Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics
Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten
Conference Paper
2018Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Journal Article
2018Experimental Verification of FE-Models for Thermo-Mechanical Loading using Digital Image Correlation
Schwerz, Robert; Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen
Conference Paper
2018Heat haze effects in thermal chamber tensile tests on digital image correlation
Yuile, Adam; Schwerz, Robert; Röllig, Mike; Metasch, René; Wiese, Steffen
Conference Paper
2018Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints
Metasch, René; Röllig, Mike; Naumann, Uwe; Wiesenhütter, Felix; Kaufmann, R.
Conference Paper
2018Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Conference Paper
2018Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Metasch, René; Meier, Karsten; Röllig, Mike
Conference Paper
2018Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Journal Article
2017Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Conference Paper
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Conference Paper
2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Conference Paper
2017Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Conference Paper
2016Entwicklung einer Pro-aktiven Lötstellengeometrie-unabhängigen Lebensdauersimulation für bleifrei Lote
Metais, Benjamin; Kabakchiev, Alexander; Guyenot, Michael; Metasch, René; Röllig, Mike; Buhl, Patrick; Weihe, Stefan
Conference Paper
2016Messverfahren zur thermo-mechanischen Charakterisierung von Werkstoffen der Hochtemperatur-AVT
Metasch, René; Klemm, Alexander; Röllig, Mike; Zerna, Thomas
Conference Paper
2015A viscoplastic-fatigue-creep damage model for tin-based solder alloy
Metais, Benjamin; Kabakchiev, Alexander; Maniar, Youssef; Guyenot, Michael; Metasch, René; Röllig, Mike; Rettenmeier, Philipp; Buhl, Patrick; Weihe, Stefan
Conference Paper
2014Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for finite element calculations
Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Guyenot, Michael; Buhl, P.; Hossfeld, M.; Metasch, René; Röllig, Mike
Conference Paper
2014Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen
Conference Paper
2014Filter-based interrogation of fiber bragg grating sensors
Wuchrer, Roland; Lautenschläger, Harald; Metasch, René; Röllig, Mike; Fleischer, Thomas; Härtling, Thomas
Conference Paper
2014Zuverlässigkeitsbewertung von elektrischen und mechanischen Verbindungen mit dem iQPro-Demonstrator
Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Conference Paper