Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Verfahren und Vorrichtung zur Trennung einews flachen Werkstücks in mehrere Teilstücke
Zühlke, Hans-Ulrich; Koitzsch, Matthias; Lewke, Dirk; Tobisch, Alexander
Patent
2013Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment. Results from European collaborative SEAL project
Le Barillec, Olivier; Davenet, Magali; Bellet, B.; Koitzsch, Matthias; Lewke, Dirk; Schellenberger, Martin; Zühlke, Hans-Ulrich
Conference Paper
2013Verfahren und Vorrichtung zum parallelen Trennen eines Werkstücks in mehrere Teilstücke
Lorenz, Jürgen; Koitzsch, Matthias; Schellenberger, Martin; Lewke, Dirk; Gumprecht, Thomas
Patent
2012Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke Hans-Ulrich
Conference Paper
2012Analysis of risks and related damages due to the implementation of virtual metrology algorithms into semiconductor fabrication lines
Koitzsch, Matthias; Honold, Alfred; Noll, Humbert; Nemecek, Alexander
Presentation
2012A calculation model for the economic effects of implementing predictive maintenance algorithms into semiconductor fabrication lines
Koitzsch, Matthias; Honold, Alfred; Noll, Humbert; Nemecek, Alexander
Presentation
2012IMPROVE - a joint European effort to boost efficiency in semiconductor manufacturing
Schellenberger, Martin; Koitzsch, Matthias; Roeder, Georg; Pfeffer, Markus; Schöpka, Ulrich; Mattes, Andreas; Pfitzner, Lothar
Presentation
2012Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells
Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich
Conference Paper
2012Thermal laser separation and its applications
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article
2011Evaluation of economic effects as the basis for assessing virtual metrology investment
Koitzsch, Matthias; Honold, Alfred
Journal Article
2011Implementing virtual metrology into semiconductor production processes - an investment assessment
Koitzsch, Matthias; Merhof, Jochen; Michl, Markus; Noll, Humbert; Nemecek, Alexander; Honold, Alfred; Kleineidam, Gerhard; Lebrecht, Holger
Conference Paper
2011Thermal Laser Separation (TLS) for separating multi-crystalline silicon wafers: A comparison with state-of-the-art methods
Koitzsch, Matthias; Schellenberger, Martin
Poster
2011Using DES for RoI calculations within semiconductor manufacturing
Merhof, Jochen; Lebrecht, Holger; Michl, Markus; Koitzsch, Matthias; Franke, Jörg
Presentation
2011A virtual equipment as a test bench for evaluating virtual metrology algorithms
Mattes, Andreas; Koitzsch, Matthias; Lewke, Dirk; Müller-Zell, Michael; Schellenberger, Martin
Conference Paper