Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Facile and efficient atomic hydrogenation enabled black TiO₂ with enhanced photo‐electrochemical activity via a favorably low‐energy‐barrier pathway
Wang, X.; Mayrhofer, L.; Höfer, M.; Estrade, S.; Lopez-Conesa, L.; Zhou, H.; Lin, Y.; Peiró, F.; Fan, Z.; Shen, H.; Schäfer, L.; Moseler, M.; Bräuer, G.; Waag, A.
Journal Article
2017Development of bond-order potentials for BCC transition metals
Vitek, V.; Lin, Y.-S.; Mrovec, M.
Conference Paper
2017Enhanced photoelectrochemical behavior of H-TiO₂ nanorods hydrogenated by controlled and local rapid thermal annealing
Wang, X.; Estrade, S.; Lin, Y.; Yu, F.; Lopez-Conesa, L.; Zhou, H.; Gurram, S.K.; Peiro, F.; Fan, Z.; Shen, H.; Schäfer, L.; Bräuer, G.; Waag, A.
Journal Article
2016Bond-order potential for magnetic body-centered-cubic iron and its transferability
Lin, Y.-S.; Mrovec, M.; Vitek, V.
Journal Article
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Conference Paper
2015Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2015Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W.
Journal Article
2015On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M.
Journal Article
2015Synthesis of novel nanodiamonds - gold core shell nanoparticles
Minati, L.; Cheng, C.L.; Lin, Y.C; Hees, J.; Lewes-Malandrakis, G.; Nebel, C.E.; Benetti, F.; Migliaresi, C.; Speranza, G.
Journal Article
2014Efficient combination of topology and parameter optimization
Lin, Yusheng; Sun, Zheng; Dadalau, Alexandru; Verl, Alexander
Journal Article
2014Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.
Conference Paper
2014A new method for development of bond-order potentials for transition bcc metals
Lin, Y.-S.; Mrovec, M; Vitek, V.
Journal Article
2013Changes in the structural dimensionality of selenidostannates in ionic liquids: Formation, structures, stability, and photoconductivity
Lin, Y.; Xie, D.; Massa, W.; Mayrhofer, L.; Lippert, S.; Ewers, B.; Chernikov, A.; Koch, M.; Dehnen, S.
Journal Article
2013Design and simulation of nanomaterial-enhanced LTCC integrated inductors
Lin, Y.-C.; Gabler, F.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013Integration and fabrication of PZT and metallic glass films for micro-mirror device
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF system
Lin, Y.-C.; Gabler, F.; Tsai, Y.-C.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2013Metallic glass micro-mirror integrated with PZT actuation for low resonant frequency and large exciting angle
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013Nanoporous gold for MEMS packing applications
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Journal Article
2012Fabrication of freestanding Pb(Zr,Ti)O film microstructures using Ge sacrificial layer
Lee, J.-W.; Kawai, Y.; Tanaka, S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2012Guidelines for the use and interpretation of assays for monitoring autophagy
Klionsky, D.J.; Abdalla, F.C.; Abeliovich, H.; Abraham, R.T.; Acevedo-Arozena, A.; Adeli, K.; Agholme, L.; Agnello, M.; Agostinis, P.; Aguirre-Ghiso, J.A.; Ahn, H.J.; Ait-Mohamed, O.; Ait-Si-Ali, S.; Akematsu, T.; Akira, S.; Al-Younes, H.M.; Al-Zeer, M.A.; Albert, M.L.; Albin, R.L.; Alegre-Abarrategui, J.; Aleo, M.F.; Alirezaei, M.; Almasan, A.; Almonte-Becerril, M.; Amano, A.; Amaravadi, R.; Amarnath, S.; Amer, A.O.; Andrieu-Abadie, N.; Anantharam, V.; Ann, D.K.; Anoopkumar-Dukie, S.; Aoki, H.; Apostolova, N.; Arancia, G.; Aris, J.P.; Asanuma, K.; Asare, N.Y.O.; Ashida, H.; Askanas, V.; Askew, D.S.; Auberger, P.; Baba, M.; Backues, S.K.; Baehrecke, E.H.; Bahr, B.A.; Bai, X.-Y.; Bailly, Y.; Baiocchi, R.; Baldini, G.; Balduini, W.; Ballabio, A.; Bamber, B.A.; Bampton, E.T.W.; Bánhegyi, G.; Bartholomew, C.R.; Bassham, D.C.; Bast Jr., R.C.; Batoko, H.; Bay, B.-H.; Beau, I.; Béchet, D.M.; Begley, T.J.; Behl, C.; Behrends, C.; Bekri, S.; Bellaire, B.; Bendall, L.J.; Benetti, L.; Berliocchi, L.; Bernardi,
Journal Article
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Journal Article
2012RIE patterning technology of Zr-based metallic glass for MEMS devices fabrication
Tsai, Y.-C.; Lin, Y.-C.; Abe, T.; Esashi, M.; Gessner, T.
Conference Paper
2012Substrate bonding at low temperature by using plasma activated porous gold
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Conference Paper
2011Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Conference Paper
2011Development of the large scanning mirror using Fe-based metallic glass ribbon
Lee, J.-W.; Lin, Y.-C.; Chen, N.; Louzguine, D.V.; Esashi, M.; Gessner, T.
Journal Article
2011Development of the micro-mirror with large scaning angle using FE-based metallic glass thin film
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2011Micromirror with large-tilting angle using Fe-based metallic glass
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Makino, A.; Inoue, A.; Esashi, M.; Gessner, T.
Journal Article
2011ZR-based metallic glass as a novel MEMS bonding material
Lin, Y.-C.; Froemel, J.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2010Fabrication of metal-based nanoporous structures
Lin, Y.-C.; Chen, P.-C.; Chen, L.Y.; Chen, M.W.; Esashi, M.; Gessner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010NEMS/MEMS and passive components integration by using novel LTCC substrate
Frömel, J.; Lin, Y.; Mori, M.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2009Capacitive coupled TLP (CC-TLP) and the correlation with the CDM
Wolf, H.; Gieser, H.; Bock, K.; Duvvury, C.; Jahanzeb, A.; Lin, Y.-Y.
Conference Paper
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2008Overview of BioCreative II gene mention recognition
Smith, L.; Tanabe, L.K.; Johnson nee Ando, R.; Juo, C.-J.; Chung, I.-F.; Hsu, C.-N.; Lin, Y.-S.; Klinger, R.; Friedrich, C.M.; Ganchev, K.; Torii, M.; Liu, H.; Haddow, B.; Struble, C.A.; Povinelli, R.J.; Vlachos, A.; Baumgartner, W.A.; Hunter, L.; Carpenter, B.; Tsai, R.T.; Dai, H.J.; Liu, F.; Chen, Y.; Sun, C.; Katrenko, S.; Adriaans, P.; Blaschke, C.; Torres Perez, R.; Neves, M.; Nakov, P.; Divoli, A.; Mana, M.; Mata-Vazquez, J.; Wilbur, J.
Journal Article, Conference Paper
2007Multirate systems and applications
Lin, Y.-P.; Phoong, S.-M.; Selesnick, I.; Oraintara, S.; Schuller, G.
Journal Article
2001Exponential prediction models based on sequence operators
Sydow, A.; Lin, Y.; Liu, S.F.; Denu, R.; Mennell, W.
Journal Article