Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Conference Paper
2012Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Conference Paper
2010Micro structure analysis for system in package components - novel tools for fault isolation, target preparation, and high-resolution material diagnostics
Petzold, M.; Altmann, F.; Krause, M.; Salzer, R.; Schmidt, C.; Martens, S.; Mack, W.; Dömer, H.; Nowodzinski, A.
Conference Paper
2004Ion beam polishing for embedded cross-sections and its advantages for FESEM analysis in electronic packaging
Mack, W.; Seidl, B.; Fischer, R.; Ort, T.; Walter, J.; Grünewald, J.; Berthold, L.; Petzold, M.
Conference Paper