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| 2012 | Energy saving potential of converged ICT and CE
Schlomann, B.; Stobbe, L.; Nissen, N.F. | Conference Paper |
| 2011 | Carbon footprinting of information technology products based on ISO standards: Fujitsu case study
Böttner, H.; Schischke, K.; Nissen, N.F. | Conference Paper |
| 2011 | Modeling and optimization of energy harvesting-systems under non-ideal operating temperatures with regard to availability of power-supply and reduction of environmental impacts
Benecke, S.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2011 | Non-energy related policy options to foster eco-design of electronics products
Maxwell, D.; McAndrew, L.; Schischke, K.; Stobbe, L.; Nissen, N.F.; White, O. | Conference Paper |
| 2010 | A comfortable world without standby - the zero Watt inside (ZeWIn) system
Deubzer, O.; Nissen, N.F.; Riedel, H.; Gaugele, J.; Ulmer, D. | Abstract, Conference Paper |
| 2010 | EuP and ErP Progress of Implementation
Nissen, N.F.; Stobbe, L.; Schischke, K.; Schlösser, A.; Mudgal, S.; Thornton, A. | Abstract |
| 2010 | Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | Intermodulation Distortion as Indicator for Interconnect Degradation
Krüger, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | Investigation of the solder joint fatigue life in combined vibration and thermal cycling tests
Eckert, T.; Krüger, M.; Müller, W.H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | Modeling and Optimization of Energy Harvesting Systems with Regard to Availability of Power Supply and Minimization of Environmental Impacts
Benecke, S.; Middendorf, A.; Wüst, F.; Bochow-Neß, O.; Nissen, N.F. | Abstract |
| 2010 | Modellierung des Energie- und Ressourcenbedarfs von IKT
Stobbe, L.; Schischke, K.; Nissen, N.F.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2010 | A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2009 | Abschätzung des Energiebedarfs der weiteren Entwicklung der Informationsgesellschaft
Stobbe, L.; Nissen, N.F.; Proske, M.; Middendorf, A.; Schlomann, B.; Friedewald, M.; Georgieff, P.; Leimbach, T. | Research Report |
| 2009 | The collaboration between Int J Life Cycle Assess and J LCA Jpn
Matsuno, Y.; Kondo, Y.; Mishima, N.; Shibaoke, N.; Yashiro, T.; Yamamoto, Y.; Morioka, T.; Nissen, N.F.; Schischke, K.; Stobbe, L.; Reichl, H.; Kurihara, S.; Nakano, K.; Hirao, M.; Kai, H.; Ishibashi, Y.; Shimase, H.; Kamohara, S.; Takemasa, T.; Higo, M.; Dowaki, K.; Genchi, Y.; Motoshita, M.; Itsubo, N.; Inaba, A.; Torii, M.; Narita, N.; Ogawa, K.; Hondo, H.; Hirayama, Y.; Nakajima, K.; Yamada, S.; Fukuhara, I. | Journal Article |
| 2009 | Environmental Comparison of Energy Scavenging Technologies for Micro System Applications
Benecke, S.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Environmental comparison of energy scavenging technologies for self-sufficient micro system applications
Benecke, S.; Reichl, H.; Nissen, N.F. | Conference Paper |
| 2009 | Evaluating the effects of electromigration by using adjustable solder joints of concave shape
Jaeschke, J.; Kleff, J.; Müller, W.H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Integration of reliability and environmental aspects in early design stages of mechatronics
Middendorf, A.; Deyter, S.; Gausemeier, J.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Lignin in der Elektronikindustrie
Müller, J.; Schmidt, R.; Nissen, N.F.; Scheel, W. | Conference Paper |
| 2009 | Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Methodology and utilization of simplified eco-assessments for policy making
Stobbe, L.; Nissen, N.F.; Schischke, K.; Reichl, H. | Conference Paper |
| 2009 | Modeling Solder Joint Fatigue in Combined Environmental Reliability Tests with Concurrent Vibration and Thermal Cycling
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signals
Krüger, M.; Eckert, T.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2008 | Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2008 | Device Switching on Demand - A Standby Reducing System
Ulmer, D.; Franke, D; Deubzer, O.; Nissen, N.F. | Conference Paper |
| 2008 | Eco-efficiency for smart microsystems
Reichl, H.; Middendorf, A.; Nissen, N.F.; Stobbe, L. | Conference Paper |
| 2008 | Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings
: Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O. | Conference Proceedings |
| 2008 | Energy efficiency meets ecodesign - technology impacts of the European EuP directive
Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H. | Conference Paper |
| 2008 | EU deckelt Standby-Leistungsaufnahme
Nissen, N.F. | Journal Article |
| 2008 | Expanding the Technological Boundaries of the Biopolymer PHB in Electronic Products
Walachowicz, F.; Petermann, C.; Achatz, B.; Scherzer, D.; Schneller, A.; Scheel, W.; Schmidt, R.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2008 | Heterointegration of Complete Systems Based on Polytronics
Bock, K.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2008 | Interdependencies between reliability and standby
Nissen, N.F.; Middendorf, A.; Stobbe, L.; Schlösser, A.; Reichl, H. | Conference Paper |
| 2008 | A Model for Gaining Significant Data to Establish Energy Profiles of Passive Electronic Components
Körber, G.; Schulz, G.; Viehmann, K.-R.; Huck, W.; Dietrich, M.; Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H. | Conference Paper |
| 2008 | RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2008 | Sustainability Assessment of Polymers Based on Renewable Resources for Electronic Products
Achatz, B.; Piepenbrink, M.; Saling, P.; Scherzer, D.; Walachowicz, F.; Petermann, C.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2007 | Applications of biopolymers in electronic products
Nissen, N.F.; Kleinert, G.; Petermann, C.; Mothes, G.; Müller, J.; Reichl, H.; Scheel, W.; Schmidt, R. | Conference Paper |
| 2007 | The EuP directive - current status and steps towards implementation
Nissen, N.F.; Schischke, K.; Stobbe, L. | Conference Paper |
| 2007 | European environmental legislation - insights into the EuP process
Nissen, N.F.; Stobbe, L.; Schischke, K.; Müller, J.; Reichl, H. | Conference Paper |
| 2007 | Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2007 | Highlights from 2007 iNEMI Environmental Roadmap
Nissen, N.F. | Conference Paper |
| 2007 | Integration of reliability and environmental aspects in the early design stages of mechatronics
Tsunezawa, K.; Middendorf, A.; Nissen, N.F.; Reichl, H.; Walachowicz, F. | Conference Paper |
| 2006 | EUlegislation: RoHS, WEEE and EUP status and implications for companies
Nissen, N.F.; Schischke, K. | Conference Paper |
| 2006 | Renewable resources for electronics
Müller, J.; Nissen, N.F.; Scheel, W.; Schmidt, R. | Conference Paper |
| 2006 | Status of ecodesign implementation and EUP readiness in electrical and electronics SMEs
Schischke, K.; Nissen, N.F.; Mueller, J.; Reichl, H. | Journal Article |
| 2001 | How Electronics Technology Trends Translate into Environmental Trends
Nissen, N.F.; Griese, H. | Conference Paper |
| 2000 | EE-Toolbox - A modular assessment system for the environmental optimization of electronics
Middendorf, A.; Nissen, N.F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I. | Conference Paper |
| 2000 | Environmental Assessment Using the IZM/EE Toolbox
Nissen, N.F.; Griese, H.; Müller, J.; Middendorf, A.; Stobbe, I.; Reichl, H.; Funk, T. | Conference Paper |
| 2000 | Implementation of Environmental Issues in SMEs
Müller, J.; Griese, H.; Middendorf, A.; Nissen, N.F.; Teller, M. | Conference Paper |
| 1999 | Bilanzierung moderner Aufbau- und Verbindungstechnologien
Schwenn, M.; Middendorf, A.; Nissen, N.F. | Conference Paper |
| 1999 | Environmental aspects of PCB microintegration
Müller, J.; Griese, H.; Nissen, N.F.; Potter, H.; Reichl, H. | Conference Paper |
| 1999 | Environmental performance of mobile products
Ram, B.; Stevels, A.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 1999 | Umweltaspekte in Kunden-Lieferanten-Beziehungen
Deubzer, O.; Heinze, L.; Nissen, N.F. | Conference Paper |
| 1998 | Auswirkungen von Zulieferer-Anforderungen auf die Entwicklung umweltgerechter Produkte in der Elektronik-Industrie
Heinze, L.; Deubzer, O.; Nissen, N.F. | Conference Paper |
| 1998 | Challenge Printed Circuit Board
Müller, J.; Griese, H.; Nissen, N.F.; Pötter, H. | Conference Paper |
| 1998 | Design for environment in automotive electronic design
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F. | Conference Paper |
| 1998 | An environmental comparison of packaging and interconnection technologies
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1997 | Comparison of simplified environmental assessments versus full life cycle assessment (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Comparison of simplified environmental assessments versus full life cycle assessments (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental assessments of electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental Assessments of Electronics: A New Model to Bridge the Gap Between Full Life Cycle Evaluations and Product Design
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental impact of materials in electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H. | Conference Paper |
| 1997 | Informationssysteme für die Kreislaufwirtschaft
Nissen, N.F.; Middendorf, A. | Conference Paper |
| 1997 | The Project UmProdIKT
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F. | Conference Paper |
| 1996 | Design for Environment: Environmental Assessments of Electronics During Layout
Nissen, N.F. | Conference Paper |
| 1996 | Umweltbezogene Anforderungen an das zukünftige Leiterplattendesign
Griese, H.; Müller, J.; Nissen, N.F.; Sietmann, R. | Conference Paper |
| 1996 | Umweltgerechter Entwurf von Leiterplatten
Nissen, N.F. | Book Article |