Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2001Accelerated testing of flip chip packages under dynamic load
Rau, I.; Miessner, R.; Liebing, G.; Becker, K.-F.
Conference Paper
2001Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A.
Patent
2000Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
Mießner, R.; Aschenbrenner, R.; Reichl, H.; Ling, S.; Le, B.; Lew, A.; Benson, R.; Nhan, E.
Conference Paper
2000Dynamic mechanical analysis (DMA) of an highly-filled epoxy resin in thin layers
Braun, T.; Mießner, R.; Becker, K.-F.
Conference Paper
2000Evaluation of flip chip bonding using ACA on polyester substrates
Mießner, R.; Nieland, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Reliability study of flip chip on FR4 interconnections with ACA
Mießner, R.
Conference Paper
1998Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H.
Conference Paper
1998Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Influences of flip chip layout on the underfilling process
Becker, K.-F.; Schaub, M.; Mießner, R.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper