Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M.
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper