| | |
|---|
| 2012 | Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H. | Journal Article |
| 2011 | High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H. | Journal Article |
| 2011 | The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H. | Conference Paper |
| 2011 | Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M. | Conference Paper |
| 2011 | Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D. | Journal Article |
| 2011 | Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M. | Conference Paper |
| 2011 | Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Conference Paper |
| 2010 | 3-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H. | Conference Paper |
| 2010 | An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H. | Journal Article |
| 2010 | Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D. | Conference Paper |
| 2010 | Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D. | Conference Paper |
| 2010 | Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D. | Journal Article |
| 2010 | Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2010 | Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H. | Journal Article |
| 2010 | Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H. | Conference Paper |
| 2010 | Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Conference Paper |
| 2010 | Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H. | Journal Article |
| 2010 | Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H. | Conference Paper |
| 2010 | RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H. | Journal Article |
| 2010 | A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H. | Conference Paper |
| 2009 | Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Electrical Modeling and Analysis of the Impact of Slits on Microstrip Lines in Thin Film Polymer Layers
Ndip, I.; Topper, M.; Becker, K.F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes
Reichl, H.; Ndip, I. | Conference Paper |
| 2009 | The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Modeling and Measurement of Coplanar Transmission Lines with Significant Proximity and Surface Roughness Effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H. | Conference Paper |
| 2009 | Modeling and Quantification of Conventional and Coax-TSVs for RF Applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2009 | RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H. | Book Article |
| 2009 | Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Managing losses in through silicon vias with different return current path configurations
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H. | Conference Paper |
| 2008 | Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H. | Conference Paper |
| 2008 | On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2008 | Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H. | Patent |
| 2007 | Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2007 | Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2007 | Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2007 | Novel methodologies for efficient and accurate modeling and optimization of system-in-package modules for RF/High-Speed applications
Ndip, I.N. | Dissertation |
| 2007 | Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H. | Conference Paper |
| 2006 | Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S. | Patent |
| 2006 | A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S. | Conference Paper |
| 2006 | RF/Microwave Modeling of SiP Modules - A novel approach
Ndip, I.; Reichl, H.; Guttowski, S. | Conference Paper |
| 2005 | Characterization of bump arrays at RF/microwave frequencies
Ndip, I.N.; Sommer, G.; John, W.; Reichl, H. | Journal Article |
| 2005 | Effects of discontinuities and technological fluctuations on the RF performance of BGA packages
Ndip, I.; John, W.; Reichl, H. | Conference Paper |
| 2005 | Efficient RF/microwave modeling of discontinuities in chip packages and boards
Ndip, I.; John, W.; Reichl, H. | Conference Paper |
| 2005 | Minimizing reflections and cross-talk in chip packages
Ndip, I.; John, W.; Reich, H. | Conference Paper |
| 2005 | A novel approach for RF/microwave modeling and optimization of BGA packages
Ndip, I.; John, W.; Reichl, H.; Thiede, A. | Conference Paper |
| 2004 | Methodology for Efficient Modeling of BGA Packages at RF/microwave Frequencies
Ndip, I.; Sommer, G.; John, W.; Reichl, H. | Conference Paper |
| 2004 | RF/microwave modeling and comparison of buried, blind and through-hole vias
Ndip, I.; John, W.; Reichl, H. | Conference Paper |
| 2003 | A novel modelling methodology of bump arrays for RF and high-speed applications
Ndip, I.; Sommer, G.; John, W.; Reichl, H. | Conference Paper |