Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
 Micromaterials and nanomaterials
: Michel, B.
Journal
2018Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B.
Journal Article, Conference Paper
2018Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B.
Journal Article, Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Conference Paper
2017Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B.
Journal Article, Conference Paper
2017Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B.
Journal Article, Conference Paper
2017Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B.
Journal Article, Conference Paper
2016Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S.
Journal Article
2016Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S.
Conference Paper
2016Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B.
Conference Paper
2016Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B.
Conference Paper
2015"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B.
Conference Paper
2015FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B.
Conference Paper
2015FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B.
Conference Paper
2015A high-efficiency hybrid high-concentration photovoltaic system
Zimmermann, S.; Helmers, H.; Tiwari, M.K.; Paredes, S.; Michel, B.; Wiesenfarth, M.; Bett, A.W.; Poulikakos, D.
Journal Article
2015Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S.
Conference Paper
2015Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B.
Conference Paper, Poster
2015Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B.
Book Article
2014An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B.
Conference Paper
2014Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies
Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R.
Book Article
2014Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B.
Book Article
2014Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B.
Conference Paper
2014Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B.
Conference Paper
2014Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B.
Book Article
2014Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2014Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S.
Book Article
2014Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B.
Conference Paper
2014Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B.
Conference Paper
2014EUCEMAN - the European Center for MicroNanoReliability Research in Europe
Michel, B.; Winkler, T.
Book Article
2014Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M.
Book Article
2014Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B.
Book Article
2014Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B.
Book Article
2014German association of nanotechnology: Objectives and benefits
Nonninger, R.; Michel, B.
Book Article
2014Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B.
Book Article
2014Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S.
Journal Article, Conference Paper
2014Interface characterisation at electronic packages by means af nanoscale deformation analysis
Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B.
Book Article
2014Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B.
Conference Paper
2014Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B.
Conference Paper
2014Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B.
Conference Paper
2014Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S.
Conference Paper
2014Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B.
Conference Paper
2014Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B.
Book Article
2014Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B.
Book Article
2014New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B.
Book Article
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B.
Book Article
2014Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B.
Conference Paper
2014Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H.
Book Article
2014Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T.
Book
2014Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A.
Conference Paper
2014Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Conference Paper, Journal Article
2014Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B.
Conference Paper
2014Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S.
Book Article
2014Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Journal Article, Conference Paper
2014Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Book Article
2014Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B.
Conference Paper
2013The 2nd International Conference on Engineering of Technology Innovation (ICETI 2012) Kaohsiung, Taiwan, Nov. 2-6, 2012
Hsieh, W.-H.; Michel, B.
Journal Article, Conference Paper
2013Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
Zimmermann, S.; Helmers, H.; Tiwari, M.K.; Escher, W.; Paredes, S.; Neves, P.; Poulikakos, D.; Wiesenfarth, M.; Bett, A.W.; Michel, B.
Conference Paper
2013Advanced mixed-mode bending test experimental-numerical characterization of the critical energy release rate Gc including mixed-mode-angle psi in interfaces under independent external loads
Schulz, M.; Springborn, M.; Keller, J.; Michel, B.; Wunderle, B.
Conference Paper
2013Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Clean Sky – European Technology Demonstration for greener Aviation
Kaulfersch, E.; Rzepka, S.; Michel, B.
Conference Paper
2013Combined method for thermal characterization of high power semiconductors
Merten, E.; Abo Ras, M.; Essen, T. von; Schacht, R.; May, D.; Winkler, T.; Michel, B.
Conference Paper
2013Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Maus, I.; Pape, H.; Nabi, H.; Michel, B.; Wunderle, B.
Conference Paper
2013Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S.
Conference Paper
2013Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S.
Conference Paper
2013Finite-Element-Modelling of Intermetallics in Solders
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
2013Kombinierte Zuverlässigkeitstests für die Elektromobilität
Otto, A.; Matkowski, P.; Winkler, T.; Michel, B.; Rzepka, S.
Conference Paper
2013Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013New Reliability Testing Methods for Electromobility Applications
Otto, A.; Matkowski, P.; Brabandt, I.; Winkler, T.; Michel, B.; Rzepka, S.
Conference Paper
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Package Characterization with Stress Chip Measurements for Health Monitoring
Rost, F.; Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Michel, B.
Conference Paper
2013Parametric transient thermo-electrical PSPICE model for a power cable
Schacht, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B.
Conference Paper
2013Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Conference Paper
2013Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Winkler, T.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2013Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2013Toolbox for visco-elastic material modeling of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Brabandt, I.; Michel, B.
Conference Paper
2013Transient thermal response as failure analytical tool - a comparison of different techniques
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2013Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum – FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B.
Conference Paper
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.
Conference Paper
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.
Conference Paper
2012Battery management network for fully electrical vehicles featuring smart systems at cell and pack level
Otto, A.; Rzepka, S.; Mager, T.; Michel, B.; Lanciotti, C.; Günther, T.; Kanoun, O.
Conference Paper
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2012Chances and limits of computer tomography in materialographic investigations
Faust, W.; Noack, E.; Michel, B.
Journal Article
2012Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Journal Article
2012Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B.
Conference Paper
2012The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Poshtan, E.A.; Rzepka, S.; Wunderle, B.; Silber, C.; Bargen, T. von; Michel, B.
Conference Paper
2012Experimental and numerical methods for evaluation of interface cracks in electronics systems
Keller, J.; Schulz, M.; Wunderle, B.; Auersperg, J.; Michel, B.
Conference Paper
2012Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2012FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Frictionless air flow blade fan for thermal management of electronics
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B.
Conference Paper
2012Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2012Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems
Pantou, R.; Shah, D.L.; Michel, B.; Rzepka, S.
Conference Paper
2012Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.
Conference Paper
2012Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2012Miniaturized frictionless fan concept for thermal management of electronic
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B.
Conference Paper
2012Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen Automobil, Luftfahrt und Elektronik
Michel, B.; Winkler, T.
Conference Paper
2012Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages
Keller, J.; Schulz, M.; Mrossko, R.; Wunderle, B.; Michel, B.
Conference Paper
2012Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2012Novel architecture for battery management systems in fully electrical cars
Rzepka, S.; Otto, A.; Dudek, R.; Michel, B.
Conference Paper
2012Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B.
Conference Paper
2012Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2012Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Journal Article
2012Transient thermal analysis as failure analytical tool in electronic packaging
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2011Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems
Rzepka, S.; Walter, H.; Pantou, R.; Freed, Y.; Michel, B.
Conference Paper
2011Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2011Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd
Conference Paper
2011Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks
Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2011Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B.
Conference Paper
2011Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Journal Article, Conference Paper
2011Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B.
Conference Paper
2011Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Conference Paper
2011Correlation based local measurement of small CTE for high temperature power electronics packaging
Hammacher, J.; Dost, M.; Seiler, B.; Scheiter, L.; Noack, E.; Rzepka, S.; Michel, B.
Conference Paper
2011DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Rzepka, S.; Wunderle, B.; Michel, B.
Conference Paper
2011Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard
Conference Paper
2011Formulation of percolating thermal underfill by sequential convective gap filling
Branschwiler, T.; Goicochea, J.V.; Matsumoto, K.; Wolf, H.; Kiimin, C.; Michel, B.; Wunderle, B.; Faust, W.
Conference Paper
2011Fracture mechanical test methods for interface crack evaluation of electronic packages
Keller, J.; Maus, I.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Journal Article, Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B.
Conference Paper
2011High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A.
Conference Paper
2011Interaction integral and mode separation for BEoL-cracking and -delamination investigations under 3D-IC integration aspects
Auersperg, J.; Dudek, R.; Oswald, J.; Michel, B.
Conference Paper
2011Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A.
Conference Paper
2011Mechanism and prevention of defect formation during hydrophilic silicon direct bonding at low temperatures
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P.
Conference Paper
2011Niedrigtemperatur-Direktbonden von Silizium-, Borosilikat- und Quarzglaswafern und der Einfluss von Funktionsschichten
Eichler, M.; Hennecke, P.; Michel, B.; Klages, C.-P.
Conference Paper
2011Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2011Photon Management Structures Based on Interference Lithography and Nanoimprint Processes
Bläsi, B.; Hauser, H.; Walk, C.; Michel, B.; Mellor, A.; Guttowski, A.; Jüchter, S.; Wellens, C.; Peters, M.; Kübler, V.; Wolf, A.J.
Conference Paper
2011Physikalisch-chemische Eigenschaften von SiO2-Schichten auf plasmabehandelten Siliziumoberflächen
Michel, B.
Dissertation
2011Project VISA: Fully integrated power electronic systems for automotive electronics
Hofmann, T.; Sommer, J.-P.; Michel, B.
Conference Paper
2011Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2011Three-dimensional deformation analysis of MEMS/NEMS by means of X-ray computer-tomography
Hammacher, J.; Dost, M.; Faust, W.; Scheiter, L.; Erb, R.; Michel, B.
Conference Paper
2010Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.
Conference Paper
2010Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Pufall, R.; Michel, B.; Kaulfersch, E.
Conference Paper
2010Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B.
Conference Paper
2010Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B.
Conference Paper
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Combination of FE simulation and micro deformation measurements - A promising approach to consider reliability aspects right from the start
Sommer, J.-P.; Michel, B.; Brämer, B.; Kugler, A.; Rank, H.
Conference Paper
2010Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B.
Conference Paper
2010Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2010Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B.
Conference Paper
2010Design and development of a miniaturized black body device for in-situ IR-camera calibration
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B.
Conference Paper
2010Design of low loss beam forming networks - supported by numerical simulation and materials characterisation
Sommer, J.-P.; Uhlig, P.; Kulke, R.; Michel, B.
Conference Paper
2010DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.
Conference Paper
2010fibDAC stress relief - A novel stress measurement approach for BEoL structures
Vogel, D.; Michel, B.
Conference Paper
2010fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B.
Conference Paper
2010Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.
Conference Paper
2010Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.
Conference Paper
2010Influence of moisture on humidity sensitive material parameters of microelectronics relevant polymers
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B.
Conference Paper
2010An integrated experimental and theoretical approach to evaluate Si strength dependent on the processing history
Brueckner, J.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2010Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2010Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B.
Conference Paper
2010Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2010Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2010Low-temperature direct bonding of borosilicate, fused silica, and functional coatings
Eichler, M.; Michel, B.; Hennecke, P.; Gabriel, M.; Klages, C.-P.
Conference Paper
2010Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds
Shirangi, M.H.; Michel, B.
Book Article
2010Miniaturized black body radiator for IR- Detector calibration - Design and development
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B.
Conference Paper
2010Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2010Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H.
Conference Paper
2010Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Conference Paper
2010Networking in micro/nano reliability research encouraged by EUCEMAN, the European center for micro- and nanoreliability
Hammacher, J.; Michel, B.; Winkler, T.; Kaulfersch, E.
Conference Paper
2010Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Book Article
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2010Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements
Nestler, J.; Otto, T.; Sommer, J.-P.; Michel, B.; Gessner, T.; Bier, F.F.
Conference Paper
2010Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B.
Conference Paper
2010Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday
: Michel, B.; Lang, K.-D.
Book
2010Special issue of the 8th International Workshop on High Aspect Ratio Micro Structure Technology, HARMST 2009
Achenbach, S.; Klymyshyn, D.; Michel, B.
Journal Article
2010Theoretical analysis on the shear test
Dudek, R.; Doering, R.; Kreyssig, K.; Michel, B.
Conference Paper
2010VCCT and integral concepts of Bi-material interface fracture in low-K structures - going to understand relation
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2010Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B.
Conference Paper
2010Virtual prototyping advanced by statistic and stochastic methodologies
Rzepka, S.; Müller, A.; Michel, B.
Conference Paper
2010Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Schacht, R.; Abo Ras, M.; May, D.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2009Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2009Active components embedded into organic boards-accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2009Advanced experimental and simulation approaches to meet reliability challenges of new electronics systems
Vogel, D.; Auersperg, J.; Michel, B.
Journal Article
2009Advanced package design for electronic and MEMS applications supported by FE analyses and deformation measurements
Sommer, J.P.; Michel, B.; Kugler, A.; Rank, H.
Conference Paper
2009Atmospheric-pressure plasma activation of silicon for MEMS packaging
Eichler, M.; Michel, B.; Hennecke, P.; Thomas, M.; Klages, C.-P.
Conference Paper
2009Bondenergie-Messung in situ während des Temperns beim Direktbonden von Glas und Silizium
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P.
Conference Paper
2009Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B.
Conference Paper
2009Comparison of bonding kinetics for borosilicate glass and silicon wafers by in situ fracture surface energy measurements during annealing
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P.
Conference Paper
2009Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack and damage evaluation in low-k BEoL structures under CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2009Density and aging behavior of primary amino groups on afterglow plasma-treated low-density polyethylene (LDPE)
Lachmann, K.; Michel, B.; Klages, C.-P.
Journal Article, Conference Paper
2009Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B.
Conference Paper
2009Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Conference Paper
2009Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Conference Paper
2009Effects of dielectric barrier discharges on silicon surfaces: Surface roughness, cleaning, and oxidation
Michel, B.; Giza, M.; Krumrey, M.; Eichler, M.; Grundmeier, G.; Klages, C.-P.
Journal Article
2009Effects on silanol condensation during low temperature silicon fusion bonding
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P.
Journal Article
2009Einsatz von Mikroplasmen für die Herstellung von Silizium-Mehrlagenaufbauten
Eichler, M.; Michel, B.; Gabriel, M.; Klages, C.-P.
Journal Article
2009EUCEMAN - recent activities from the European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Conference Paper
2009Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper, Journal Article
2009Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Courtois, B.; Michel, B.
Journal Article
2009Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H.
Conference Paper
2009Influence of moisture on the time and temperature dependent properties of polymer systems
Walter, H.; Dermitzaki, E.; Shirangi, H.; Wunderle, B.; Hartmann, S.; Michel, B.
Conference Paper
2009Influence of nano composites on reliability and mechanical properties of moisture sensors
Hammacher, J.; Saettler, P.; Kreyßig, K.; Martin, J.; Seiler, B.; Michel, B.
Conference Paper
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article, Conference Paper
2009Investigations on the effect of dielectric barrier discharge (DBD) treatment as a preconditioning method for low temperature silicon wafer bonding
Michel, B.; Eichler, M.; Klages, C.-P.
Journal Article, Conference Paper
2009Investigations on the plasma-surface interaction during DBD-treatment for low-temperature direct silicon wafer bonding
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2009Lifetime modelling for microsystems integration: From nano to systems
Wunderle, B.; Michel, B.
Journal Article
2009Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T.
Journal Article
2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H.
Conference Paper
2009Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Conference Paper
2009Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Wunderle, B.; Dermitzaki, E.; Holck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Ratzke, K.; Faupel, F.; Michel, B.
Conference Paper
2009MST special issue on the conference MicroNanoReliability 2007. Editorial
Michel, B.
Conference Paper, Journal Article
2009Multipin ac corona treatment - a new surface activation method for low temperature direct bonding
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2009Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H.
Journal Article
2009Reliability concepts of microsystem integration
Wunderle, B.; Michel, B.
Conference Paper
2009Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper, Journal Article
2009Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper
2009Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2009Study on the effect of moisture and elevated temperature on the fracture properties of visco elastic polymers
Walter, H.; Shirangi, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2009Surface reactions controlled by dielectric barrier discharge at atmospheric pressure for high performance large-scale production
Eichler, M.; Thomas, M.; Borris, J.; Michel, B.; Klages, C.-P.
Conference Paper
2009Testing and reliability issues in nanomechanics
Michel, B.
Conference Paper
2009Thermo-mechanical reliability assessment for 3D through-Si stacking
Dudek, R.; Brämer, B.; Irsigler, R.; Rzepka, S.; Michel, B.
Conference Paper
2009Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.
Journal Article
2009Untersuchung der Aktivierungseffekte durch DBD bei Atmosphärendruck für das Tieftemperatur-Direktbonden
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2009Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B.
Patent
2009Verfahren zum zwischenschichtfreien Verbinden von Substraten, Vorrichtung zur Durchfuehrung einer Plasmabehandlung sowie deren Verwendung
Klages, C.-P.; Michel, B.; Eichler, M.
Patent
2009Virtual prototyping in microelectronics and packaging
Rzepka, S.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M.
Journal Article
2008Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M.
Conference Paper
2008Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B.
Conference Paper
2008Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures
Eichler, M.; Michel, B.; Thomas, M.; Gabriel, M.; Klages, C.-P.
Journal Article, Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B.
Conference Paper
2008Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.
Conference Paper, Journal Article
2008Editorial to MST special issue: Colloquium on Micro-Production, Karlsruhe, Germany, November 2007
Kraft, O.; Michel, B.
Conference Paper, Journal Article
2008Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H.
Conference Paper
2008Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B.
Journal Article, Conference Paper
2008FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B.
Conference Paper
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Conference Paper
2008Incorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components
Auersperg, J.; Michel, B.
Conference Paper
2008Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B.
Conference Paper
2008Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B.
Journal Article, Conference Paper
2008Kinetics of silanol condensation for low-temperature direct bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.
Conference Paper
2008Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
May, D.; Wunderle, B.; Abo Ras, M.; Faust, W.; Gollhard, A.; Schacht, R.; Michel, B.
Conference Paper
2008Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2008Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in Epoxy Molding Compounds
Shirangi, M.H.; Fan, X.J.; Michel, B.
Conference Paper
2008A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B.
Conference Paper, Journal Article
2008Micro- and nanoscale deformation measurements at interface crack tips
Keller, J.; Mayer, S.; Gollhardt, A.; Michel, B.
Conference Paper
2008MicroCar 2008: Micro materials, nano materials for automotives. Volume of abstracts
: Michel, B.
Conference Proceedings
2008Microsecurity and nanosecurity - Security research using the advantages of smart system integration
Michel, B.; Winkler, T.
Conference Paper
2008Modelling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards
Schacht, R.; Wunderle, B.; May, D.; Michel, B.; Reichl, H.
Conference Paper
2008Nano-Computertomographie - ein wertvolles Hilfsmittel bei metallographischen Untersuchungen zur Schadensanalyse mikroelektronischer und mikrotechnischer Komponenten
Faust, W.; Noack, E.; Michel, B.
Conference Paper
2008Nanoreliability - Reliability Research for Microsystem Technology on the way from Micro to Nano
Michel, B.; Winkler, T.; Werner, M.; Fecht, H.
Journal Article
2008Nanoscale deformation measurements - concepts for failure and reliability assessment at the nanoscale
Michel, B.; Gollhardt, A.; Keller, J.
Conference Paper
2008Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2008Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper
2008Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B.
Journal Article, Conference Paper
2008Reliability-solutions and concepts for applications in high-tech regions
Michel, B.
Book Article
2008Residual stress measurements of high spatial resolution
Vogel, D.; Luczak, F.; Michel, B.
Conference Paper
2008Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B.
Conference Paper
2008Special Issue of the Conference Smart Sensors, Actuators and MEMS, Maspalomas, Gran Canaria, Spain, 2-4 May 2007
Michel, B.; Becker, T.; Schmid, U.
Journal Article
2008Special issue of the high-aspect-ratio micro-structure technology workshop, HARMST'07. Editorial
Malek, C.K.; Saile, V.; Michel, B.
Conference Paper, Journal Article
2008Structure Property Correlation of Epoxy Resins Under the Influence of Moisture and Temperature; and Comparison of Diffusion Coefficient with MD-Simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2008Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages
Shirangi, H.; Müller, W.H.; Michel, B.
Conference Paper
2008Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B.
Conference Paper
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Vibration, Deformation and Reliability - an Overview about Measuring Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.
Conference Paper
2008Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A.
Conference Paper
2008Zuverlässigkeits-Lösungsansätze und Konzepte für Anwendungen im Hightech Bereich
Michel, B.
Book Article
2007Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Conference Paper
2007Design, test, integration and packaging of MEMS/MOEMS, 2006
Michel, B.; Courtois, B.
Conference Paper
2007Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B.
Conference Paper
2007Effects of dielectric barrier discharge treatment on the surface of silicon wafers
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2007Einsatz von Atmosphärendruck-Mikroplasmen für die Aufbau- und Verbindungstechnik
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.
Conference Paper
2007EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Journal Article, Conference Paper
2007EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Conference Paper, Journal Article
2007Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2007Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2007Experimental Vibration Analyses by Laser Vibrometer under Vacuum Conditions
Schnitzer, R.; Rümmler, N.; Dost, Mi.; Michel, B.; Hauck, T.
Conference Paper
2007Experimental Vibration and Deformation Analyses for Increase Micro-Structure Reliability
Rümmler, N.; Schnitzer, R.; Michel, B.
Conference Paper
2007Failure Analysis of Microelectronic Packages by Pulse IR Thermography
Wunderle, B.; May, D.; Schacht, R.; Michel, B.
Abstract
2007Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B.
Conference Paper
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Journal Article
2007FIB Based Local Residual Stress Measurement - Potentials and Challenges
Vogel, D.; Michel, B.
Conference Paper
2007FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B.
Journal Article
2007Focused Ion Beam (FIB) as an Analytical Tool in Micro- and Nanotechnology
Gollhardt, A.; Michel, B.
Conference Paper
2007Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
Auersperg, J.; Michel, B.
Conference Paper
2007Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H.
Conference Paper
2007HARMST, High Aspect Ratio Micro Structure Technology Workshop. Editorial
Kwon, T.H.; Michel, B.
Conference Paper, Journal Article
2007In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B.
Conference Paper
2007In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B.
Conference Paper
2007Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H.
Conference Paper
2007Lokale Eigenspannungsmessung im FIB - Potential und Herausforderung
Vogel, D.; Michel, B.
Conference Paper, Journal Article
2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B.
Conference Paper
2007Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B.
Conference Paper
2007Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper, Journal Article
2007A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Micro- and Nanosecurity - Security by Miniaturization in MST
Michel, B.; Winkler, T.
Conference Paper
2007Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique, in Micro- and Opto-Electronic Materials and Structures
Michel, B.; Keller, J.
Book Article
2007Microsecurity, Nanosecurity - Security Research in Europa Utilizing Advanced Micro- and Nanotechnologies
Michel, B.; Winkler, T.
Conference Paper, Journal Article
2007Microsecurity, Nanosecurity - Sicherheitsforschung in Europa unter Verwendung von Methoden der Mikro- und Nanotechnologien
Michel, B.; Winkler, T.
Conference Paper, Journal Article
2007Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
2007MMCB - The Micro Materials Center Berlin and Chemnitz at Fraunhofer IZM
Michel, B.
Conference Paper, Journal Article
2007Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B.
Conference Paper
2007NanoDAC - Object deformation measurements for micro and nanotechnology applications
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2007Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2007Nanoreliability - Reliability Concepts for Micro-Nano Interface Regions
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper, Journal Article
2007Nanoreliability - Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper, Journal Article
2007Nanoscale deformation measurements for reliability assessment of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Conference Paper
2007Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B.
Conference Paper
2007Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Progressing from Micro to Nanoreliability in System Integration
Wunderle, B.; Michel, B.
Conference Paper
2007Pulse and Lock-In Infrared Thermography - Possibilities for Non-Destructive Reliability Analysis of Micro-Electronic Assemblies
May, D.; Schacht, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D.
Conference Paper
2007Reliability of SnPb and Pb-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Journal Article
2007Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Journal Article
2007Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B.
Journal Article
2007Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T.
Conference Paper
2007Silizium-Aktivierung für das Tieftemperatur-Waferbonden mit Barrierenentladung
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2007System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H.
Conference Paper
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Testing of Microcomponents
Michel, B.; Walter, H.
Book Article
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper
2007Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Michel, B.
Conference Paper
2007Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2007Zuverlässigkeitsprobleme im Hightech-Bereich - Lösungsansätze und Konzepte
Michel, B.
Book Article
20063D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
20063D-PCB-packaging technology for high power applications with water cooling
Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2006Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H.
Conference Paper
2006Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2006AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2006Ambient pressure plasma activation for low temperature bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Radu, I.; Gabriel, M.
Conference Paper
2006Bestimmung der Querkontraktionszahl von Polymeren in Abhängigkeit von der Temperatur mit Hilfe des UNIDAC-Verfahrens
Walter, H.; Seiler, B.; Bombach, C.; Michel, B.
Conference Paper
2006Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Auersperg, J.; Michel, B.
Conference Paper
2006Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2006Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2006Colloquium on Micro Production, Aachen, Germany, 2-3 March 2005
Gatzen, H.H.; Michel, B.
Abstract
2006Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2006Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B.
Conference Paper
2006Design, test, integration and packaging of MEMS/MOEMS, 2005
Courtois, B.; Michel, B.
Conference Paper, Journal Article
2006Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation
Dermitzaki, E.; Bauer, J.; Wunderle, B.; Michel, B.
Conference Paper
2006Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B.
Journal Article
2006Effects of dielectric barrier discharge treatment on surface chemistry of silicon wafers
Michel, B.; Eichler, M.; Klages, C.-P.
Conference Paper
2006Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2006Energy dispersive X-ray diffraction
Kämpfe, B.; Luczak, F.; Michel, B.
Journal Article
2006Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B.
Conference Paper
2006Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2006Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B.
Conference Paper
2006A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B.
Conference Paper
2006FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2006FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B.
Conference Paper
2006High-resolution stress measurements for microsystem and semiconductor applications
Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2006Interface-Risse in Komponenten der Mikro- und Nanoelektronik
Auersperg, J.; Michel, B.; Walter, H.
Conference Paper
2006Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B.
Abstract
2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis
Deplanque, S.; Nüchter, W.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2006Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B.
Journal Article
2006Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R.
Journal Article
2006Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Michel, B.; Reichl, H.
Conference Paper
2006NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2006Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2006Nanoscale Deformation Measurements to Improve Reliability Assessment of Sensors and MEMS
Michel, B.; Keller, J.; Walter, H.
Conference Paper
2006A new method for local strain field analysis near cracks in micro- and nanotechnology applications
Michel, B.; Vogel, D.; Sabaté, N.; Lieske, D.
Conference Paper
2006Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding
Eichler, M.; Michel, B.; Thomas, M.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.; Klages, C.-P.
Conference Paper
2006Progress in reliability research in the micro and nano region
Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2006Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2006Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2006Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B.
Conference Paper
2006Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B.
Conference Paper
2006Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2006Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M.
Patent
2006Zuverlässige Bauteile mit neuen Werkstoffen
Michel, B.
Book Article
2006Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2005"Microreliability", "Nanoreliability" - Zuverlässigkeitsbewertung von Mikro- und Nanokomponenten unter Anwendung der Bruchmechanik
Michel, B.
Conference Paper
20053D deformation analysis of flow and gas sensors membranes for reliability assessment
Sabate, N.; Keller, J.; Gollhardt, A.; Vogel, D.; Gracia, I.; Cane, C.; Morante, J.R.; Michel, B.
Conference Paper
2005Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2005Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B.
Abstract
2005Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2005Combination of nanoDAC and FEM for reliability analysis of materials in the micro-nano-transition scale
Kaulfersch, E.; Keller, J.; Michel, B.
Abstract
2005A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2005A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2005Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2005Damage and failure analysis of lead-free solder interconnects in automotive electronics
Faust, W.; Kreyßig, K.; Michel, B.
Abstract
2005Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2005Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2005Digital image correlation - a versatile experimental tool to improve reliability, security and lifetime
Dost, M.; Seiler, B.; Erb, R.; Michel, B.
Abstract
2005Experimental mechanics on the way from micro to nano
Michel, B.
Journal Article
2005FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints
Spraul, M.; Nüchter, W.; Wunderle, B.; Michel, B.
Conference Paper
2005FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B.
Conference Paper
2005fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2005Fracture and Fatigue Behaviour of MEMS related Micro Materials
Walter, H.; Dudek, R.; Michel, B.
Conference Paper
2005Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Identification of Fitted Viscoelastic Material Parameters of Adhesives in Automotive Applications for Numerical Simulations using Genetic Algorithms
Göhler, J.; Michel, B.; Schaper, M.K.
Conference Paper
2005Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F.
Conference Paper
2005Micro and nanomechanical Deformation Analysis at Materials Interfaces
Keller, J.; Michel, B.
Conference Paper
2005Microreliability, Nanoreliability - Reliability approach for the micro-nano interface region
Michel, B.
Conference Paper
2005Microreliability, Nanoreliability- Zuverlässigkeitsbewertung von Polymer-Verbundsystemen im Mikro- und Nanobereich
Michel, B.
Conference Paper
2005Mikroprüftechnik
Michel, B.; Walter, H.
Book Article
2005Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B.
Conference Paper
2005Nanodac - a method for fracture mechanical characterization on the nanoscale
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2005Nanodeformation analysis near small cracks by means of nanoDAC technique
Michel, B.; Keller, J.
Conference Paper
2005Nanoreliability - lifetime estimation for nanotechnology applications based on nanoDAC and FIBDAC techniques
Michel, B.; Keller, J.
Conference Paper
2005Nanoreliability for mechanically loaded devices
Vogel, D.; Sabate, N.; Wunderle, B.; Keller, J.; Michel, B.; Reichl, H.
Conference Paper
2005Nanoreliability-combined simulation and testing
Michel, B.
Conference Paper
2005Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2005A new approach to micro deformation analysis by finite element based digital image correlation
Kühnert, R.; Meyer, R.; Vogel, D.; Michel, B.
Abstract
2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2005Packaging reliability research on the way from micro to nano
Wunderle, B.; Michel, B.
Conference Paper
2005Probabilistic Approaches for Fracture and Reliability Estimations of Microsystems
Winkler, T.; Michel, B.; Wunderle, B.
Conference Paper
2005Prüfung und Zuverlässigkeitsbewertung für die Mikrosystemtechnik im Mikro- und Nanobereich
Michel, B.; Keller, J.
Conference Paper
2005Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B.
Conference Paper
2005Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005Reliability on the Micro- and Nano-Scale - Experiment and Simulation
Wunderle, B.; Michel, B.
Conference Paper
2005Reliability Testing of Polytronics Components in the Micro-Nano Region
Michel, B.; Dudek, R.; Walter, H.
Conference Paper
2005Testing at Micro and Nanoscale
Michel, B.
Conference Paper
2005Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
2005Thermal and mechanical reliability analysis of an anisotropic magneto-resistive current measurement sensor
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Doering, R.; Hoelzl, J.; Michel, B.
Conference Paper
2005Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B.
Conference Paper
2005Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Journal Article, Conference Paper
2005Thermo-mechanical and fracture mechanical characterization of lead-free solder joints in microelectronics
Walter, H.; Déplanque, S.; Nüchter, W.; Wunderle, B.; Michel, B.
Conference Paper
2005Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2005Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005A Tribute to Albert Einstein
: Michel, B.
Journal Issue
2005Vibration Analyses for Function and Reliability Estimation of Automotive Sensors by Laser Vibrometry
Rümmler, N.; Schnitzer, R.; Dost, Mi.; Michel, B.
Conference Paper
2005Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Conference Paper
2005Zuverlässigkeit von Komponenten der Mikrosystemtechnik durch Einbeziehung von Nanoanalytik und Nanomechanik
Michel, B.; Wunderle, B.; Gollhardt, A.; Bombach, C.; Keller, J.
Conference Paper
2005Zuverlässigkeitskonzepte von "Mikro bis Nano" - Neue Anforderungen und Möglichkeiten der Zuverlässigkeitsbewertung für die Mikrosystemtechnik
Michel, B.
Conference Paper
2004Bragg Gitter in Polymer- und Glasfasern
Alt, T.; Badstübner, K.; Ansorge, F.; Michel, B.; Reichl, H.
Conference Paper
2004Characterization approaches of nanoscale modified plastics
Vogel, D.; Keller, J.; Michel, B.; Holst, M.; Muzic, M.
Conference Paper
2004Characterization of materials with nanoscopic filler particles by AFM techniques
Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2004Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2004Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2004Determination of local stress intensity factor at crack tip using image correlation techniques
Tsai, Y.; Keller, J.; Eylon, D.; Vogel, D.; Michel, B.; Meyendorf, N.
Conference Paper
2004Displacement and strain field measurements from SPM images
Keller, J.; Vogel, D.; Schubert, A.; Michel, B.
Book Article
2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen
Deplanque, S.; Nüchter, W.; Wunderle, B.; Walter, H.; Michel, B.
Conference Paper
2004FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Book Article
2004Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2004In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2004Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2004Materials mechanics for system integration and packaging
: Michel, B.
Journal Issue
2004MicroDAC - ein Messverfahren zur Ermittlung von Werkstoffeigenschaften im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2004Microreliability, nanoreliability - issues for MEMS
Michel, B.
Book Article
2004Microsecurity - important capabilities for homeland security challenges
Michel, B.; Winkler, T.
Journal Article
2004Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B.
Journal Article
2004Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2004Parametric FE-approach to flip-chip reliability under various loading conditions
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H.
Journal Article
2004Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2004Reliability in Experiment and Simulation on the Micro- and Nano Scale
Wunderle, B.; Michel, B.
Conference Paper
2004Reliability of SnPb and PB-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Conference Paper
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Conference Paper
2004Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Conference Paper
2004Thermo-mechanical reliability of power flip-chip cooling concepts
Wunderle, B.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2004Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Book Article
2004The world of electronic packaging and system integration
: Michel, B.; Aschenbrenner, R.
Book
2004Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2004Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und Nanomesstechniken in Kopplung zur Simulation
Michel, B.; Dudek, R.; Keller, J.; Luczak, F.
Conference Paper
2003Bestimmung der Querkontraktionszahl von Polymeren mittels Laserextensometrie und Grauwertkorrelationsanalyse
Walter, H.; Vogel, D.; Michel, B.; Grellmann, W.; Bierögel, C.
Conference Paper
2003Challenges of advanced mechanical micro testing techniques
Walter, H.; Grellmann, W.; Seidler, S.; Michel, B.
Abstract
2003Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B.
Conference Paper
2003Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
Spraul, M.; Nüchter, W.; Möller, A.; Schubert, A.; Michel, B.
Conference Paper
2003Continuation and change
Michel, B.; Bhushan, B.
Journal Article
2003Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2003Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P.
Conference Paper
2003Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2003Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B.
Conference Paper
2003High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R.
Journal Article
2003How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B.
Conference Paper
2003Investigations on low cycle fatigue of electrodeposited thin copper and nickel films
Dudek, R.; Walter, H.; Michel, B.; Zapf, J.
Conference Paper
2003The Micro Materials Center Berlin (MMCB)
Michel, B.; Winkler, T.
Abstract
2003Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B.
Journal Article
2003Morphologie-Zähigkeits-Korrelationen an modifizierten Epoxidharzsystemen mittels bruchmechanischer Prüfmethoden an Miniaturprüfkörpern
Walter, H.; Michel, B.; Bierögel, C.; Grellmann, W.
Conference Paper
2003nanoDAC - A Method of Reliability Analysis for Micro and Nano Technology
Vogel, D.; Michel, B.
Abstract
2003Nanomechanics for Electronics in Automotive Application
Keller, J.; Michel, B.
Conference Paper
2003Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2003Reliability of micro- and nanosystems
Michel, B.
Conference Paper
2003Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Journal Article
2003Schadensanalyse an Komponenten der Mikrosystemtechnik und Mikroelektronik
Faust, W.; Dost, M.; Michel, B.
Conference Paper
2003A severe loss. In memoriam Dr.-Ing. Andreas Schubert
Michel, B.
Journal Article
2003Simulation and reliability on the way from micro to nano
Michel, B.; Wunderle, B.
Conference Paper
2003Thermal and mechanical analysis of micromachined gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R.
Journal Article
2003Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B.
Conference Paper
2003Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2003Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
2003Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Auersperg, J.
Conference Paper
2002a46Parametric FE-approach to flip chip reliability under various loading situations
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
2002Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Journal Article
2002Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B.
Journal Article
2002Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2002Fracture mechanical characterization of polymers on nano scale by means of grey scale correlation
Keller, J.; Vogel, D.; Gollhardt, A.; Bauer, M.; Michel, B.
Conference Paper
2002Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2001/2002
: Michel, B.
Electronic Publication, Annual Report
2002Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2001/2002
: Michel, B.; Winkler, T.; Hinkel, O.
Annual Report
2002Generalized fracture mechanical integral concept J/sub G/ and its application in microelectronic packaging technology
Badri Ghavifekr, H.; Michel, B.
Journal Article
2002Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B.
Conference Paper
2002Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D.
Conference Paper
2002Micro andnanoDAC - a powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D.
Conference Paper
2002Micro Materials Center Berlin - materials research for MEMS packaging
Michel, B.; Winkler, T.
Conference Paper
2002Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Conference Paper
2002Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B.
Journal Article
2002Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2002Micromaterials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Conference Paper
2002A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G.
Conference Paper
2002NanoDAC - A powerful method for nanomechanical analysis of polymeric materials
Keller, J.; Vogel, D.; Bauer, M.; Michel, B.
Conference Paper
2002Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B.
Conference Paper
2002Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2002Special issue containing selected papers from the E-MRS proceedings of symposium-j - materials in microtechnologies and microsystems - Strasbourg, France - june 5-8, 2001. Preface
Morante, J.R.; Barbier, D.; Michel, B.
Journal Article
2002Special issue on Poly'2000, London - Foreword
Michel, B.; Kishimoto, K.
Journal Article, Conference Paper
2002Studies on moisture diffusion and popcorn cracking
Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2002Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.
Conference Paper
2001Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B.
Journal Article
2001Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B.
Conference Paper
2001Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B.
Conference Paper
2001Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J.
Conference Paper
2001Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Conference Paper
2001Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2001Fracture mechanics characterisation of epoxy resins by means of mini-compact-tension-specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Henning, H.; Michel, B.
Conference Paper
2001Fracture mechanics testing of modified epoxy resins with mini-compact tension (CT) specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B.
Book Article
2001Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2000
: Michel, B.; Winkler, T.; Hinkel, O.
Annual Report
2001From modular MEMS to a modular microfactory - the hybrid microfactory?
Großer, V.; Michel, B.; Schuenemann, M.; Reichl, H.
Journal Article, Conference Paper
2001Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B.
Journal Article, Conference Paper
2001In-situ-Messungen an Komponenten der Mikroelektronik und Mikrosystemtechnik mit optischen Methoden
Faust, W.; Bombach, C.; Pritzke, B.; Michel, B.
Conference Paper
2001Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Interface cracks and reliability in microsystems
Michel, B.; Auersperg, J.; Schubert, A.; Kühnert, R.
Conference Paper
2001Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.
Journal Article, Conference Paper
2001Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2001Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.
Conference Paper
2001Mechanical reliability of MEMS-structures under shock load
Wagner, U.; Franz, J.; Schweiker, M.; Bernhard, W.; Müller-Fiedler, R.; Michel, B.; Paul, O.
Journal Article
2001Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B.
Journal Article
2001Micro materials Center Berlin
Michel, B.; Schubert, A.; Winkler, T.
Journal Article, Conference Paper
2001Microcrack evaluation for electronics components by AFM nano-DAC deformation measurements
Vogel, D.; Michel, B.
Conference Paper
2001The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D.
Conference Paper
2001MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B.
Journal Article
2001Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B.
Conference Paper
2001Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B.
Journal Article, Conference Paper
2001Preface. Editorial
Michel, B.; Schubert, A.
Journal Article
2001Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Journal Article, Conference Paper
2001Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G.
Conference Paper
2001Verbundwerkstoffe und Werkstoffverbunde in der Mikrosystemtechnik
Michel, B.
Conference Paper
2001Vibration measurements of micro assemblies by means of laser techniques
Rümmler, N.; Schnitzer, R.; Michel, B.
Journal Article, Conference Paper
2000Analyses of flip-chip attach reliability
Dudek, R.; Schubert, A.; Michel, B.
Conference Paper
2000Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T.
Journal Article
2000Automated optical measurements under vacuum
Hillmann, V.; Großer, V.; Gentzsch, S.; Bloch, H.; Michel, B.
Conference Paper
2000Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Database for materials in micro systems
Villain, J.; Müller, T.; Michel, B.; Totzauer, W.
Conference Paper
2000Deformation behavior of micro mirror arrays under optical power
Kurth, S.; Kehr, K.; Kaufmann, C.; Faust, W.; Dötzel, W.; Michel, B.
Conference Paper
2000Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B.
Conference Paper
2000Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B.
Conference Paper
2000Experimental and numerical analyses of flip-chip attach reliability
Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Fracture electronics and thermomechanical compatibility (TMC) of microcomponents in high tech systems
Michel, B.; Winkler, T.
Conference Paper
2000Fracture mechanics characterization of epoxy resins with Mini-Compact-Tension(CT)-Specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B.
Conference Paper
2000Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1999
: Michel, B.
Annual Report
2000From Modular MEMS to a Modular Microfactory - the Hybrid Microfactory?
Großer, V.; Michel, B.; Schünemann, M.; Reichl, H.
Conference Paper
2000In situ measurement of deformations on microelectronic components by microscopic methods
Faust, W.; Bombach, C.; Michel, M.; Michel, B.
Conference Paper
2000Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B.
Conference Paper
2000Materials science and engineering - a major topic in the future of microelectronic packaging
Reichl, H.; Michel, B.; Schubert, A.
Conference Paper
2000Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B.
Conference Paper
2000Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B.
Conference Paper
2000Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B.
Conference Paper
2000Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F.
Conference Paper
2000MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B.
Conference Paper
2000Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Mode shape analysis of microstructures by means of laser-optical methods
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B.
Conference Paper
2000Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B.
Conference Paper
2000New investigations in materials research by confocal laser scanning microscopy
Kunath-Fandrei, G.; Faust, W.; Ullmann, P.; Michel, B.
Conference Paper
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
2000Package reliability studies by experimental and numerical analysis
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2000Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Book Article
2000Rapid prototyping of microcomponents and demonstrators in micro system technology
Fleischer, L.; Faust, W.; Dost, M.; Michel, B.; Vogel, J.; Zeidler, H.
Conference Paper
2000Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B.
Conference Paper
2000Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R.; Berek, H.; Fritsch, T.; Michel, B.
Journal Article
2000Results of Experimental Vibration Measurements as Input of Numerical Reliability Valuations
Schnitzer, R.; Rümmler, N.; Dudek, R.; Michel, B.
Conference Paper
2000Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2000Thermally optimised millimeter wave package on an LTCC ceramic board
Sommer, J.-P.; Michel, B.; Goebel, U.; Jelonnek, J.
Journal Article, Conference Paper
2000Thermo-mechanical reliability enhancement of microelectronics
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2000Thermo-mechanical reliability of microcomponents
Dudek, R.; Schubert, A.; Michel, B.
Conference Paper
2000Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.
Conference Paper
2000UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B.
Conference Paper
2000Usage of Fracture Mechanical Integral Concept T* in Microelectronic Packaging Technique
Badri Ghavifekr, H.; Auersperg, J.; Michel, B.
Conference Paper
2000X-ray diffraction at elevated temperatures in microsystem technology
Auerswald, E.; Anhöck, S.; Kieselstein, E.; Vogel, J.; Michel, B.
Conference Paper
1999Analysis of field coupling effects in fracture by combining infrared thermography and FE-calculation
Vogel, J.; Dost, M.; Auersperg, J.; Faust, W.; Michel, B.
Journal Article
1999Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B.
Conference Paper
1999Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B.
Journal Article
1999Damage and fracture evaluation in microelectronics assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Michel, B.
Book Article
1999A design and production framework for modular microsystems
Großer, V.; Schünemann, M.; Michel, B.; Reichl, H.
Conference Paper
1999Determination of material properties by the optical measuring procedure UNIDAC
Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Journal Article
1999An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Book Article
1999Facilities and results of micro deformation measurements
Faust, W.; Bombach, C.; Michel, B.
Book Article
1999Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.
Conference Paper
1999Fracture and damage evaluation in microelectronic assemblies by FEA
Auersperg, J.; Michel, B.
Conference Paper
1999Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1998
: Michel, B.
Annual Report
1999Investigation of thermomechanical field coupling effects near crack tips by combining thermal emission analysis and FE-simulation
Vogel, J.; Auersperg, J.; Dost, M.; Faust, W.; Michel, B.
Book Article
1999Investigations on popcorn cracking of T-QFP packages
Dudek, R.; Sommer, J.-P.; Michel, B.; Alpern, P.; Birzer, C.; Tilgner, R.
Book Article
1999Lasermetrological measurement of transient strain fields in Hopkinson-bar experiments
Vogel, D.; Michel, B.; Totzauer, W.; Schreppel, U.; Clos, R.
Book Article
1999Materials mechanics and thermo-mechanical reliability of flip chip area array packages
Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
1999Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechnik
Michel, B.; Reichl, H.
Conference Paper
1999MicroDAC deformation analysis on solder interconnects for flip chip
Vogel, D.; Luczak, F.; Schubert, A.; Michel, B.
Conference Paper
1999Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Vogel, D.; Gollhardt, A.; Kühnert, R.; Auersperg, J.; Michel, B.
Conference Paper
1999Optical measurement methods for MEMS applications
Großer, V.; Bombach, C.; Faust, W.; Vogel, D.; Michel, B.
Book Article
1999Packaging and thermomechanical challenges for high temperature electronics
Michel, B.; Vogel, D.
Conference Paper
1999Reliability aspects of microassembly in microfactories
Großer, V.; Michel, B.; Reichl, H.
Book Article
1999Stochastic FEM for parameter scattering in numerical simulation of advanced packages
Winkler, T.; Skurt, L.; Kaulfersch, E.; Michel, B.
Book Article
1999Strain measurement in micrometrology
Vogel, D.; Kühnert, R.; Michel, B.
Conference Paper
1999Thermo-mechanical FE analysis and micro deformation measurement
Sommer, J.-P.; Kaulfersch, E.; Hussack, J.; Schubert, A.; Michel, B.
Book Article
1999Vibration measurement of microstructures by means of laseroptical modalanalysis
Schnitzer, R.; Rümmler, N.; Großer, V.; Michel, B.
Conference Paper
1998Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B.
Conference Paper
1998Crack avoidance and crack evaluation in microsystems
Michel, B.
Conference Paper
1998Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Vogel, D.; Michel, B.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998Der Einsatz von Mikro- und Nanowerkstoffen. Grundlage für die Miniaturisierung von Komponenten und Systemen
Michel, B.; Reichl, H.
Conference Paper
1998Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1997
: Michel, B.
Annual Report
1998Improvement of the thermo-mechanical performance of advanced packages by experimentally assisted FE-analysis
Michel, B.; Dudek, R.; Schubert, A.
Conference Paper
1998Investigation of a rigid carrier CSP with the microDAC method
Simon, J.; Vogel, D.; Faust, W.; Gollhardt, A.; Michel, B.
Conference Paper
1998Laseroptische Modalanalyse an Mikrobauteilen
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B.
Conference Paper
1998Microdeformation analysis of packages and interconnects by the MicroDAC method
Vogel, D.; Kaulfersch, E.; Michel, B.
Conference Paper
1998Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Conference Paper
1998Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H.
Conference Paper
1998Reliability aspects of microassembly in microfactories
Michel, B.; Großer, V.; Reichl, H.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1998Thermo-mechanical analysis of microelectronics components and chipcards
Michel, B.; Vogel, D.
Conference Paper
1998Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1998Thermomechanical behavior of metal contacts and interconnects for information technology
Kaulfersch, E.; Schubert, A.; Michel, B.
Conference Paper
1998Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosystemen
Michel, B.; Faust, W.; Auersperg, J.
Conference Paper
1998Werkstoffeinsatz und Zuverlässigkeit von Mikrosystemen
Michel, B.
Conference Paper
1997Advanced deformation and failure analysis on flip chip assemblies
Vogel, D.; Caers, J.; Auersperg, J.; Schubert, A.; Michel, B.
Conference Paper
1997Characterization of composite materials by means of correlation analysis of grey scale patterns
Kieselstein, E.; Penno, M.; Wielage, B.; Dost, M.; Michel, B.
Conference Paper
1997Characterization of packages for laser diodes
Auerswald, E.; Döring, R.; Nechansky, H.; Kämpfe, B.; Michel, B.
Conference Paper
1997Charakterisierung von Werkstoffverbunden für neue Einsatzmöglichkeiten im Bereich der Mikrosystemtechnik
Michel, B.; Schubert, A.; Winkler, T.; Reichl, H.
Conference Paper
1997Comparison of different CSP approaches by means of numerical simulations
Auersperg, J.; Simon, J.; Schubert, A.; Michel, B.
Conference Paper
1997Confocal laser scanning microscopy for testing of microsystems
Faust, W.; Michel, B.
Conference Paper
1997CTE matched and mismatched heat-spreader materials for high power laser diode attachment. Thermal and mechanical optimization
Kaulfersch, E.; Töpfer, M.; Michel, B.; Reichl, H.
Conference Paper
1997Deformation analysis on flip chip solder interconnects by MicroDAC
Vogel, D.; Auersperg, J.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder
Weiß, S.; Kaulfersch, E.; Töpfer, M.; Zakel, E.; Michel, B.; Reichl, H.
Conference Paper
1997An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Fatigue life studies on Flip Chip, PBGA and PQFP solder joints
Dudek, R.; Nylen, M.; Gustavsson, U.; Michel, B.
Conference Paper
1997FE-Simulation for polymeric packaging materials
Dudek, R.; Scherzer, M.; Schubert, A.; Michel, B.
Conference Paper
1997Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
Auersperg, J.; Schubert, A.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Fracture electronics. Concepts of fracture mechanics for reliability
Michel, B.
Conference Paper
1997Investigation of crack temperature fields by means of infrared thermography and FE calculations
Vogel, J.; Auersperg, J.; Dost, M.; Michel, B.
Conference Paper
1997Laseroptical deformation measurements on SAA-materials
Faust, W.; Bombach, C.; Oehmigen, M.; Großer, V.; Michel, B.
Conference Paper
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H.
Conference Paper
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Journal Article
1997Mechanical characterization of polymers in microelectronics
Walter, H.; Faust, W.; Schubert, A.; Grellmann, W.; Michel, B.
Conference Paper
1997Mechanical reliability study of FCOB and CSP assemblies by FEA and MicroDAC
Schubert, A.; Dudek, R.; Vogel, D.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
1997MicroDAC deformation measurement in packaging components
Vogel, D.; Langheinrich, M.; Auersperg, J.; Schubert, A.; Michel, B.
Conference Paper
1997MicroDAC deformation measurement on microelectronic products
Vogel, D.; Bombach, C.; Großer, V.; Michel, B.
Conference Paper
1997The microDAC method. A powerful means for microdeformation analysis in electronic packaging
Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H.
Conference Paper
1997Miniaturisierung und Werkstoffverbunde. Probleme und Lösungsmöglichkeiten im Bereich Chip-Leiterplatte
Michel, B.; Reichl, H.
Conference Paper
1997Optical analysis of 3D-microstructures produced by additive technologies
Bombach, C.; Großer, V.; Gentzsch, S.; Engelmann, G.; Michel, B.
Conference Paper
1997Predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1997Reliability evaluation of chip scale packages by FEA and MicroDAC
Auersperg, J.; Vogel, D.; Simon, J.; Schubert, A.; Michel, B.
Conference Paper
1997Reliability evaluation of components using fracture machanics in spite of uncertain data
Winkler, T.; Kaulfersch, E.; Michel, B.
Conference Paper
1997Residual stress analysis in microcomponents
Schubert, A.; Michel, B.
Conference Paper
1997SEM shape and deformation analysis by micro DAC
Kühnert, R.; Tränkner, K.; Franke, H.; Michel, B.
Conference Paper
1997A simple method to reduce thermomechanical stress in GaAs Assemblies including diamond heat spreaders and AuSn solders
Töpfer, M.; Kaulfersch, E.; Michel, B.; Reichl, H.
Conference Paper
1997Testing devices for well defined mechanical and thermal loading of microcomponents
Dost, M.; Dietrich, D.; Vogel, J.; Sommer, J.-P.; Großer, V.; Michel, B.
Conference Paper
1997Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Thermomechanical aspects of modular vertical integration technique (TB2GA)
Leutenbauer, R.; Großer, V.; Reichl, H.; Michel, B.
Conference Paper
1997Thermomechanical behaviour of chipcard materials
Michel, B.; Schubert, A.; Winkler, T.
Conference Paper
1997Thermomechanical simulation of advanced packages in spite of uncertain characteristics
Winkler, T.; Kaulfersch, E.; Schubert, A.; Michel, B.
Conference Paper
1997Verfahren zur Bestimmung von Abstaenden zwischen einkristallinen Prueflingen und flaechenhaften Detektionseinrichtungen fuer Roentgenstrahlung
Kaempfe, B.; Goldenbogen, S.; Michel, B.; Krause, F.; Diezko, R.H.
Patent
1997Verfahren zur Ermittlung von Materialkennwerten in mikroskopisch dimensionierten Prueflingsbereichen
Dost, M.; Kaempfe, B.; Kuehnert, R.; Michel, B.; Traenkner, K.
Patent
1997Verfahren zur feldmaessigen Bestimmung von Deformationszustaenden in mikroskopisch dimensionierten Prueflingsbereichen
Kuehnert, R.; Schubert, A.; Dost, M.; Vogel, D.; Kaempfe, B.; Michel, B.
Patent
1996Die Finite-Elemente Methode als Analysewerkzeug in der Mikrotechnik
Sommer, J.-P.; Dudek, R.; Michel, B.
Book Article
1996Mechanisch-thermische Zuverlässigkeit von Chipkarten
Schubert, A.; Dudek, R.; Faust, W.; Vogel, D.; Michel, B.; Reichl, H.
Book Article
1996MicroDAC - ein neues Verfahren zur quantitativen Mikroverformungsanalyse
Vogel, D.; Schubert, A.; Michel, B.
Book Article
1996Stress analysis using an area detector
Schubert, A.; Michel, B.; Kämpfe, B.
Conference Paper
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Bewertung der mechanischen Zuverlässigkeit mikrotechnischer Aufbauten mittels in-situ-Verformungsexperimenten im REM
Kühnert, R.; Tränkner, K.; Auersperg, J.; Michel, B.
Conference Paper
1995Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotechnischer Aufbauten
Michel, B.; Sommer, J.-P.; Krause, F.; Winkler, T.; Faust, W.
Conference Paper
1995Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
Michel, B.
Conference Paper
1995FEM-Anwendungen auf mechanisch-thermische Probleme in der Mikrotechnik
Auersperg, J.; Kaulfersch, E.; Dudek, R.; Michel, B.
Conference Paper
1995Laseroptische Analysen von Miniaturbauelementen
Bombach, C.; Großer, V.; Faust, W.; Michel, B.
Conference Paper
1995Laseroptische Verformungsmessungen an Mikroaufbauten
Großer, V.; Lindemann, G.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Measurement of thermal microdeformations in bumps
Kühnert, R.; Michel, B.
Conference Paper
1995Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B.
Book Article
1995Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Micro Materials, Micro Mat 1995. Abstracts
: Michel, B.; Winkler, T.
Conference Proceedings
1995Das MicroDAC-Verfahren - eine Methode zur quantitativen Verformungsbewertung von Mikrokomponenten im Rasterelektronenmikroskop
Michel, B.; Kühnert, R.
Conference Paper
1995Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1995Probalistische Methoden zur Charakterisierung mikrotechnischer Aufbauten
Winkler, T.; Michel, B.; Kaulfersch, E.
Conference Paper
1995Thermal and mechanical characterization of electronic packages in extremely high frequency applications by means of finite element analysis
Sommer, J.-P.; Dudek, R.; Michel, B.; Boheim, M.; Hager, W.
Conference Paper
1995Thermische Verformungsuntersuchungen an Polymer-Abdeckmassen für Si-Chips - Simulation Tauchlötvorgang
Grosser, V.; Vogel, D.; Bombach, C.; Dudek, R.; Michel, B.
Book Article
1995Thermomechanische Analysen mikrotechnischer Komponenten
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
1995Werkstoffmechanische Untersuchungen an Chipkarten
Vogel, D.; Schubert, A.; Faust, W.; Michel, B.; Reichl, H.
Conference Paper
1994Application of fracture machanics to micromechanics and microsystem technology
Michel, B.; Sommer, J.-P.; Großer, V.
Conference Paper
1994Application of solid mechanics in the fields of microelectronics and micro system technology
Michel, B.; Sommer, J.-P.
Conference Paper
1994Damage structures due to thermal fatigue - development of a stochastic simulation model
Winkler, T.; Kullig, E.; Oppermann, H.; Foit, A.; Michel, B.
Conference Paper
1994Evaluation of microdeformations and fracture quantities by means of micro moire methods
Michel, B.; Kühnert, R.
Conference Paper
1994Experimental and numerical deformation analysis on components of microsystem technology
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K.
Conference Paper
1994Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V.
Journal Article
1994Experimentelle und numerische Deformationsanalyse an Komponenten der Mikrosystemtechnik
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K.
Conference Paper
1994Fatigue crack evaluation in electronics
Michel, B.; Dost, M.
Conference Paper
1994Mechanische und thermische Zuverlässigkeit von Komponenten und Bauteilen der Mikrosystemtechnik
Michel, B.; Reichl, H.
Conference Paper
1994Mikrobaugruppen mechanisch prüfen
Michel, B.; Großer, V.
Journal Article
1994Mikroskopische Deformationsmessungen mittels Laserinterferometrie
Großer, V.; Bombach, C.; Auersperg, J.; Michel, B.
Conference Paper
1994Motion of oxygen in vanadium and niobium studied by nuclear magnetic resonance
Michel, B.; Kanert, O.; Günther, B.
Journal Article
1994Optical deformation analysis of surface mounted devices
Vogel, D.; Kaulfersch, E.; Dudek, R.; Michel, B.
Conference Paper
1994Quantitative Deformations- und Rißspitzenanalyse mittels Mikro-Moire-Technik im REM
Michel, B.; Kühnert, R.
Conference Paper
1994Residual stress analysis in components of microsystems
Schubert, A.; Michel, B.
Conference Paper
1994Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
Vogel, D.; Sommer, J.-P.; Michel, B.
Conference Paper
1994Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B.
Conference Paper
1994Werkstoffmechanische Untersuchungen von Komponenten der Mikrosystemtechnik
Michel, B.; Winkler, T.; Reichl, H.
Conference Paper
1994X-ray residual stress analysis in components of microsystem technology
Schubert, A.; Kämpfe, B.; Michel, B.
Conference Paper
1993Beanspruchung von Lötverbindungen oberflächenmontierter ICs in Abhängigkeit von der Pin-Form
Dudek, R.; Faust, W.; Michel, B.; Hartmann, H.J.
Conference Paper
1993Lasermeßtechnik für Mikroaktuatoren
Großer, V.; Michel, B.; Bombach, C.
Book Article
1993Physical and micromechanical aspects of stochastic fatigue crack growth
Michel, B.; Winkler, T.; Skurt, L.
Book Article
1993Prüfen des Verformungsverhaltens mikromechanischer Bauelemente mittels Lasermeßtechniken
Michel, B.; Großer, V.
Conference Paper
1993Qualitätskontrolle an mikromechanischen Bauteilen
Faust, W.; Michel, B.; Winkler, T.
Journal Article
1993SPY - a modular specklephotographic measurement system for micro-mechanics purposes
Vogel, D.; Kaulfersch, E.; Michel, B.
Conference Paper
1993Untersuchungen zum lokalen Deformationsverhalten in der Rißspitzenumgebung mit laseroptischen und elektronenmikroskopischen Feldmeßverfahren
Michel, B.; Vogel, D.; Kühnert, R.
Conference Paper
1993X-ray analysis of residual stress gradients and textures in thin coatings
Schubert, A.; Kämpfe, B.; Auerswald, E.; Michel, B.
Conference Paper
1993Zur Anwendbarkeit festkörpermechanischer Modelle im Bereich der Mikroelektronik
Michel, B.; Winkler, T.
Conference Paper
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 1
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 2
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article
1991Investigation of self-diffusion in nanocrystalline copper by NMR.
Dickenscheid, W.; Birringer, R.; Gleiter, H.; Kanert, O.; Michel, B.; Günther, B.
Journal Article
1988Atomic motion of copper in solid Au-xCu alloys studied by nuclear magentic resonance.
Hackmann, A.; Kanert, O.; Kolem, H.; Michel, B.; Günther, B.
Journal Article
1987Diffusion-investigations in solid Au-Cu alloys.
Kanert, O.; Kolem, H.; Hackmann, A.; Michel, B.; Guenther, B.
Abstract