Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Life Cycle Cost Reduction and Market Acceleration for New Nearly Zero-energy Buildings
Weiß, T.; Pernetti, R.; Garzia, F.; Köhler, B.; Stobbe, M.; Meier, K.; Berggren, B.
Conference Paper
2019Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics
Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten
Conference Paper
2018Developments for highly reliable electronics - experiments on combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2018Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Journal Article
2018Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Journal Article
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018Laser Ultrasound as a tool for the characterisation of electromagnetic welded joints
Hofer, Christian; Meier, Klarissa; Psyk, Verena; Faes, Koen; Scherleitner, Edgar; Reitinger, Bernhard
Presentation
2018Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Conference Paper
2018Solder joint fatigue analysis under combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.
Conference Paper
2018Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Metasch, René; Meier, Karsten; Röllig, Mike
Conference Paper
2017Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Conference Paper
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Conference Paper
2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Conference Paper
2016Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2014Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen
Conference Paper
2014Here's looking at you, player: The potential of eye tracking analysis for player-centered learning game design
Friedemann, S.; Meier, K.; Jantke, K.P.
Conference Paper
2014In situ cell retention of a CHO culture by a reverse-flow diafiltration membrane bioreactor
Meier, K.; Djeljadini, S.; Regestein, L.; Büchs, J.; Carstensen, F.; Wessling, M.; Holland, T.; Raven, N.
Journal Article
2014Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Wolter, Klaus-Jürgen; Röllig, Mike; Schießl, Andreas
Journal Article
2014Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2014Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2013Determination of the life-time of solder joints under temperature and vibration loadings
Meier, Karsten; Röllig, Mike; Lautenschlaeger, Georg; Schießl, Andreas; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Conference Paper
2013The effect of Cu and Ag on the yielding behaviour of lead-free solders at high strain rates
Meier, K.; Roellig, M.; Wolter, K.-J.
Conference Paper
2013Evaluation of embedded IC approach for automotive application
Schwerz, R.; Meier, K.; Roellig, M.; Schiessl, A.; Schingale, A.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2013Lifetime assessment for bipolar components under vibration and temperature loading
Meier, K.; Roellig, M.; Lautenschlaeger, G.; Schiessl, A.; Wolter, K.-J.
Conference Paper
2013Novel quick predict approach for identification of critical loadings in electronic components on PCB under vibration realized as design support tool
Roellig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.
Conference Paper
2012Characterisation of lead-free solders at high strain rates considering microstructural conditions
Meier, K.; Kraemer, F.; Roellig, M.; Wolter, K.-J.
Conference Paper
2012FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S.
Conference Paper
2012Lifetime assessment of BGA solder joints with voids under thermo-mechanical load
Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.
Conference Paper
2012Process optimization and biocompatibility of cell carriers suitable for automated magnetic manipulation
Krejci, I.; Piana, C.; Howitz, S.; Wegener, T.; Fiedler, S.; Zwanzig, M.; Schmitt, D.; Daum, N.; Meier, K.; Lehr, C.M.; Batista, U.; Zemljic, S.; Messerschmidt, J.; Franzke, J.; Wirth, M.; Gabor, F.
Journal Article
2012Thermo-mechanical characterization and modeling of TSV annealing behavior
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig, M.; Boettcher, M.; Wolter, K.J.
Conference Paper
2011Determination of thermal and mechanical properties of packaging materials for the use in FEM-simulations
Röllig, M.; Böhme, B.; Meier, K.; Metasch, R.
Conference Paper
2011Finite element modeling on thermal fatigue of BGA solder joints with multiple voids
Schwerz, R.; Meyer, S.; Roellig, M.; Meier, K.; Wolter, K.-J.
Conference Paper
2011Life time prediction for lead-free solder joints under vibration loads
Meier, K.; Röllig, M.; Schiessl, A.; Wolter, K.-J.
Conference Paper
2010Characterisation of the mechanical behaviour of SAC solder at high strain rates
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder
Roellig, M.; Metasch, R.; Meier, K.; Alt, F.
Conference Paper
2010Mechanical behaviour of typical lead-free solders at high strain rate conditions
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Mechanical solder characterisation under high strain rate conditions
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010A novel in-situ force measurement method for real solder joints fatigue
Röllig, M.; Metasch, R.; Meier, K.
Conference Paper
2010Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Time and temperature dependent micromechanical properties of solder joints for 3D-package integration
Roellig, M.; Meier, K.; Metasch, R.
Conference Paper
2009Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2009Mechanical characterisation of Lead free solder alloys under high strain rate loads
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Conference Paper
1960Zur Bestimmung des Harnstoff- und Melaminharzgehaltes von Holzspanplatten
Klauditz, W.; Meier, K.
Journal Article