Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2001Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000MEMS Modular Packaging and Interfaces
Schünemann, M.; Jam, A.K.; Großer, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.
Conference Paper
2000Modularized Microelectromechanical Systems
Bauer, G.; Schünemann, M.; Schäfer, W.; Großer, V.; Leutenbauer, R.
Conference Paper
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
1999Gehaeuse zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung
Azdasht, G.; Leutenbauer, R.; Oppermann, H.
Patent
1999A highly flexible design and production framework for modularized microelectromechanical systems
Schünemann, M.; Grosser, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.
Journal Article
1998Baukastensystem Mikrosystemtechnik
Schünemann, M.; Bauer, G.; Schäfer, W.; Reichl, H.; Großer, V.; Leutenbauer, R.
Journal Article
1998Design and Application of Modular Microsystems
Schünemann, M.; Bauer, G.; Schäfer, W.; Leutenbauer, R.; Grosser, V.; Zoeppig, V.
Conference Paper
1998The Design methodology of 3D-HDI
Amiri Jam, K.; Leutenbauer, R.; Großer, V.; Simsek, A.; Reichl, H.
Conference Paper
1998The development of a LTCC top-bottom-BGA (TB-BGA)
Bechtold, F.; Leutenbauer, R.; Grosser, V.; Polzer, E.K.
Conference Paper
1998The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Schünemann, M.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998A highly flexible design and production framework for modularized microelectromechanical systems
Schünemann, M.; Grosser, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.
Conference Paper
1998Modulare Mikrosysteme aus dem Baukasten
Großer, V.; Schünemann, M.; Amiri Jam, K.; Leutenbauer, R.
Conference Paper
1998Modulare Mikrosysteme für kleine und mittlere Stückzahlen
Schünemann, M.; Bauer, G.; Schäfer, W.; Großer, V.; Leutenbauer, R.
Conference Paper
1998Modularization of Microsystems and Standardization of Interfaces
Schünemann, M.; Bauer, G.; Schäfer, W.; Leutenbauer, R.; Grosser, V.; Reichl, H.
Conference Paper
1998Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H.
Conference Paper
1997Modularized Microelectromechanical Devices as Key Components for Advanced Intelligent Autonomous Sensors and Control Systems
Schünemann, M.; Grosser, V.; Leutenbauer, R.; Matuscheck, P.; Schäfer, W.; Reichl, H.
Conference Paper
1997Thermomechanical aspects of modular vertical integration technique (TB2GA)
Leutenbauer, R.; Großer, V.; Reichl, H.; Michel, B.
Conference Paper
1995The development of a FC-BGA
Simon, J.; Chmiel, G.; Leutenbauer, R.; Reichl, H.
Conference Paper