Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2010Carrierless design for handling and processing of ultrathin wafers
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T.
Conference Paper
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2010Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2001High Density Bumping for Advanced Packaging
Wolf, M.J.; Ritzdorf, T.; Kuna, I.; Kasap, T.; Worm, O.
Conference Paper
1996Novel potentiometric silicon sensor for medical devices
Schnakenberg, U.; Lisec, T.; Hintsche, R.; Kuna, I.; Uhlig, A.; Wagner, B.
Conference Paper
1995Novel potentiometric silicon sensor for medical devices
Schnakenberg, U.; Lisec, T.; Hintsche, R.; Kuna, I.; Uhlig, A.; Wagner, B.
Conference Paper