Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Conference Paper
2016Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B.
Journal Article
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Journal Article
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Conference Paper
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Journal Article
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Conference Paper
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Conference Paper
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.
Journal Article
2015Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.
Journal Article
2015Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D.
Conference Paper
2015Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong
Conference Paper
2015Silicon photonics packaging on board-level
Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.
Conference Paper
2014Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
Conference Paper
2014Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.
Conference Paper
2013An advanced MEMS sensor packaging concept for use in harsh environments
Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong
Conference Paper
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.
Conference Paper
2011Verfahren zur Herstellung von mechanischen Anschlägen zur Selbstjustage und Vorrichtung mit Anschlägen zur Selbstjustage
Oppermann, Hermann; Jordan, Rafael; Glaw, Veronika; Mukhopadhyay, Biswajit
Patent
2009CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
Galan, J.V.; Sanchis, P.; Marti, J.; Marx, S.; Schröder, H.; Mukhopadhyay, B.; Tekin, T.; Selvaraja, S.; Bogaerts, W.; Dumon, P.; Zimmermann, L.
Conference Paper