Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018TLS-dicing for SiC - Latest assessment results
Lewke, D.; Cerezuela Barreto, M.; Dohnke, K.; Zühlke, H.-U.; Belgardt, C.; Schellenberger, M.
Conference Paper
2017Raman micro-spectroscopy as a non-destructive key analysis tool in current power semiconductor manufacturing
Biasio, M. de; Kraft, M.; Geier, E.; Goller, B.; Bergmann, C.; Esteve, R.; Cerezuela-Barreto, M.; Lewke, D.; Schellenberger, M.; Roesner, M.
Conference Paper
2017Verfahren zur Überprüfung eines Trennschrittes bei der Zerteilung eines flachen Werkstückes in Teilstücke
Tobisch, Alexander; Schellenberger, Martin; Lewke, Dirk
Patent
2016Direct optical stress sensing in semiconductor manufacturing using raman micro-spectrometry
Biasio, M. de; Kraft, M.; Roesner, M.; Bergmann, C.; Cerezuela-Barreto, M.; Lewke, D.; Schellenberger, M.
Conference Paper
2015Comparison of different novel chip separation methods for 4H-SiC
Dohnke, K.O.; Kaspar, K.; Lewke, D.
Conference Paper
2015Nachbearbeitung von teilgetrennten Bauelementen in der Halbleitertechnik
Lewke, Dirk; Schellenberger, Martin
Study
2015Thermal laser separation - a novel dicing technology fulfilling the demands of volume manufacturing of 4H-SiC devices
Lewke, D.; Dohnke, K.O.; Zühlke, H.U.; Cerezuela Barret, M.; Schellenberger, M.; Bauer, A.; Ryssel, H.
Conference Paper
2015Verfahren und Vorrichtung zur Trennung einews flachen Werkstücks in mehrere Teilstücke
Zühlke, Hans-Ulrich; Koitzsch, Matthias; Lewke, Dirk; Tobisch, Alexander
Patent
2014Automated tool for measuring nanotopography of 300 mm wafers at early stages of wafer production
Tröger, B.; Mühlig, A.; Fries, T.; Bauer, S.; Wihr, H.; Riedel, F.; Lewke, D.; Schellenberger, M.
Conference Paper
2014High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using thermal laser separation
Lewke, D.; Koitzsch, M.; Dohnke, K.O.; Schellenberger, M.; Zuehlke, H.-U.; Rupp, R.; Pfitzner, L.; Ryssel, H.
Conference Paper
2013Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment. Results from European collaborative SEAL project
Le Barillec, Olivier; Davenet, Magali; Bellet, B.; Koitzsch, Matthias; Lewke, Dirk; Schellenberger, Martin; Zühlke, Hans-Ulrich
Conference Paper
2013Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images
Lewke, D.; Schellenberger, M.; Pfitzner, L.; Fries, T.; Tröger, B.; Muehlig, A.; Riedel, F.; Bauer, S.; Wihr, H.
Conference Paper
2013Improving electric behavior and simplifying production of Si-based diodes by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Kolb, R.; Zühlke, H.-U.
Conference Paper
2013Verfahren und Vorrichtung zum parallelen Trennen eines Werkstücks in mehrere Teilstücke
Lorenz, Jürgen; Koitzsch, Matthias; Schellenberger, Martin; Lewke, Dirk; Gumprecht, Thomas
Patent
2012Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke Hans-Ulrich
Conference Paper
2012Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Zühlke, H.U.
Conference Paper
2012Stationsanordnung zur Bearbeitung und/oder Vermessen von Halbleiterscheiben sowie Bearbeitungsverfahren
Schellenberger, Martin; Lewke, Dirk
Patent
2012Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells
Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich
Conference Paper
2012Thermal laser separation and its applications
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article
2011A virtual equipment as a test bench for evaluating virtual metrology algorithms
Mattes, Andreas; Koitzsch, Matthias; Lewke, Dirk; Müller-Zell, Michael; Schellenberger, Martin
Conference Paper
2011Virtual equipment. A test bench for virtual metrology algorithms
Mattes, Andreas; Lewke, Dirk; Schellenberger, Martin
Presentation