätssicherung in der Drahtbondtechnik
Osterwald, F.; Lang, K.-D.; Stäcker, K.-O.
Book Article