Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Conference Paper
2016An integrated metagenome and -proteome analysis of the microbial community residing in a biogas production plant
Ortseifen, V.; Stolze, Y.; Maus, I.; Sczyrba, A.; Bremges, A.; Albaum, S.P.; Jaenicke, S.; Fracowiak, J.; Pühler, A.; Schlüter, A.
Journal Article
2014Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B.
Conference Paper
2014Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B.
Conference Paper
2014Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B.
Book Article
2013Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Maus, I.; Pape, H.; Nabi, H.; Michel, B.; Wunderle, B.
Conference Paper
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.
Conference Paper
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.
Conference Paper
2012Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.
Conference Paper
2011Fracture mechanical test methods for interface crack evaluation of electronic packages
Keller, J.; Maus, I.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Journal Article, Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B.
Conference Paper
2010Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B.
Conference Paper
2010fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B.
Conference Paper
2010Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2010Interfacial fracture parameters of silicon-to-molding compound
Schlottig, G.; Maus, I.; Walter, H.; Jansen, K.M.B.; Pape, H.; Wunderle, B.; Ernst, L.J.
Conference Paper
2010Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B.
Conference Paper