Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Information and communication technologies for promoting and sustaining quality of life, health and self-sufficiency in ageing societies - outcomes of the Lower Saxony Research Network Design of Environments for Ageing (GAL)
Haux, R.; Hein, A.; Kolb, G.; Künemund, H.; Eichelberg, M.; Appell, J.-E.; Appelrath, H.-J.; Bartsch, C.; Bauer, J.M.; Becker, M.; Bente, P.; Bitzer, J.; Boll, S.; Büsching, F.; Dasenbrock, L.; Deparade, R.; Depner, D.; Elbers, K.; Fachinger, U.; Felber, J.; Feldwieser, F.; Forberg, A.; Gietzelt, M.; Goetze, S.; Gövercin, M.; Helmer, A.; Herzke, T.; Hesselmann, T.; Heuten, W.; Huber, R.; Hülsken-Giesler, M.; Jacobs, G.; Kalbe, E.; Kerling, A.; Klingeberg, T.; Költzsch, Y.; Lammel-Polchau, C.; Ludwig, W.; Marschollek, M.; Martens, B.; Meis, M.; Meyer, E.M.; Meyer, J.; Meyer zu Schwabedissen, H.; Moritz, N.; Müller, H.; Nebel, W.; Neyer, F.J.; Okken, P.-K.; Rahe, J.; Remmers, H.; Rölker-Denker, L.; Schilling, M.; Schöpke, B.; Schröder, J.; Schulze, G.C.; Schulze, M.; Siltmann, S.; Song, B.; Spehr, J.; Steen, E.-E.; Steinhagen-Thiessen, E.; Tanschus, N.-M.; Tegtbur, U.; Thiel, A.; Thoben, W.; Hengel, P. van; Wabnik, S.; Wegel, S.; Wilken, O.; Winkelbach, S.; Wist, T.; Wolf, K.-H.; Wolf, L.; Zokoll-van
Journal Article
2007Inkjettable conductive adhesive for use in microelectronics and microsystems technology
Kolbe, J.; Arp, A.; Calderone, F.; Meyer, E.M.; Meyer, W.; Schäfer, H.; Stuve, M.
Journal Article
2006A novel conductive adhesive for use in microelectronics and microsystems by ink jet technology
Kolbe, J.; Arp, A.; Calderone, F.; Meyer, E.M.; Meyer, W.; Schäfer, H.; Stuve, M.
Conference Paper
2005Adhesive and Conductive - Inkjettable nano-filled inks for use in microelectronics and microsystems technology
Meyer, E.M.; Arp, A.; Calderone, F.; Kolbe, J.; Meyer, W.; Schaefer, H.; Stuve, M.
Conference Paper
2005Inkjettable conductive adhesive for use in microelectronics and microsystems technology
Kolbe, J.; Arp, A.; Calderone, F.; Meyer, E.M.; Meyer, W.; Schaefer, H.; Stuve, M.
Conference Paper
2001Ultrananocrystalline diamond thin-films for MEMS and moving mechanical assembly devices
Krauss, A.R.; Auciello, O.; Gruen, D.M.; Jayatissa, A.; Sumant, A.; Tucek, J.; Mancini, D.C.; Moldovan, N.; Erdemir, A.; Ersoy, D.; Gardos, M.N.; Busmann, H.G.; Meyer, E.M.; Ding, M.Q.
Journal Article
2000Two- and three-dimensional ultrananocrystalline diamond (UNCD) structures for a high resolution diamond-based MEMS technology
Auciello, O.; Krauss, A.R.; Gruen, D.M.; Meyer, E.M.; Busmann, H.G.; Tucek, J.; Sumant, A.; Jayatissa, A.; Moldovan, N.; Mancini, D.C.; Gardos, M.N.
Conference Paper