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| 2012 | Effektivere Diagnosen durch neues Sensorelement
Nebrich, L. | Journal Article |
| 2012 | Heterogene Systemintegration von Halbleitersensoren
Klumpp, A.; Nebrich, L.; Eisele, I. | Book Article |
| 2012 | Highly sensitive radiation detectors for medical applications
Nebrich, L.; Wiest, F.; Eisele, I. | Conference Paper |
| 2012 | Hochempfindliche Strahlungsdetektoren für medizinische Anwendungen
Nebrich, L.; Wiest, F. | Conference Paper |
| 2012 | X-ray detectors to discover dangerous substances
Nebrich, L. | Journal Article |
| 2011 | Der Röntgenblick entdeckt gefährliche Stoffe
Nebrich, L. | Journal Article |
| 2010 | Silicon-interposer with high density Cu-filled TSVs
Wieland, R.; Zoschke, K.; Jürgensen, N.; Merkel, R.; Nebrich, L.; Wolf, J. | Conference Paper |
| 2009 | 3D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W. | Conference Paper |
| 2009 | 3D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2009 | 3D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2005 | 3D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P. | Conference Paper, Journal Article |
| 2005 | High quality strained Si/SiGe substrates for CMOS and optical devices
Weber, J.; Nebrich, L.; Bensch, F.; Neumeier, K.; Vogg, G.; Wieland, R.; Bonfert, D.; Ramm, P. | Conference Paper |
| 2005 | Process integration of infrared-sensitive PIN photodiodes and CMOS transistors in a single-SiGe substrate
Nebrich, L.; Neumeier, K.; Stadler, A.; Weber, J.; Bensch, F.; Kreuzer, S.; Vogg, G.; Herrmann, K.; Klumpp, A.; Wieland, R.; Bonfert, D.; Soldner, W.; Ramm, P. | Conference Paper, Journal Article |