Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Conference Paper
2019Ultra-thin flexible interposer - a flexible hybrid integration approach to replace wire bonds
Yacoub-George, Erwin; Palavesam, Nagarajan; Hell, Waltraud; König, Martin; Faul, Robert; Landesberger, Christof; Kutter, Christof
Conference Paper
2018Dynamic Bending Reliability Analysis of Flexible Hybrid Integrated Chip-Foil Packages
Palavesam, Nagarajan; Yacoub-George, E.; Hell, W.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2018Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process
Bose, Indranil; Palavesam, Nagarajan; Hochreiter, Christian; Landesberger, Christof; Kutter, Christoph
Conference Paper
2018Novel chip embedding and interconnection technology for mm-wave System-in-Package (SiP) applications
Landesberger, Christof; Drost,, A.; Faul, R.; Hell, W.; Scherbaum, S.; Bonfert, D.; Ott, A.; Hotopan, R.; Böhnke, R.
Conference Paper
2018Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICs
Bose, I.R.; Palavesam, N.; Landesberger, C.; Kutter, C.
Book Article
2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph
Journal Article
2017New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"
Landesberger, Christof; Bose, Indranil; König, Martin; Kutter, Christoph
Conference Paper
2017Roll-to-Roll processed foil inlay as an electrostatic chuck for flexible thin semiconductor wafer handling
Bose, I.; Gest, P.; Landesberger, C.; Kutter, C.
Conference Paper
2017Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices
El Hasni, Akram; Pfirrmann, Stefan; Kolander, Anett; Yacoub-George, Erwin; König, Martin; Landesberger, Christof; Voigt, Anja; Grützner, Gabi; Schnakenberg, Uwe
Journal Article
2016Mechanical reliability analysis of ultra-thin chip-on-foil assemblies under different types of recurrent bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Conference Paper
2016Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.
Conference Paper
2016A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2016Thin chip foil packaging: An enabling technology for ultra-thin packages
Landesberger, C.; Palavesam, N.; Drost, A.; Hell, W.; Faul, R.; Kutter, C.
Journal Article
2016Vorrichtung mit Folie zum elektrostatischen Koppeln eines Substrates mit einem Substratträger
Landesberger, Christof
Patent
2015Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Conference Paper
2015Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2014Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
Landesberger, C.; Paschke, C.; Spöhrle, H.-P.; Bock, K.
Book Article
2014High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces
Landesberger, C.; Hiroshima, M.; Weber, J.; Bock, K.
Book Article
2014Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Bock, K.
Conference Paper
2014Multifunctional system integration in flexible substrates
Bock, K.; Yacoub-George, E.; Hell, W.; Drost, A.; Wolf, H.; Bollmann, D.; Landesberger, C.; Klink, G.; Gieser, H.; Kutter, C.
Conference Paper
2013Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz
Topak, E.; Choi, J.-Y.; Merkle, T.; Koch, S.; Saito, S.; Landesberger, C.; Faul, R.; Bock, K.
Conference Paper
2013Heterointegration technologies for high frequency modules based on film substrates
Bock, K.; Yacoub-George, E.; Wolf, H.; Landesberger, C.; Klink, G.; Gieser, H.
Conference Paper
2013A robustness study on self-alignment of thin-si dies using surface tension
Hiroshima, M.; Arita, K.; Haji, H.; Landesberger, C.; Bock, K.
Journal Article
2012Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration
Landesberger, C.; Scherbaum, S.; Weber, J.; Bock, K.; Hiroshima, M.; Oberhofer, B.
Conference Paper
2012Temporary bonding: Electrostatic
Landesberger, C.; Klumpp, A.; Bock, K.
Book Article
2011Influence of wafer grinding and etching techniques on the fracture strength of thin silicon substrates
Landesberger, C.; Paschke, C.; Bock, K.
Conference Paper
2011Large area multilayer foil assembly for flexible electronic systems
Yacoub-George, E.; Ohlander, A.; Meixner, L.; Bollmann, D.; Faul, R.; Landesberger, C.; Bock, K.
Conference Paper
2011Polymer opto-electronic-fluidic detection module on plastic film substrates
Ohlander, A.; Burghart, M.; Strohhöfer, C.; Bollmann, D.; Landesberger, C.; Klink, G.; Bock, K.
Conference Paper
2011Roll-to-roll hot embossing of microstructures
Velten, T.; Bauerfeld, F.; Schuck, H.; Scherbaum, S.; Landesberger, C.; Bock, K.
Conference Paper
2011Vorrichtung und Verfahren zum justierten Laminieren von folienbasierten Schaltungsträgern zur Herstellung von flexiblen, mehrlagigen Schaltungssubstraten
Yacoub-George, E.; Landesberger, C.
Patent
2010Mobile electrostatic carrier (MEC) evaluation for a GaAs wafer backside manufacturing process
Stieglauer, H.; Nösser, J.; Miller, A.; Lanz, M.; Öttlin, D.; Jonsson, G.; Behammer, D.; Landesberger, C.; Spöhrle, H.-P.; Bock, K.
Conference Paper
2010Roll-to-roll hot embossing of microstructures
Velten, T.; Bauerfeld, F.; Schuck, H.; Scherbaum, S.; Landesberger, C.; Bock, K.
Conference Paper
2010Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Landesberger, C.; Yacoub-George, E.; Hell, W.; Bock, K.
Conference Paper
2010Substrate handling techniques for thin wafer processing
Landesberger, C.; Scherbaum, S.; Bock, K.
Book Article
2010Ultra-thin wafer fabrication through dicing-by-thinning
Landesberger, C.; Scherbaum, S.; Bock, K.
Book Article
2010Verfahren zum Herstellen eines Chip-Package und Chip-Package
Landesberger, C.; Faul, R.
Patent
2009Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates
Alberti, M.; Yacoub-George, E.; Hell, W.; Landesberger, C.; Bock, K.
Journal Article
2009Electrostatic carrier technique for thin wafer processing
Landesberger, C.; Wieland, R.; Ramm, P.; Bock, K.
Journal Article
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Conference Paper
2009Fluidfilter, Filtervorrichtung und Filterverfahren
Landesberger, C.; Endres, H.
Patent
2009Individualisierung einer Karte
Landesberger, C.; Yacoub-George, E.; Drost, A.; Klink, G.
Patent
2009Masterstruktur zum Prägen und/oder Bedrucken eines Grundmaterials, Vorrichtung zum kontinuierlichen Prägen und/oder Bedrucken eines Grundmaterials und Verfahren zum Herstellen einer Masterstruktur zum Prägen und/oder Bedrucken eines Grundmaterials
Landesberger, C.; Richter, M.; Bock, K.
Patent
2009Verfahren zum ausgerichteten Aufbringen von Bauteilen auf einem Traegersubstrat und ein Verfahren zur Herstellung eines Traegersubstrats dafuer und ein Verfahren zur Bestueckung eines Zielsubstrats damit.
Landesberger, C.; Scherbaum, S.
Patent
2009Wafer-Kassettenvorrichtung und Verfahren zum gemeinsamen Bearbeiten einer Mehrzahl von Waferstapeln und Kontaktschieber
Landesberger, C.
Patent
2008Selective one-step plasma patterning process for fluidic self-assembly of silicon chips
Bock, K.; Scherbaum, S.; Yacoub-George, E.; Landesberger, C.
Conference Paper
2007Carrier techniques for thin wafer processing
Landesberger, C.; Scherbaum, S.; Bock, K.
Conference Paper
2007Handling ultra-thin wafers
Landesberger, C.; Scherbaum, S.; Bollmann, D.; Bock, K.
Journal Article
2007Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J.
Journal Article
2007Verfahren zur selektiven Beschichtung einer Oberflaeche mit Fluessigkeit
Yacoub-George, E.; Scherbaum, S.; Landesberger, C.
Patent
2007Vorrichtung und Verfahren zum Bearbeiten eines Substrates
Landesberger, C.
Patent
2006Handling and processing of thin semiconductor substrates
Landesberger, C.; Bollmann, D.; Drost, A.; Schaber, U.; Bock, K.
Conference Paper
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
2006Verfahren und Vorrichtung zur elektrostatischen Fixierung von Substraten mit polarisierbaren Molekülen
Landesberger, C.
Patent
2006Verfahren zur Herstellung von gemeinsam bereitstellbaren flexiblen integrierten Schaltkreisen
Klink, G.; Landesberger, C.; Feil, M.
Patent
2005Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers
Bock, K.; Landesberger, C.; Bleier, M.; Bollmann, D.; Hemmetzberger, D.
Conference Paper