Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Approaches to calculate the dielectric function of ZnO around the band gap
Agocs, E.; Fodor, B.; Pollakowski, B.; Beckhoff, B.; Nutsch, A.; Jank, M.; Petrik, P.
Journal Article, Conference Paper
2013Characterization of ZnO structures by optical and X-ray methods
Petrik, P.; Pollakowski, B.; Zakel, S.; Gumprecht, T.; Beckhoff, B.; Lemberger, M.; Labadi, Z.; Baji, Z.; Jank, M.; Nutsch, A.
Journal Article, Conference Paper
2013Comparative measurements on atomic layer deposited Al2O3 thin films using ex situ table top and mapping ellipsometry, as well as X-ray and VUV reflectometry
Petrik, P.; Gumprecht, T.; Nutsch, A.; Roeder, G.; Lemberger, M.; Juhasz, G.; Polgar, O.; Major, C.; Kozma, P.; Janosov, M.; Fodor, B.; Agocs, E.; Fried, M.
Journal Article, Conference Paper
2013Complementary methodologies for thin film characterization in one tool - A novel instrument for 450 mm wafers
Holfelder, I.; Beckhoff, B.; Fliegauf, R.; Honicke, P.; Nutsch, A.; Petrik, P.; Roeder, G.; Weser, J.
Journal Article
2012Influence of the excitation energy on absorption effects in Total Reflection X-ray Fluorescence analysis
Horntrich, C.; Kregsamer, P.; Smolek, S.; Maderitsch, A.; Wobrauschek, P.; Simon, R.; Nutsch, A.; Knoerr, M.; Streli, C.
Journal Article
2012Probenpositioniereinrichtung und Verfahren zu ihrem Betrieb
Nutsch, Andreas; Holfelder, I.; Fliegauf, Rolf; Weser, J.; Beckhoff, B.
Patent
2012Reference samples for ultra trace analysis of organic compounds on substrate surfaces
Nutsch, A.; Beckhoff, B.; Borionetti, G.; Codegoni, D.; Grasso, S.; Hoenicke, P.; Leibold, A.; Müller, M.; Otto, M.; Pfitzner, L.; Polignano, M.-L.
Conference Paper
2012Reliable quantification of inorganic contamination by TXRF
Müller, M.; Nutsch, A.; Altmann, R.; Borionetti, G.; Holz, T.; Mantler, C.; Hönicke, P.; Kolbe, M.; Beckhoff, B.
Conference Paper
2011Analysis of contaminated oxide-silicon interfaces
Polignano, M.L.; Codegoni, D.; Castellano, L.; Greco, S.; Borionetti, G.; Bonoli, F.; Nutsch, A.; Altmann, R.; Leibold, A.; Otto, M.; Monge, P.; Riva, C.
Conference Paper
2011Atomic layer deposited Al2O3 as characterized reference samples for nanolayer metrology
Nutsch, A.; Lemberger, M.; Petrik, P.
Conference Paper
2011Electrical and structural properties of ultrathin SiON films on Si prepared by plasma nitridation
Hourdakis, E.; Nassiopoulou, A.G.; Parisini, A.; Reading, M.A.; Berg, J.A. van den; Sygellou, L.; Ladas, S.; Petrik, P.; Nutsch, A.; Wolf, M.; Roeder, G.
Journal Article
2011Expanded beam (macro-imaging) ellipsometry
Fried, M.; Juhasz, G.; Major, C.; Petrik, P.; Polgar, O.; Horvath, Z.; Nutsch, A.
Conference Paper, Journal Article
2011The impact of organic contamination on the oxide-silicon interface
Codegoni, D.; Polignano, M.L.; Castellano, L.; Borionetti, G.; Bonoli, F.; Nutsch, A.; Leibold, A.; Otto, M.
Conference Paper
2011An X-ray photoelectron spectroscopy study of ultra-thin oxynitride films
Ladas, S.; Sygellou, L.; Kennou, S.; Wolf, M.; Roeder, G.; Nutsch, A.; Rambach, M.; Lerch, W.
Journal Article
2010Highly sensitive wavefront sensor for visual inspection of bare and patterned silicon wafers
Lazareva, I.; Nutsch, A.; Schellenberger, M.; Pfitzner, L.; Frey, L.
Conference Paper
2010Optical inspection of flat reflective surfaces by a wave front sensor
Lazareva, I.; Nutsch, A.; Pfitzner, L.; Frey, L.
Conference Paper
2010Verfahren zur Bestimmung der Topografie einer Oberfläche eines Objekts
Lazareva, I.; Nutsch, A.
Patent
2010Yield model for estimation of yield impact of semiconductor manufacturing equipment
Nutsch, A.; Oechsner, R.; Schoepka, U.; Pfitzner, L.
Conference Paper
2009Characterization of Organic Contamination during Semiconductor Manufacturing Processing Employing Near Edge X-Ray Absorption Fine Structure Spectroscopy
Mueller, M.; Beckhoff, B.; Bedana, P.; Borionetti, G.; Corradi, A.; Frey, L.; Guerinoni, G.; Leibold, A.; Otto, M.; Nutsch, A.; Müller, M.; Beckhoff, B.; Bedana, P.; Borionetti, G.; Corradi, A.; Frey, L.; Guerinoni, G.; Leibold, A.; Otto, M.; Nutsch, A.
Abstract
2009Characterization of organic contamination in semiconductor manufacturing processes
Nutsch, A.; Beckhoff, B.; Bedana, G.; Borionetti, G.; Codegoni, D.; Grasso, S.; Guerinoni, G.; Leibold, A.; Müller, M.; Otto, M.; Pfitzner, L.; Polignano, M.; Simone, D. de; Frey, L.
Conference Paper
2009Comparability of TXRF Systems at Different Laboratories
Nutsch, A.; Beckhoff, B.; Altmann, R.; Polignano, M.; Cazzini, E.; Codegoni, D.; Borionetti, G.; Kolbe, M.; Mueller, M; Mantler, C.; Streli, C.
Conference Paper
2009Complementary metrology within a European joint laboratory
Nutsch, A.; Beckhoff, B.; Altmann, R.; Berg, J.A. van den; Giubertoni, D.; Hoenicke, P.; Bersani, M.; Leibold, A.; Meirer, F.; Müller, M.; Pepponi, G.; Otto, M.; Petrik, P.; Reading, M.; Pfitzner, L.; Ryssel, H.
Conference Paper
2009Detection of Acidic Substances of H-X Type in Clean Room Air
Kames, J.; Leibold, A.; Nutsch, A.; Otto, M.
Conference Paper
2009Highly sensitive detection of inorganic contamination
Beckhoff, B.; Nutsch, A.; Altmann, R.; Borionetti, G.; Pello, C.; Polignano, M.L.; Codegoni, D.; Grasso, S.; Cazzini, E.; Bersani, M.; Lazzeri, P.; Gennaro, S.; Kolbe, M.; Müller, M.; Kregsamer, P.; Posch, F.
Conference Paper
2009Highly sensitive wavefront sensor for characterization of micro- to nanometer-scale surface flatness deviations
Lazareva, I.; Nutsch, A.; Pfitzner, L.; Frey, L.
Conference Paper
2009Revealing Copper Contamination in Silicon after Low Temperature Treatments
Polignano, M.; Brivio, J.; Codegoni, D.; Grasso, S.; Altmann, R.; Nutsch, A.; Pavia, G.
Conference Paper
2009Wave front sensor for highly accurate characterization of flatness on wafer surfaces
Nutsch, A.; Bucourt, S.; Grandin, T.; Lazareva, I.; Pfitzner, L.
Conference Paper
2008Determination of flatness on patterned wafer surfaces using wavefront sensing methods
Nutsch, A.; Pfitzner, L.; Grandin, T.; Levecq, X.; Bucourt, S.
Conference Paper
2008Total reflection x-ray fluorescence as a sensitive analysis method for the investigation of sputtering processes
Sekowski, M.; Steen, C.; Nutsch, A.; Birnbaum, E.; Burenkov, A.; Pichler, P.
Conference Paper, Journal Article
2007Characterization of the impurity profile at the SiO2/Si interface using a combination of total reflection x-ray fluorescence spectrometry and successive etching of silicon
Steen, C.; Nutsch, A.; Pichler, P.; Ryssel, H.
Journal Article
2007Chemical mechanical planarization (CMP) metrology for 45/32 nm technology generations
Nutsch, A.; Pfitzner, L.
Conference Paper
2007Control of flatness for chemical mechanical planarization
Nutsch, A.; Pfitzner, L.
Conference Paper
2007Detection and review of crystal originated surface and sub surface defects on bare silicon
Nutsch, A.; Funakoshi, T.; Pfitzner, L.; Steffen, R.; Supplieth, F.; Ryssel, H.
Conference Paper
2007Metrology, analysis and characterization in micro- and nanotechnologies
Pfitzner, L.; Nutsch, A.; Öchsner, R.; Pfeffer, M.; Don, E.; Wyon, C.; Hurlebaus, M.
Conference Paper
2007Process optimization by means of integrated monitoring tools in the semiconductor industry
Pfitzner, L.H.; Nutsch, A.; Roeder, G.; Schellenberger, M.
Conference Paper
2006Importance of noise and crystal defects for matching of defect inspection tools at 50 nm defect size
Nutsch, A.; Supplieth, F.
Conference Paper
2006Scenario for a yield model based on reliable defect density data and linked to advanced process control
Nutsch, A.; Öchsner, R.
Conference Paper
2005Defect inspection @ 50 nm defect size described by a binomial model
Nutsch, A.
Conference Paper
2005Reliable matching of 300 mm defect inspection tools @ sub 60 nm defect size
Nutsch, A.; Supplieth, F.; Pfitzner, L.; Ryssel, H.
Conference Paper
2004Polierverfahren in der Halbleiterfertigung
Pfitzner, L.; Bär, E.; Frickinger, J.; Nguyen, H.; Nutsch, A.
Conference Paper
2003Defect inspection method for quality control in a reclaim line
Nutsch, A.; Fritsche, M.; Dudenhausen, H.-M.; Pfitzner, L.; Ryssel, H.
Conference Paper
2003Evaluation of aluminum contamination on large-diameter wafers in ULSI fabrication
Nutsch, A.; Shimizu, H.; Englmüller, A.; Fabry, L.
Conference Paper
2003Wafer reclaim in semiconductor manufacturing
Frickinger, J.; Nutsch, A.; Pfitzner, L.; Ryssel, H.; Zielonka, G.
Book Article
2001Trace analysis for 300 mm wafers and processes with total- reflection x-ray-fluorescence
Nutsch, A.; Erdmann, V.; Zielonka, G.; Pfitzner, L.; Ryssel, H.
Journal Article