Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2009Platform technology for form factor equivalent microsystems derived from COTS components
Jung, E.; Minkus, M.; Becker, K.F.; Koch, M.
Conference Paper
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2006Reliability issues in Pb-free solder joint miniaturization
Huang, Z.; Conway, P.P.; Jung, E.; Thomson, R.C.; Liu, C.; Loeher, T.; Minkus, M.
Journal Article