Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Conference Paper
2018Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Conference Paper
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Conference Paper
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Journal Article, Conference Paper
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Conference Paper
2014Stretchable and deformable electronic systems in thermoplastic matrix materials
Löher, T.; Ostmann, A.; Seckel, M.
Conference Paper
2013Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies
Vanfleteren, J.; Bossuyt, F.; Löher, T.; Hsu, Y.-Y.; Gonzalez, M.; Günther, J.
Book Article
2013Technologies and processes used in printed circuit board fabrication for the realization of stretchable electronics
Bossuyt, F.; Löher, T.
Book Article
2012First approach to cost-efficient fine pitch NCA flip-chip assembly on thermoplastic polyurethane printed circuit boards
Foerster, P.; Dils, C.; Kallmayer, C.; Löher, T.; Lang, K.-D.
Conference Paper
2012Flexible Mikroverdrahtungsstrukturen für implantierbare Elektroden
Schmidt, Ralf; Zwanzig, M.; Marcos, D.; Wirth, A.; Löher, T.; Seckel, M.
Journal Article
2012SCB and SMI: Two stretchable circuit technologies, based on standard printed circuit board processes
Vanfleteren, J.; Loeher, T.; Gonzalez, M.; Bossuyt, F.; Vervust, T.; Wolf, I. de; Jablonski, M.
Journal Article
2011Cyclic endurance reliability of stretchable electronic substrates
Bossuyt, F.; Guenther, J.; Löher, T.; Seckel, M.; Sterken, T.; Vries, J. de
Journal Article
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Conference Paper
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Conference Paper
2010Module miniaturization by ultra thin package stacking
Löher, T.; Schütze, D.; Ostmann, A.; Aschenbrenner, R.
Conference Paper
2010Stretchable electronics manufacturing and application
Löher, T.; Seckel, M.; Ostmann, A.
Conference Paper
2009Flexibel bleiben: dehnbare elektronische Systeme
Löher, T.; Seckel, M.; Ostmann, A.
Journal Article
2009Photovoltaikmodul und Verfahren zur Herstellung eines Photovoltaikmoduls
Löher, T.; Ostmann, A.; Seckel, M.
Patent
2009Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology in textile applications
Ostmann, A.; Vieroth, R.; Seckel, M.; Löher, T.; Reichl, H.
Conference Paper
2009Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformflaeche mit einem solchen System, sowie elektronisches System und Freiformflaechen mit einem solchen System
Loeher, T.; Ostmann, A.; Seckel, M.
Patent
2008Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, W.; Löher, T.; Pahl, B.; Feil, M.; Vandevelde, B.; Vanfleteren, J.
Journal Article
2008Flex Technology for Foldable Medical Flip Chip Devices
Pahl, B.; Löher, T.; Burkhard, H.; Link, J.; Aschenbrenner, R.
Conference Paper
2008Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H.
Conference Paper
2008Stretchable electronic systems for wearable and textile applications
Löher, T.; Vieroth, R.; Seckel, M.; Ostmann, A.; Reichl, H.
Conference Paper
2007Realization of large area stretchable electronic systems using lamination processes
Loeher, T.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2006Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H.
Presentation
2006Development of a nano-structure based interconnection technology
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Presentation
2006Embedding of active and passive components into printed wiring boards
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H.
Presentation
2006Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H.
Conference Paper
2006Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.
Conference Paper
2006Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2006Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Conference Paper
2006Reliability issues in Pb-free solder joint miniaturization
Huang, Z.; Conway, P.P.; Jung, E.; Thomson, R.C.; Liu, C.; Loeher, T.; Minkus, M.
Journal Article
2006Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A.
Journal Article
2006Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H.
Conference Paper
2006Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H.
Conference Paper
2006Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R.
Patent
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Embedded resistors by electro less deposition of Ni(P)
Löher, T.; Vieroth, R.
Conference Paper
2005Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M.L.; Löher, T.; Ostmann, A.; Reichl, H.
Journal Article
2005Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils
Manke, I.; Becker, K.; Ostmann, A.; Aschenbrenner, R.; Loeher, T.
Patent