Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Journal Article
2017Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
2017Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Conference Paper
2017Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Journal Article
2016Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Conference Paper
2012All printed touchless human-machine interface based on only five functional materials
Scheipl, G.; Zirkl, M.; Sawatdee, A.; Helbig, U.; Krause, M.; Kraker, E.; Andersson Ersman, P.; Nilsson, D.; Platt, D.; Bodö, P.; Bauer, S.; Domann, G.; Mogessie, A.; Hartmann, P.; Stadlober, B.
Conference Paper
2011An all-printed ferroelectric active matrix sensor network based on only five functional materials forming a touchless control interface
Zirkl, M.; Sawatdee, A.; Helbig, U.; Krause, M.; Scheipl, G.; Kraker, E.; Ersman, P.A.; Nilsson, D.; Platt, D.; Bodö, P.; Bauer, S.; Domann, G.; Stadlober, B.
Journal Article