Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1997Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1997A new production line for low cost flip chip assembly
Kutzner, K.; Kloeser, J.; Kappeler, U.; Aschenbrenner, R.; Reichl, H.
Conference Paper