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| 2010 | Silicon-interposer with high density Cu-filled TSVs
Wieland, R.; Zoschke, K.; Jürgensen, N.; Merkel, R.; Nebrich, L.; Wolf, J. | Conference Paper |
| 2007 | 3D system integration
Klumpp, A.; Merkel, R.; Ramm, P.; Wieland, R. | Conference Paper |
| 2007 | 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P. | Conference Paper |
| 2005 | 3D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P. | Conference Paper, Journal Article |
| 2005 | In situ defect etching of strained-Si layers with HCl gas
Kreuzer, S.; Bensch, F.; Merkel, R.; Vogg, G. | Conference Paper, Journal Article |
| 2005 | Strain stabilization of SiGe films on Si(001) by in situ pre-epitaxial HCL etching
Vogg, G.; Bensch, F.; Kreuzer, S.; Merkel, R. | Conference Paper, Journal Article |
| 2004 | Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding
Klumpp, A.; Merkel, R.; Ramm, P.; Weber, J.; Wieland, R. | Journal Article |
| 2004 | Vertical System Integration Technology for High Speed Applications by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding
Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Elst, G.; Ramm, P. | Book Article |
| 2003 | 3D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J. | Conference Paper |
| 2003 | Chip-to-wafer stacking technology for 3D system integration
Klumpp, A.; Merkel, R.; Wieland, R.; Ramm, P. | Conference Paper |
| 1997 | Conformal copper deposition in deep trenches
Bollmann, D.; Merkel, R.; Klumpp, A. | Journal Article |