Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Conference Paper
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Conference Paper
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D.
Conference Paper
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
20164.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Journal Article
2016µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.
Report
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Conference Paper
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Conference Paper
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Anordnung aus einem Substrat mit mindestens einem optischen Wellenleiter und einer optischen Koppelstelle und aus einem optoelektronischen Bauelement und Verfahren zur Herstellung einer solchen Anordnung
Oppermann, Hermann
Patent
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.
Conference Paper
2015Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.
Book Article
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Journal Article, Conference Paper
2014High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Journal Article
2014A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014Microstructural and mechanical analyses of Ag sintered joints
Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Lang, Klaus-Dieter
Conference Paper
2014Nanoporous gold bumps for thermocompression bonding
Oppermann, Hermann; Dietrich, Lothar; Weber, Constanze; Ziedorn, Morten; Aschenbrenenr, Rolf
Abstract
2014Optisches Kopplungssystem mit einem optischen Koppler und einem lichtdurchlässigen äußeren Medium sowie Herstellung und Verwendung eines solchen Systems
Oppermann, Hermann
Patent
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Conference Paper
2014Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.
Conference Paper
2014Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Journal Article
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
2013Corrosion fatigue of welded aluminium vehicle structures under constant and variable amplitude loadings
Sonsino, Cetin Morris; Morgenstern, Christioph; Streicher, M.; Oppermann, H.; Schmid, A.M.
Journal Article
2013Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S.
Conference Paper
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2013The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Conference Paper
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2013Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Conference Paper
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Conference Paper
2012Assembly and interconnect formation in MEMS/MOEMS application
Oppermann, H.
Conference Paper
2012Au/Sn Solder
Oppermann, H.; Hutter, M.
Book Article
2012Die bonding in embedded substrates
Oppermann, H.; Rothermund, M.; Jurgensen, N.; Yen, U.; Essig, K.
Conference Paper
2012Challenges in LED packaging and green lighting
Jordan, R.; Hutter, M.; Oppermann, H.
Conference Paper
2012Corrosion fatigue of welded aluminium vehicle structures under constant and variable amplitude loadings
Sonsino, C.M.; Morgenstern, C.; Streicher, M.; Oppermann, H.; Schmid, A.M.
Journal Article
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article, Conference Paper
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Conference Paper
2012Nanoporous gold bumps for low temperature bonding
Oppermann, H.; Dietrich, L.
Journal Article
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.
Journal Article
2012Technologies and Trends to Improve Power Electronic Packaging
Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter
Conference Paper
2012Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Conference Paper
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Conference Paper
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Conference Paper
2011Fortschritte beim Aufbau von Leistungshalbleitern
Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann
Journal Article
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.
Conference Paper
2011Lässt sich bei einer Lebensdauerabschätzung die Kollektivvölligkeit berücksichtigen?
Sonsino, C.M.; Oppermann, H.
Journal Article
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2011Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
Oppermann, H.; Hutter, M.; Ehrhardt, C.
Patent
2011Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2011Verfahren zur Herstellung von mechanischen Anschlägen zur Selbstjustage und Vorrichtung mit Anschlägen zur Selbstjustage
Oppermann, Hermann; Jordan, Rafael; Glaw, Veronika; Mukhopadhyay, Biswajit
Patent
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Bedeutung und Auswirkung einer standardisierten Methode zur experimentellen Ermittlung von zyklischen Werkstoffkennwerten für Feinbleche
Wagener, R.; Bork, C.-P.; Borsutzki, M.; Masendorf, R.; Menne, M.; Geisler, S.; Schenk, J.; Thaller, K.; Oppermann, H.
Conference Paper
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
2010Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B.
Conference Paper
2010Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect
Klein, A.; Gerritzen, A.; Schröder, H.; Oppermann, H.; Capello, D.; Pallaro, N.
Conference Paper
2010Nano-porous gold interconnect
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.; Reichl, H.
Conference Paper
2010Nanoporous interconnects
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.
Conference Paper
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2010Selbstmontage von Bauelementen
Oppermann, H.-H.
Patent
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009AuSn solder in photonics assembly
Oppermann, H.
Conference Paper
2009Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.
Patent
2009Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F.
Journal Article
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article, Conference Paper
2009Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H.
Conference Paper
2009Stability of AuSn eutectic solder cap on Au socket during reflow
Yu, D.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2009VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components
Pruijmboom, A.; Booij, S.; Schemmann, M.; Werner, K.; Hoeven, P.; Limpt, H. van; Intemann, S.; Jordan, R.; Fritzsch, T.; Oppermann, H.; Barge, M.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008Effizienter Wellenlaengenkonverter und Leuchtvorrichtung mit einem effizienten Wellenlaengenkonverter
Jordan, R.; Oppermann, H.
Patent
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Conference Paper
2008Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2008Lead free solder joints: reliability and metallurgical reactions
Hutter, M.; Schmidt, R.; Pape, U.; Oppermann, H.; Reichl, H.
Conference Paper
2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.
Patent
2007Converter film technology for homogeneous white light
Jordan, R.C.; Bauer, J.; Oppermann, H.
Conference Paper
2007Lotmetallisierung
Hutter, M.; Oppermann, H.; Rafael, J.; Thomas, T.
Patent
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.
Journal Article
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.
Conference Paper
2007Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
Oppermann, H.; Wolf, J.; Jordan, R.; Schmidt, R.; Engelmann, G.
Patent
2007Verfahren zum Herstellen einer nanoporoesen Schicht
Oppermann, H.; Dietrich, L.; Engelmann, G.; Wolf, J.
Patent
2007Verfahren zum Verbinden einer Edelmetalloberflaeche mit einem Polymer
Oppermann, H.
Patent
2007Verfahren zum Verbinden zweier Fuegeflaechen
Oppermann, H.
Patent
2007Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
Oppermann, H.
Patent
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Biocompatible hybrid system integration of silicon based neural interface devices
Tathireddy, P.; Chakravarthy, S.; Hsu, J.; Klein, M.; Oppermann, H.; Rieth, L.; Harrison, R.; Normann, R.A.; Solzbacher, F.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006Goldhaltiges Lotdepot, Verfahren zu dessen Herstellung, Lötverfahren und Verwendung
Oppermann, H.
Patent
2006Multiple flip-chip assembly for hybrid compact optoelectroi modules using electroplated AuSn solder Bumps
Chu, K.-M.; Lee, J.-S.; Oppermann, H.; Engelmamr, G.; Wolf, J.; Reichl, H.; Jeon, D.Y.
Conference Paper
2006Optimized heat transfer and homogeneous color converting for ultra high brightness LED package
Jordan, R.; Bauer, J.; Oppermann, H.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.
Conference Paper
2005Au/Sn-Flip-Chip-Bonding für 77 GHz-Radar-Frontend-Anwendungen
Klein, M.; Hutter, M.; Oppermann, H.
Journal Article
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Gold-gold flip chip bonding processes for RF, optoelectronic, high temperature and power devices
Klein, M.; Oppermann, H.; Reichl, H.
Conference Paper
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005Leichtbau mit Aluminium-Schweißverbindungen des Fahrzeugbaus
Morgenstern, C.; Streicher, M.; Oppermann, H.
Journal Article
2005Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005The role of Au/Sn solder in packaging
Oppermann, H.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2004Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
Hutter, M.; Hohnke, F.; Oppermann, H.; Klein, M.; Engelmann, G.
Conference Paper
2004Flip chip assembly and reliability using gold/tin solder bumps
Oppermann, H.; Hutter, M.; Klein, M.; Reichl, H.
Conference Paper
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper
2004High precision passive alignment flip chip assembly using self alignment and micromechanical stops
Hutter, M.; Oppermann, H.; Engelmann, G.; Reichl, H.
Conference Paper
2004Investigation of Cu stud bumping for single chip flip-chip assembly
Klein, M.; Busse, E.; Kaschlun, K.; Oppermann, H.
Conference Paper
2004Investigation of solder bumps, flip chip assembly, reliability and passive alignment using Au/Sn
Hutter, M.; Klein, M.; Engelmann, G.; Oppermann, H.
Book Article
2004Leichtbau mit Aluminium-Schweißverbindungen des Fahrzeugbaus unter korrosiven Umgebungsbedingungen und variablen Belastungsamplituden
Morgenstern, C.; Streicher, M.; Oppermann, H.
Conference Paper
2004On the pseudobinary systems Bi2Ch3/BiX3 and the ternary phases in these systems (Ch = S, Se, Te; X = Cl, Br, I). II: Bismutselenidhalides Bi2Se3/BiX3 and Bismuttelluridhalides Bi2Te3/BiX3
Oppermann, H.; Schmidt, P.; Petasch, U.; Keller, E.; Krämer, V.
Journal Article
2004Verfahren zum Erzeugen einer Lotverbindung durch kapillaren Lotfluss
Oppermann, H.; Hutter, M.
Patent
2003Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Reichl, H.; Aschenbrenner, R.; Ansorge, F.; Becker, K.; Ehrlich, R.; Oppermann, H.; Azdasht, G.
Patent
2003Kontakthoecker mit profilierter Oberflaechenstruktur sowie Verfahren zur Herstellung
Oppermann, H.; Ostmann, A.; Nieland, C.
Patent
2003Substratstapel
Oppermann, H.
Patent
2003Verfahren zur Erzeugung von erhabenen Strukturen, insbesondere Kontakthoeckern
Oppermann, H.; Ostmann, A.
Patent
2003Zu den pseudobinären Zustandssystemen Bi2Ch2-BiX3 und den ternären Phasen auf diesen Schnitten (Ch = S, Se, Te; X = Cl, Br, I), I: Bismutsulfidhalogenide
Oppermann, H.; Petasch, U.
Journal Article
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
Oppermann, H.H.; Zakel, E.; Azdasht, G.; Kasulke, P.
Patent
2002Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering
Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E.
Journal Article, Conference Paper
2002Modular systems for sensor integration
Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Elger, G.; Oppermann, H.H.
Conference Paper
2001Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Elger, G.; Voigt, J.; Oppermann, H.
Conference Paper
2001Verfahren zur Erzeugung von Lothuegeln auf einem Substrat
Oppermann, H.H.
Patent
2000Advanced flip chip technologies in RF, microwave and MEMS applications
Oppermann, H.H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Avanzadas Tecnologias "Flip Chip"
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Spectroscopic measurement of mounting-induced strain in optoelectronic devices
Bärwolff, A.; Tomm, J.W.; Müller, R.; Weiss, S.; Hutter, M.; Oppermann, H.; Reichl, H.
Journal Article
1999Advanced flip chip technologies
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Gehaeuse zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung
Azdasht, G.; Leutenbauer, R.; Oppermann, H.
Patent
1999Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Oppermann, H.; Azdasht, G.
Patent
1999Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Single chip bumping and reliability for flip chip processes
Klein, M.; Oppermann, H.; Kalicki, R.; Aschenbrenner, R.; Reichl, H.
Journal Article
1998Bemessung eines Nutzfahrzeugachsenschenkels mit Hilfe der FKM-Richtlinie. Vergleich, Berechnung, Experiment
Oppermann, H.; Sonsino, C.M.
Conference Paper
1998Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Verfahren zur Ausbildung einer raeumlichen Chipanordnung und raeumliche Chipanordung
Oppermann, H.H.; Azdasht, G.; Kasulke, P.; Zakel, E.
Patent
1998Verfahren zur Verbindung eines Bauelements mit einem Substrat und eine damit hergestellte elektrische Schaltung
Oppermann, H.; Azdasht, G.
Patent
1997Betriebsfestigkeitsuntersuchung an Karosserieteilsystemen
Sigwart, A.; Müller, J.; Oppermann, H.
Conference Paper
1997Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Traegersubstrat zur Kontaktierung von Chips
Aschenbrenner, R.; Zakel, E.; Oppermann, H.H.; Azdasht, G.
Patent
1997New trends in semiconductor packaging
Oppermann, H.; Zakel, E.; Reichl, H.
Conference Paper
1997Schädigungsproportionale Beschreibung von Lastfolgen mit veränderlichen Mittellasten. Das Trennverfahren
Oppermann, H.
Book
1997Tutorial chip size package
Oppermann, H.H.; Azdasht, G.; Zakel, E.; Reichl, H.
Conference Paper
1997Verfahren zum Herstellen eines Kontakthoeckers durch Umschmelzen einer Kontaktflaechenmetallisierung
Gwiasda, J.; Zakel, E.; Oppermann, H.H.; Kloeser, A.; Weiss, S.
Patent
1996Verfahren zur Substratfixierung von elektronischen Bauelementen
Oppermann, H.H.; Zakel, E.; Kallmayer, C.; Kloeser, A.
Patent
1995Entwicklung eines wissensbasierten Informationssystems zur rechnerischen Lebensdauervorhersage
Oppermann, H.
Journal Article
1995Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper
1995Oberflächennachbehandlung
Oppermann, H.
Journal Article
1995Verbesserung der Genauigkeit der rechnerischen Lebensdauervorhersage metallischer Bauteile durch Berücksichtigung der Belastungsreihenfolge
Oppermann, H.
Book Article
1994Damage structures due to thermal fatigue - development of a stochastic simulation model
Winkler, T.; Kullig, E.; Oppermann, H.; Foit, A.; Michel, B.
Conference Paper
1994Investigation of self-alignment during the flip-chip assembly using eutectic gold-tin metallurgy
Oppermann, H.H.; Zakel, E.; Engelmann, G.; Reichl, H.
Conference Paper
1993FALIXS - Ein Expertensystem zur rechnerischen Lebensdauervorhersage von Fahrzeugbauteilen
Oppermann, H.; Bender, H.-J.; Bubenhagen, H.; Johna-Lin, E.
Conference Paper
1993Kritik und Verbesserung von Lebensdauervorhersagemethoden
Schütz, D.; Oppermann, H.
Conference Paper
1993Zur Steigerung der Betriebsfestigkeit zufallsartig wechselbiegebelasteter Kerbstäbe aus Stahl durch Oberflächennachbehandlung.
Oppermann, H.
Book
1991Effect of loading sequence on the fatigue life of notched specimens made from steel and aluminium alloys
Buxbaum, O.; Klätschke, H.; Oppermann, H.
Journal Article
1989Zum Einfluß der Belastungsreihenfolge auf die Lebensdauer von Kerbstäben aus Stahl und Aluminium
Buxbaum, O.; Klätschke, H.; Oppermann, H.
Report
1989Zur Problematik der rechnerischen Lebensdauerabschätzung gekerbter Bauteile
Oppermann, H.
Conference Paper
1987Simulation von Betriebsbeanspruchungen für den Lebensdauernachweis von Leichtbaublattfedern
Oppermann, H.; Schütz, D.
Journal Article
1985Einfluss der Vergiessungsart auf das Schwingfestigkeitsverhalten unter Torsionsbeanspruchung
Bleidt, M.; Braeker, K.-F.; Gulden, H.; Oppermann, H.; Spitzer, H.
Journal Article
1983Vergleich der Lebensdauervorhersage nach dem Kerbgrundkonzept und dem Nennspannungskonzept
Buxbaum, O.; Oppermann, H.; Koebler, H.-G.; Schütz, D.; Boller, C.; Heuler, P.; Seeger, T.
Book