Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Parylene Coatings in Power Electronic Modules
Diepgen, A.; Zimmermann, V.; Bayer, C.F.; Zhou, Y.; Forster, C.; Wilbers, P.; Leib, J.; Schletz, A.; Virtanen, S.; März, M.
Presentation
2018Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters
Yu, Zechun; Zeltner, Stefan; Boettcher, Norman; Rattmann, Gudrun; Leib, Jürgen; Bayer, Christoph Friedrich; Schletz, Andreas; Erlbacher, Tobias; Frey, Lothar
Presentation
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Conference Paper
2011Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
2010Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
2010Hermetic BSG thin film coatings for harsh environment applications
Maus, S.; Hansen, U.; Leib, J.; Toepper, M.
Conference Paper
2010Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Conference Paper
2010Tapered through-silicon-via interconnects for wafer-level packaging of sensor devices
Leib, J.; Bieck, F.; Hansen, U.; Looi, K.-K.; Ngo, H.-D.; Seidemann, V.; Shariff, D.; Studzinski, D.; Suthiwongsunthorn, N.; Tan, K.; Wilke, R.; Yam, K.-L.; Töpper, M.
Journal Article
2010Wafer-level glass capping with optical integration
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Conference Paper
2009A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
Maus, S.; Hansen, U.; Leib, J.; Töpper, M.
Conference Paper, Journal Article
2009Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
Hansen, U.; Maus, S.; Leib, J.; Töpper, M.
Conference Paper, Journal Article
2009Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
Hansen, U.; Leib, J.; Maus, S.; Gyenge, O.; Töpper, M.
Conference Paper
2009Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M.
Conference Paper
2007Wafer-level glass capping as drop-in for miniaturized, advanced optical COB packaging
Seidemann, V.; Gyenge, O.; Hansen, U.; Heuser, T.; Maus, S.; Mund, D.; Espertshuber, K.; Wilke, R.; Leib, J.
Conference Paper
2005Novel Hermetic WLP Technology using Low-Temperature Passivation
Töpper, M.; Leib, J.; Mund, D.
Conference Paper
2004Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates
Töpper, M.; Mund, D.; Leib, J.
Conference Paper