Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Journal Article
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Journal Article
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Conference Paper
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Journal Article