Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
Koepge, R.; Buehler, K.; Kaule, F.; Zeh, J.; Schoenfelder, S.; Anspach, O.
Conference Paper
2016The impact of wafering on organic and inorganic surface contaminations
Meyer, S.; Wahl, S.; Timmel, S.; Köpge, R.; Jang, B.-Y.
Journal Article
2014Loss of wire tension in the wire web during the slurry based multi wire sawing process
Meißner, D.; Schoenfelder, S.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Grün, A.; Hagel, H.-J.; Moeller, H.J.; Schwabe, H.; Anspach, O.
Journal Article
2013Characterization of damage and mechanical strength of wafers and cells during the cell manufacturing process
Koepge, R.; Wegert, F.; Thormann, S.; Schoenfelder, S.
Journal Article
2012Damage and breakage of silicon wafers during impact loading on the wafer edge
Kaule, F.; Koepge, R.; Schönfelder, S.
Conference Paper
2012Loss of wire tension in the wire web: Towards stable cutting conditions for all wafers
Meißner, D.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Moeller, H.-J.; Schoenfelder, S.; Anspach, O.
Conference Paper
2011The influence of transport operations on the wafer strength and breakage rate
Köpge, Ringo; Schönfelder, Stephan; Giesen, Tim; Fischmann, Christian; Verl, Alexander; Bagdahn, Jörg
Conference Paper
2010Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
Ganapati, V.; Schoenfelder, S.; Castellanos, S.; Oener, S.; Koepge, R.; Sampson, A.; Marcus, M.A.; Lai, B.; Morhenn, H.; Hahn, G.; Bagdahn, J.; Buonassisi, T.
Journal Article