Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, Jessica; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2015Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.
Conference Paper
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2014In situ monitoring of interface delamination by the 3ω-method
Schulz, M.; Sheva, S.; Walter, H.; Mroßko, R.; Yang, G.; Keller, J.; Wunderle, B.
Conference Paper
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Conference Paper
2014Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Journal Article, Conference Paper
2014Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.
Conference Paper
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2013Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Conference Paper
2012Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages
Keller, J.; Schulz, M.; Mrossko, R.; Wunderle, B.; Michel, B.
Conference Paper
2011Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D.
Conference Paper
2011Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.
Conference Paper
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R.
Journal Article
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2010Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B.
Conference Paper
20093-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H.
Conference Paper
2009Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B.
Conference Paper
2009Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L.
Conference Paper
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Conference Paper
2008Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2008Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R.
Journal Article, Conference Paper
2007Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H.
Conference Paper
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper