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| 2020 | Feasibility and Performance Case Study of a Private Mobile Cell in the Smart Factory Context
Neumann, Arne; Martenvormfelde, Lukas; Wisniewski, Lukasz; Ferfers, Tobias; Schuba, Kornelia; Pieper, Carsten; Musiol, Torsten | Conference Paper |
| 2020 | Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu-Bogdan; Doncker, Rik W. de | Conference Paper |
| 2019 | 5G into Profinet integration as a use case for network slicing
Neumann, Arne; Wisniewski, Lukasz; Jasperneite, Jürgen | Conference Paper |
| 2019 | Quality-of-Service monitoring of hybrid industrial communication networks
Ehrlich, Marco; Neumann, Arne; Biendarra, Alexander; Jasperneite, Jürgen | Journal Article |
| 2019 | Topology Detection as a Base for Efficient Management of Heterogeneous Industrial Network Systems Using Software-Defined Networking
Panda, S.K.; Majumder, M.; Ehrlich, M.; Neumann, A.; Wisniewski, L.; Jasperneite, J. | Conference Paper |
| 2018 | Towards integration of industrial ethernet with 5G mobile networks
Neumann, Arne; Wisniewski, Lukasz; Ganesan, Rakash SivaSiva; Rost, Peter; Jasperneite, Jürgen | Conference Paper |
| 2017 | Analytical model for diode-to-fiber coupling and beam propagation in weakly guiding fibers
Neumann, A.; Giesberts, M.; Witte, U.; Fitzau, O.; Hoffmann, H.-D. | Conference Paper |
| 2017 | Approaches for in-vehicle communication - an analysis and outlook
Neumann, Arne; Mytych, Martin Jan; Wesemann, Derk; Wisniewski, Lukasz; Jasperneite, Jürgen | Conference Paper |
| 2017 | MEMS switch with prolonged lifetime under hot switching conditions based on gold as contact material
Lisec, T.; Stoppel, F.; Kaden, D.; Heinrich, F.; Neumann, A.; Wagner, B. | Conference Paper |
| 2017 | Towards monitoring of hybrid industrial networks
Neumann, Arne; Ehrlich, Marco; Wisniewski, Lukasz; Jasperneite, Jürgen | Conference Paper |
| 2016 | Estimating alternative technology sets in nonparametric efficiency analysis
Neumann, Anne; Nieswand, Maria; Schubert, Torben | Journal Article |
| 2016 | Großserientaugliche Prozessketten für hochintegrierte Bauteile aus hybriden Faser-Kunststoff/Metall-Verbunden
: Behrens, Bernd-Arno; Neumann, Andre; Landgrebe, Dirk; Scholz, Peter; Müller, Roland; Schieck, Frank; Kropp, Thomas | Report |
| 2016 | Potential of multipath communications to improve communications reliability for internet-based cyberphysical systems
Elattar, M.; Wendt, V.; Neumann, A.; Jasperneite, J. | Conference Paper |
| 2015 | Umformprozessketten für Bauteile aus Faser-Kunststoff/Metall-Verbunden
Scholz, Peter; Schieck, Frank; Müller, Roland; Seidlitz, Holger; Gerstenberger, Colin; Osiecki, Tomasz; Behrens, Bernd-Arno; Vucetic, Milan; Grbic, Nenad; Neumann, Andè | Conference Paper |
| 2014 | D2.4 Overview and analysis of modes of exchange between relevant sectors
Grigoleit, Sonja; Jovanovic, Milos; Schietke, Ruth; Kliuyeva, Katsiaryna; Neumann, Alexander; Martin-Maze, Mederic; Gabrielsen Jumbert, Maria; Garcia Canales, Juan Enrique; Herrera, Javier F. | Report |
| 2013 | A case for research with and on community networks
Braem, B.; Blondia, C.; Barz, C.; Rogge, H.; Freitag, F.; Navarro, L.; Bonicioli, J.; Papathanasiou, S.; Escrich, P.; Baig Viñas, R.; Kaplan, A.L.; Neumann, A.; Vilata i Balaguer, I.; Tatum, B.; Matson, M. | Journal Article |
| 2013 | Estimating alternative technology sets in nonparametric efficiency analysis: Restriction tests for panel and clustered data
Neumann, Anne; Nieswand, Maria; Schubert, Torben | Report |
| 2011 | High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A. | Conference Paper |
| 2010 | Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B. | Conference Paper |
| 2010 | Time to Play Gorge - Time to Learn AI
Jantke, K.; Hoppe, I.; Lengyel, D.; Neumann, A. | Conference Paper |
| 2009 | Microtechnology platform for cell cell interaction detection
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H. | Conference Paper |
| 2008 | Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R. | Journal Article |
| 2008 | Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A. | Conference Paper |
| 2007 | Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H. | Conference Paper |
| 2007 | Verfahren zur Herstellung einer elektronischen Baugruppe
Kostelnik, J.; Schaaf, U.; Kugler, A.; Becker, K.-F.; Neumann, A. | Patent |
| 2006 | Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H. | Presentation |
| 2006 | Embedding of active and passive components into printed wiring boards
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H. | Presentation |
| 2006 | Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Die hoch-integrierte Leiterplatte mit eingebetteten Chips - Ergebnisse aus dem EU-Projekt Hiding Dies
Neumann, A. | Presentation |
| 2006 | Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A. | Journal Article |
| 2006 | Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H. | Conference Paper |
| 2006 | Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R. | Patent |
| 2005 | Buried components in printed circuit boards
Ostmann, A.; Neumann, A.; Sommer, P.; Reichl, H. | Journal Article |
| 2005 | Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E. | Journal Article |
| 2005 | Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Integration of active and passive components using chip in polymer technology
Böttcher, L.; Neumann, A.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2005 | A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Process flow and manufacturing concept for embedded active devices
Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reich, H. | Conference Paper |
| 2004 | Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Chip in polymer: 3D integration of active circuitry in polymeric substrate
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Optische transkutane Speisung und Steuerung voll-implantierbarer Hörgeräte
Neumann, A. | Thesis |
| 2003 | Stackable packages with integrated components
Ostmann, A.; Neumann, A.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Chip in polymer - Next step in miniaturization
Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H. | Journal Article |
| 2002 | Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H. | Conference Paper |
| 2001 | Si-C-N-Pulver aus Hexamethyldisilazan durch Pyrolyse im Heißwandreaktor in Gegenwart von Ammoniak
Neumann, A. | Dissertation |
| 1998 | Nanosized Si-C-N-Powders by Polysilazane-Pyrolysis and Si3N4/SiC Composite materials thereof
Boden, G.; Neumann, A.; Breuning, T.; Tschernikowa, E.; Hermel, W. | Journal Article |
| 1997 | Nanosized siliconcarbonitride powders-synthesis, characterization and handling
Hermel, W.; Boden, G.; Friedrich, H.; Neumann, A.; Knösche, C.; Zimmermann, H. | Book Article |
| 1997 | Structural development and properties of Si3N4-SiC composites from amorphous Si-C-N powder precursors
Tschernikova, E.; Neumann, A.; Boden, G. | Conference Paper |
| 1996 | Investigations on surface reactivity of silicon-carbonitride powders by thermoanalytical methods
Breuning, T.; Neumann, A.; Boden, G. | Conference Paper |