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| 2020 | Formation and crystallographic orientation of NiSi2-Si interfaces
Fuchs, Florian; Bilal Khan, Muhammad; Deb, Dipjyoti; Pohl, Darius; Schuster, Jörg; Weber, Walter M.; Mühle, Uwe; Löffler, Markus; Georgiev, Yordan M.; Erbe, Artur; Gemming, Sibylle | Journal Article |
| 2020 | Investigations of internal stresses in high-voltage devices with deep trenches
Hieckmann, Ellen; Mühle, Uwe; Chekhonin, Paul; Zschech, Ehrenfried; Gambino, Jeff | Journal Article |
| 2020 | Microstructure and interface characteristics of 17-4PH/YSZ components after Co-Sintering and hydrothermal corrosion
Günther, Anne; Moritz, Tassilo; Mühle, Uwe | Journal Article |
| 2020 | Precipitation hardening of high entropy alloy CoCrFeMnNi containing titanium
Eißmann, N.; Mühle, U.; Gaitzsch, U.; Walther, G.; Weißgärber, T.; Kieback, B. | Journal Article |
| 2019 | The effect of Fe as constituent in Ni-base alloys on the oxygen evolution reaction in alkaline solutions at high current densities
Rauscher, Thomas; Bernäcker, Christian Immanuel; Mühle, Uwe; Kieback, Bernd F.; Röntzsch, Lars | Journal Article |
| 2019 | Optimierung der FIB-Präparation an vielkristallinen Al-Werkstoffen durch Orientierungsbestimmung mittels EBSD
Mühle, U.; Löffler, M.; Schubert, T.; Staab, T.E.M.; Krause-Rehberg, R.; Kieback, B. | Journal Article |
| 2019 | Precipitation hardening of Cantor alloy containing titanium
Gaitzsch, U.; Eißmann, N.; Mühle, U.; Weißgärber, T.; Kieback, B. | Conference Paper |
| 2019 | Towards reconfigurable electronics: Silicidation of top-down fabricated silicon nanowires
Khan, Muhammad Bilal; Deb, Dipjyoti; Kerbusch, Jochen; Fuchs, Florian; Löffler, Markus; Banerjee, Sayanti; Mühle, Uwe; Weber, Walter Michael; Gemming, Sibylle; Schuster, Jörg; Erbe, Artur; Georgiev, Yordan M. | Journal Article |
| 2018 | Corrosion resistance of silicon-infiltrated silicon carbide (SiSiC)
Striegler, Maria; Matthey, Björn; Mühle, Uwe; Michaelis, Alexander; Herrmann, Mathias | Journal Article |
| 2018 | Nanocrystalline non-equilibrium alloys of molybdenum with sodium
Bergk, B.; Mühle, U.; Kieback, B. | Journal Article |
| 2018 | Nanomaterials: Certain aspects of application, risk assessment and risk communication
Laux, Peter; Tentschert, Jutta; Riebeling, Christian; Braeuning, Albert; Creutzenberg, Otto; Epp, Astrid; Fessard, Valérie; Haas, Karl-Heinz; Haase, Andrea; Hund-Rinke, Kerstin; Jakubowski, Norbert; Kearns, Peter; Lampen, Alfonso; Rauscher, Hubert; Schoonjans, Reinhilde; Störmer, Angela; Thielmann, Axel; Mühle, Uwe; Luch, Andreas | Journal Article |
| 2018 | Non-equilibrium solid solution of molybdenum and sodium: Atomic scale experimental and first principles studies
Bergk, B.; Mühle, U.; Povstugar, I.; Koutná, N.; Holec, D.; Clemens, H.; Kieback, B. | Journal Article |
| 2018 | Precipitation Behavior in High-Purity Aluminium Alloys with Trace Elements
Lotter, F.; Muehle, U.; Elsayed, M.; Ibrahim, A.M.; Schubert, T.; Krause-Rehberg, R.; Kieback, B.; Staab, T.E.M. | Journal Article |
| 2018 | Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation
Huang, J.; Löffler, Markus; Mühle, Uwe; Möller, Wolfhard; Mulders, Johannes J.L.; Kwakman, Laurens; Dorp, Willem F. van; Zschech, Ehrenfried | Journal Article |
| 2018 | Thin bioactive Zn substituted hydroxyapatite coating deposited on ultrafine-grained titanium substrate
Prosolov, K.A.; Belyavskaya, O.A.; Muehle, U.; Sharkeev, Y.P. | Journal Article |
| 2017 | Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried | Journal Article |
| 2017 | Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried | Journal Article |
| 2017 | Enabling energy efficiency and polarity control in germanium nanowire transistors by individually gated nanojunctions
Trommer, Jens; Heinzig, André; Mühle, Uwe; Löffler, Markus; Winzer, Annett; Jordan, Paul M.; Beister, Jürgen; Baldauf, Tim; Geidel, Marion; Adolphi, Barbara; Zschech, Ehrenfried; Mikolajick, Thomas; Weber, Walter Michael | Journal Article |
| 2017 | In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried | Journal Article |
| 2017 | Microstructural investigation of diamond-SiC composites produced by pressureless silicon infiltration
Matthey, Björn; Höhn, Sören; Wolfrum, Anne-Kathrin; Mühle, Uwe; Motylenko, Mykhaylo; Rafaja, David; Michaelis, Alexander; Herrmann, Mathias | Journal Article |
| 2017 | Nanocrystalline Alloys of Molybdenum with Sodium and Yttrium obtained by Mechanical Alloying
Kieback, B.; Bergk, B.; Mühle, U. | Conference Paper |
| 2017 | Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried | Poster |
| 2017 | Reconfigurable germanium transistors with low source-drain leakage for secure and energy-efficient doping-free complementary circuits
Trommer, Jens; Heinzig, André; Slesazeck, Stefan; Mühle, Uwe; Löffler, Markus; Walter, Dennis; Mayr, Christian Georg; Mikolajick, Thomas; Weber, Walter Michael | Conference Paper |
| 2017 | Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried | Book Article |
| 2016 | CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko | Conference Paper |
| 2016 | Structural characterisation of carbon fibres along the fabrication process using SEM/FIB and TEM
Mühle, Uwe; Standke, Yvonne; Zschech, Ehrenfried; Meinl, Juliane; Michaelis, Alexander; Kirsten, Martin; Cherif, Chokri | Conference Paper |
| 2016 | TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried | Journal Article |
| 2015 | Bulk titanium nitride ceramics - Significant enhancement of hardness by silicon nitride addition, nanostructuring and high pressure sintering
Bläß, Ulrich W.; Barsukova, Tatiana; Schwarz, Marcus; Köhler, Anke; Schimpf, Christian; Petrusha, Igor A.; Mühle, Uwe; Rafaja, David; Kroke, Edwin | Journal Article |
| 2015 | In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried | Journal Article |
| 2015 | In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried | Journal Article, Conference Paper |
| 2015 | Phasenbildungsmechanismen in Stahl-Keramik-Werkstoffverbunden
Günther, Anne; Slawik, Tim; Moritz, Tassilo; Mühle, Uwe; Michaelis, Alexander | Conference Paper |
| 2015 | Preparation and characterization of silicon nanowires using SEM/FIB and TEM
Banerjee, Sayanti; Mühle, Uwe; Löffler, Markus; Heinzig, André; Trommer, Jens; Zschech, Ehrenfried | Journal Article, Conference Paper |
| 2015 | Spezielle Anwendungen der Transmissionselektronenmikroskopie in der Siliziumhalbleiterindustrie
Mühle, Uwe
: Rafaja, David (Betreuer); Lichte, Hannes (Gutachter); Zschech, Ehrenfried (Gutachter) | Habilitation |
| 2015 | TEM study of schottky junctions in reconfigurable silicon nanowire devices
Banerjee, Sayanti; Löffler, Markus; Mühle, Uwe; Berent, Katarzyna; Heinzig, A.; Trommer, J.; Weber, Walter; Zschech, Ehrenfried | Journal Article |
| 2015 | Ultra-thin ZrO2/SrO/ZrO2 insulating stacks for future dynamic random access memory capacitor applications
Knebel, Steve; Pešić, Milan; Cho, Kyuho; Chang, Jaewan; Lim, Hanjin; Kolomiiets, Nadiia; Afanasyev, Valeri; Mühle, Uwe; Schröder, Uwe; Mikolajick, Thomas | Journal Article |
| 2015 | Verfahren zur Erstellung von Elementverteilungsbildern mit einem Transmissionselektronenmikroskop
Mühle, Uwe; Gluch, Jürgen; Zschech, Ehrenfried | Patent |
| 2014 | In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried | Journal Article |
| 2014 | A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried | Journal Article |
| 2013 | An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O. | Conference Paper |
| 2013 | Multi-scale materials data for 3D TSV stack performance simulation and model validation
Zschech, E.; Yeap, K.B.; Sander, C.; Muehle, U.; Gall, M.; Sukharev, V. | Conference Paper |
| 2011 | Effect of the carbon ion energy on the microstructure of ta-C/Cr multilayers
Ratayski, U.; Rafaja, D.; Klemm, V.; Mühle, U.; Leonhardt, M.; Scheibe, H.-J. | Journal Article, Conference Paper |
| 2009 | Properties of plasma-enhanced atomic layer deposition-grown tantalum carbonitride thin films
Hossbach, C.; Teichert, S.; Thomas, J.; Wilde, L.; Wojcik, H.; Schmidt, D.; Adolphi, B.; Bertram, M.; Mühle, U.; Albert, M.; Menzel, S.; Hintze, B.; Bartha, J.W. | Journal Article |