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| 2020 | Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger | Conference Paper |
| 2019 | Investigation of mechanical and microstructural properties of a new, corrosion resistant gold-palladium coated copper bond wire
Lorenz, G.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T. | Conference Paper |
| 2019 | Micro-Transfer-Printing and Potential Process Optimizations by FEA
Bühler, K.; Lorenz, G.; Mittag, M.; Krieger, U.; Heise, N.; Wicht, S.; Gerbach, R.; Naumann, F. | Conference Paper |
| 2019 | Synthesis of soft polysiloxane-urea elastomers for intraocular lens application
Riehle, Natascha; Thude, Sibylle; Kandelbauer, Andreas; Tovar, Günter; Lorenz, Günter | Journal Article |
| 2018 | Data on the synthesis and mechanical characterization of polysiloxane-based urea-elastomers prepared from amino-terminated polydimethylsiloxanes and polydimethyl-methyl-phenyl-siloxane-copolymers
Riehle, Natascha; Götz, Tobias; Kandelbauer, Andreas; Tovar, Günter; Lorenz, Günter | Journal Article |
| 2018 | Finite element study of chip package induced mechanical and corrosive failure modes complementing microstructural root cause analyses
Lorenz, G.; Simon-Najasek, M.; Lindner, A. | Conference Paper |
| 2018 | Influence of PDMS molecular weight on transparency and mechanical properties of soft polysiloxane-urea-elastomers for intraocular lens application
Riehle, Natascha; Thude, Sibylle; Götz, Tobias; Kandelbauer, Andreas; Thanos, Solon; Tovar, Günter; Lorenz, Günter | Journal Article |
| 2017 | The combined effect of mechanical package stress and humidity on chip corrosion probability
Lorenz, G.; Simon-Najasek, M.; Lindner, A. | Conference Paper |
| 2016 | Claudin-16 deficiency impairs tight junction function in ameloblasts, leading to abnormal enamel formation
Bardet, C.; Courson, F.; Wu, Y.; Khaddam, M.; Salmon, B.; Ribes, S.; Thumfart, J.; Yamaguti, P.M.; Rochefort, G.Y.; Figueres, M.L.; Breiderhoff, T.; Garcia-Castano, A.; Vallee, B.; Denmat, D. le; Baroukh, B.; Guilbert, T.; Schmitt, A.; Masse, J.M.; Bazin, D.; Lorenz, G.; Morawietz, M.; Hou, J.H.; Carvalho-Lobato, P.; Manzanares, M.C.; Fricain, J.C.; Talmud, D.; Demontis, R.; Neves, F.; Zenaty, D.; Berdal, A.; Kiesow, A.; Petzold, M.; Menashi, S.; Linglart, A.; Acevedo, A.C.; Vargas-Poussou, R.; Müller, D.; Houillier, P.; Chaussain, C. | Journal Article |
| 2016 | Correlation of PVD deposition parameters with electrical and mechanical properties of coated thin-glass compounds
Lorenz, G.; Naumann, F.; Westphalen, J.; Weller, S.; Junghähnel, M. | Conference Paper |
| 2016 | Influence of thin-film properties on the reliability of flexible glass
Westphalen, J.; Junghähnel, M.; Weller, S.; Lorenz, G.; Naumann, F. | Conference Paper |
| 2016 | Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Simon-Najasek, M.; Lorenz, G.; Lindner, A.; Altmann, F. | Journal Article |
| 2014 | EMMPRIN/CD147 deficiency disturbs ameloblast-odontoblast cross-talk and delays enamel mineralization
Khaddam, M.; Huet, E.; Vallée, B.; Bensidhoum, M.; Denmat, D. le; Filatova, A.; Jimenez-Rojo, L.; Ribes, S.; Lorenz, G.; Morawietz, M.; Rochefort, G.Y.; Kiesow, A.; Mitsiadis, T.A.; Poliard, A.; Petzold, M.; Gabison, E.E.; Menashi, S.; Chaussain, C. | Journal Article |
| 2014 | Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M. | Conference Paper |
| 2014 | Mechanical characterization of bond wire materials in electronic devices at elevated temperatures
Lorenz, G.; Naumann, F.; Mittag, M.; Petzold, M. | Conference Paper |
| 2013 | Determination of hardness and Young's modulus for important III-V compound semiconductors
Klinger, V.; Roesener, T.; Lorenz, G.; Petzold, M.; Dimroth, F. | Journal Article |
| 2013 | Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M. | Conference Paper |
| 2012 | Characterizing the chip damage potential during wafer probing of highly integrated devices
Lorenz, G.; Stephan, T.; Petzold, M. | Conference Paper |
| 2012 | Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M. | Conference Paper, Journal Article |
| 2012 | Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M. | Conference Paper |
| 2012 | Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H. | Conference Paper |
| 2011 | Analysis of chip damage risk in thermosonic wire bonding
Dresbach, C.; Lorenz, G.; Petzold, M.; Altenbach, H. | Conference Paper |
| 2010 | Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
Lorenz, G.; Petzold, M.; Mittag, M.; Dresbach, C.; Milke, E. | Conference Paper |
| 2010 | Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding
Bennemann, S.; Dresbach, C.; Lorenz, G.; Berthold, L.; Petzold, M. | Conference Paper |
| 2009 | Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Dresbach, C.; Lorenz, G.; Mittag, M.; Petzold, M.; Milke, E.; Müller, T. | Conference Paper |
| 2000 | Modellierung und Simulation in der Mikrosystemtechnik
Neul, R.; Lorenz, G.; Dickmann, S.; Becker, U.; Haase, J.; Reitz, S.; Schwarz, P.; Schreiber, U.; Uhlig, A. | Conference Paper |
| 1998 | A modeling approach to include mechanical microsystem components into the system simulation
Neul, R.; Becker, U.; Lorenz, G.; Schwarz, P.; Haase, J.; Wünsche, S. | Conference Paper |
| 1997 | Netzwerk- und Verhaltensmodellierung eines mikromechanischen Beschleunigungssensors
Haase, J.; Reitz, S.; Wünsche, S.; Schwarz, P.; Becker, U.; Lorenz, G.; Neul, R. | Conference Paper |