Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021IC package related stress effects on the characteristics of ring oscillator circuits
Schlipf, Simon; Sander, Christoph; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Conference Paper
2021Piezoresistive characteristics of MOSFET channels determined with indentation
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Journal Article
2021Stress-induced transistor degradation studied by an indentation approach
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Journal Article
2020FEM-study for solder model comparison on solder joints stress-strain effects
Schwerz, Robert; Metasch, René; Röllig, Mike; Meier, Karsten
Conference Paper
2020Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Conference Paper
2019Analysis of flip-chip solder joints under isothermal vibration loading
Meier, Karsten; Leslie, David; Dasgupta, Abhijit; Röllig, Mike; Bock, Karlheinz
Conference Paper
2019Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics
Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten
Conference Paper
2018Developments for highly reliable electronics - experiments on combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2018Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Journal Article
2018Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Conference Paper
2018Solder joint fatigue analysis under combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.
Conference Paper
2018Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Metasch, René; Meier, Karsten; Röllig, Mike
Conference Paper
2017Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Conference Paper
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Conference Paper
2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Conference Paper
2016Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2014Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen
Conference Paper
2014Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Wolter, Klaus-Jürgen; Röllig, Mike; Schießl, Andreas
Journal Article
2014Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2014Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2013Determination of the life-time of solder joints under temperature and vibration loadings
Meier, Karsten; Röllig, Mike; Lautenschlaeger, Georg; Schießl, Andreas; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Conference Paper