Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Co-MOCVD processed seed layer for through silicon via copper metallization
Esmaeili, S.; Lilienthal, K.; Nagy, N.; Gerlich, L.; Krause, R.; Uhlig, B.
Journal Article
2019Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications
Liang, J.; Chen, R.; Ramos, R.; Lee, J.; Okuno, H.; Kalita, D.; Georgiev, V.; Berrada, S.; Sadi, T.; Uhlig, B.; Lilienthal, K.; Dhavamani, A.; Könemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Asenov, A.; Dijon, J.; Todri-Sanial, A.
Journal Article
2018Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
Uhlig, B.; Dhavamani, A.; Nagy, N.; Lilienthal, K.; Liske, R.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Lee, J.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Koenemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Liang, J.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.
Conference Paper
2018A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects
Liang, J.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Renaud, D.; Lee, J.; Georgiev, V.P.; Berrada, S.; Sadi, T.; Asenov, A.; Uhlig, B.; Lilienthal, K.; Dhavamani, A.; Könemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Teo, K.; Pandey, R.R.; Todri-Sanial, A.
Conference Paper
2018Understanding Electromigration in Cu-CNT Composite Interconnects
Lee, J.; Berrada, S.; Adamu-Lema, F.; Nagy, N.; Georgiev, V.P.; Sadi, T.; Liang, J.; Ramos, R.; Carrillo-Nunez, H.; Kalita, D.; Lilienthal, K.; Wislicenus, M.; Pandey, R.; Chen, B.; Teo, K.B.K.; Goncalves, G.; Okuno, H.; Uhlig, B.; Todri-Sanial, A.; Dijon, J.; Asenov, A.
Journal Article
2017The fabrication of copper-carbon nanotube composites for global interconnects
Nagy, Nicole; Lilienthal, Katharina; Uhlig, Benjamin
Poster
2017Herstellung und Messung von elektrischen Teststrukturen zur Untersuchung von Elektromigration in Kupfer-CNT-Kompositen
Makus, Steffen
: Lilienthal, Katharina (Betreuer)
Master Thesis
2017Novel TSV metallization and simplified ECD processes for ultra-large scale integration (ULSI) technology
Esmaeili Dehkalani, M. Sajjad
: Lilienthal, Katharina (Betreuer); Adelung, Rainer (Betreuer)
Master Thesis
2017A survey of carbon nanotube interconnects for energy efficient integrated circuits
Todri-Sanial, A.; Ramos, R.; Okuno, H.; Dijon, J.; Dhavamani, A.; Wislicenus, M.; Lilienthal, K.; Uhlig, B.; Sadi, T.; Georgiev, V.; Asenov, A.; Amoroso, S.; Pender, A.; Brown, A.; Millar, C.; Motzfeld, F.; Gotsmann, B.; Liang, J.; Goncalves, G.; Rupesinghe, N.; Teo, K.
Journal Article
2016A novel 384-multiwell microelectrode array for the impedimetric monitoring of Tau protein induced neurodegenerative processes
Jahnke, Heinz-Georg; Krinke, Dana; Seidel, Diana; Lilienthal, Katharina; Schmidt, Sabine; Azendorf, Ronny; Fischer, Michael; Mack, Till; Striggow, Frank; Althaus, Holger; Schober, Andreas; Robitzki, Andrea
Journal Article