Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Automatisierte Methoden der Erfassung von Rufen und Gesängen in der avifaunistischen Feldforschung
Frommolt, Karl-Heinz; Hüppop, Ommo; Bardeli, Rolf; Hill, Reinhold; Koch, Martina; Tauchert, Klaus-Henry; Specht, Raimund
Journal Article
2012Computer-assisted diagnosis (CAD) in colposcopy: Evaluation of a pilot study
Mehlhorn, G.; Kage, A.; Münzenmayer, C.; Benz, M.; Koch, M.C.; Beckmann, M.W.; Wittenberg, T.
Journal Article
2012Damage detection in wind turbine`s towers
Friedmann, Andreas; Siebel, Thomas; Koch, M.; Mayer, D.; Bein, T.
Conference Paper
2012Design of a random decrement method based structural health monitoring system
Buff, H.; Friedmann, A.; Koch, M.; Bartel, T.; Kauba, M.
Journal Article
2012Enhancement of barrier properties of encapsulants for harsh environment applications
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.F.; Koch, M.; Aschenbrenner, R.; Lang, K.D.
Conference Paper
2012Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2012Experimentelle und numerische Analysen zum Aufbau eines Tragwerks mit Tilgern
Herold, Sven; Koch, M.; Mayer, D.; Pöllmann, D.; Röglin, T.; Siebel, T.
Presentation
2012On a methodical design approach for train self-powered hot box detectors
Koch, M.; Kurch, Matthias; Mayer, D.
Conference Paper
2012Realization and testing of an in-service vibration analysis system for structural health monitoring
Mayer, D.; Friedmann, A.; Koch, M.; Dornbusch, T.
Conference Paper
2011Computer-assistierte Diagnostik (CAD) für die Kolposkopie: Unterscheidung von Low-Grade, High-Grade und Tumor-Läsionen der Cervix uteri
Mehlhorn, G.; Münzenmayer, C.; Benz, M.; Kage, A.; Koch, M.; Beckmann, M.; Wittenberg, T.
Journal Article, Conference Paper
2011Evidence of two disorder scales in Ga(AsBi)
Imhof, S.; Wagner, C.; Chernikov, A.; Koch, M.; Kolata, K.; Köster, N.S.; Chatterjee, S.; Koch, S.W.; Lu, X.; Johnson, S.R.; Beaton, D.A.; Tiedje, T.; Rubel, O.; Thränhardt, A.
Journal Article
2011Experimental investigation of a Random decrement based modal estimation on a pedestrian bridge
Dornbusch, Thomas; Nottbeck, Manfred; Bartel, Thorsten; Buff, Hendrik; Friedmann, Andreas; Kauba, Michael; Koch, Michael; Mayer, Dirk
Conference Paper
2011Luminescence dynamics in Ga(AsBi)
Imhof, S.; Wagner, C.; Thränhardt, A.; Chernikov, A.; Koch, M.; Köster, N.S.; Chatterjee, S.; Koch, S.W.; Rubel, O.; Lu, X.; Johnson, S.R.; Beaton, D.A.; Tiedje, T.
Journal Article
2011Multi-Kamera Netzwerk für markerloses Motion Capturing
Koch, Markus
: Graf, Holger (Betreuer)
Master Thesis
2011Pathology of flupirtine-induced liver injury: A histological and clinical study of six cases
Puls, F.; Agne, C.; Klein, F.; Koch, M.; Rifai, K.; Manns, M.P.; Borlak, J.; Kreipe, H.H.
Journal Article
2011Photoconductive THz generation at 1.5 µm excitation in InGaAs/InAlAs structures with separated photoconductive and trapping layers
Dietz, R.J.B.; Gerhard, M.; Boettcher, J.; Kuenzel, H.; Koch, M.; Sartorius, B.; Schell, M.
Conference Paper
2011Simulation and testing of cell operating temperature in structured single and double glass modules
Li, B.; Christian, T.; Koch, M.; Muller, M.; Rodriguez, J.; Doble, D.M.J.
Conference Paper
2011Systematic preparation of random decrement method based structural health monitoring
Buff, H.; Friedmann, A.; Koch, M.; Bartel, T.; Kauba, M.
Conference Paper
2011THz generation at 1.55 µm excitation: six-fold increase in THz conversion efficiency by separated photoconductive and trapping regions
Dietz, R.J.B.; Gerhard, M.; Stanze, D.; Koch, M.; Sartorius, B.; Schell, M.
Journal Article
2011Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Conference Paper
2010Computer-assistierte Diagnostik (CAD) für die Kolposkopie - Evaluation einer Pilotstudie
Mehlhorn, G.; Münzenmayer, C.; Kage, A.; Benz, M.; Koch, M.C.; Winter, C.; Beckmann, M.W.; Wittenberg, T.
Journal Article
2010Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Contactless material deposition by jetting for heterogeneous system integration
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Conference Paper
2010Detecting bird sounds in a complex acoustic environment and application to bioacoustic monitoring
Bardeli, R.; Wolff, D.; Kurth, F.; Koch, M.; Tauchert, K.-H.; Frommolt, K.-H.
Journal Article
2010Evaluation einer Computer-assistierten Diagnostik (CAD) für die Kolposkopiedaten einer Pilotstudie
Mehlhorn, G.; Münzenmayer, C.; Kage, A.; Benz, M.; Koch, M.; Wittenberg, T.; Beckmann, M.
Abstract, Journal Article
2010GynCAD - A Computer-Assisted Diagnosis Approach for Colposcopy
Wittenberg, T.; Kage, A.; Benz, M.; Winter, C.; Koch, M.; Beckmann, M.; Münzenmayer, C.; Mehlhorn, C.
Abstract
2010Impact of structured glass on light transmission, temperature and power of PV modules
Duell, M.; Ebert, M.; Muller, M.; Li, B.; Koch, M.; Christian, T.; Perdichizzi, R.F.; Marion, B.; Kurtz, S.; Doble, D.
Conference Paper
2010Intuitives zweihändiges Arbeiten in der virtuellen Realität
Koch, M.; Franke, R.; Stellmach, S.; Dachselt, R.
Conference Paper
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Conference Paper
2010Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Precision material deposition for SiP manufacturing using jetting processes
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Conference Paper
2010Die Produktion von morgen - Anforderungen und Herausforderungen
Schenk, M.; Koch, M.
Journal Article
2010Using the random decrement method for the decentralized acquisition of modal data
Friedmann, A.; Koch, M.; Mayer, D.
Conference Paper
2010Water diffusion in micro- and nano-particle filled encapsulants
Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Comparison of different piezoelectric materials for GHz acoustic microscopy transducers
Jakob, A.; Bender, M.; Knoll, T.; Lemor, R.; Zhou, Q.; Zhu, B.P.; Han, J.X.; Shung, K.K.; Bender, M.; Lehnert, T.; Koch, M.; Veith, M.
Conference Paper
2009Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
2009Handheld terahertz spectrometer for the detection of liquid explosives
Krumbholz, N.; Jansen, C.; Scheller, M.; Müller-Wirts, T.; Lübbecke, S.; Holzwarth, R.; Scheunemann, R.; Wilk, R.; Sartorius, B.; Roehle, H.; Stanze, D.; Beckmann, J.; Chrzanowski, L.S. von; Ewert, U.; Koch, M.
Conference Paper
2009Increasing the speed of THz TDS imaging
Scherger, B.; Jördens, C.; Stanze, D.; Krumbholz, N.; Koch, M.
Conference Paper
2009Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Platform technology for form factor equivalent microsystems derived from COTS components
Jung, E.; Minkus, M.; Becker, K.F.; Koch, M.
Conference Paper
2008Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
2008High-power monolithic two-mode DFB laser diodes for the generation of THz radiation
Klehr, A.; Fricke, J.; Knauer, A.; Erbert, G.; Walther, M.; Wilk, R.; Mikulics, M.; Koch, M.
Journal Article
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Miniaturized camera system using advanced packaging techniques
Jung, E.; Koch, M.; Schmitz, S.; Boutte, R.; Harvey, I.; Meacham, T.; Solzbacher, F.
Conference Paper
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2008Probing noncovalent interactions in biomolecular crystals with Terahertz spectroscopy
Kleine-Ostmann, T.; Wilk, R.; Rutz, F.; Koch, M.; Niemann, H.; Güttler, B.; Brandhorst, K.; Grunenberg, J.
Journal Article
2007Applications of terahertz spectroscopy in the plastics industry
Wietzke, S.; Rutz, F.; Jördens, C.; Krumbholz, N.; Vieweg, R.; Jansen, C.; Wilk, R.; Koch, M.
Conference Paper
2007High power monolithic two mode DFB laser diodes for the generation of terahertz radiation
Klehr, A.; Fricke, J.; Knauer, A.; Erbert, G.; Walther, M.; Wilk, R.; Koch, M.
Conference Paper
2007A novel THz source based on a two-color Nd:LSB microchip-laser and a LT-GaAsSb photomixer
Willer, U.; Wilk, R.; Schippers, W.; Nodop, D.; Böttger, S.; Schossig, T.; Schade, W.; Mikulics, M.; Koch, M.; Walther, M.; Niemann, H.; Güttler, B.
Journal Article
2007Overmolded FC-SiP for miniaturized devices
Jung, E.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Properties of building and plastic materials in the THz range
Piesiewicz, R.; Jansen, C.; Wietzke, S.; Mittleman, D.; Koch, M.; Kurner, T.
Journal Article
2007Terahertz generation with 1064 nm DFB laser diode
Wilk, R.; Klehr, A.; Mikulics, M.; Hasek, T.; Walther, M.; Koch, M.
Journal Article
2007The terahertz view
Wietzke, S.; Rutz, F.; Koch, M.
Journal Article
2007THz Photoconductive Antennas for 1.55 µm Telecom Wavelengths
Sartorius, B.; Künzel, H.; Biermann, K.; Böttcher, J.; Roehle, H.; Wilk, R.; Mikulics, M.; Koch, M.; Mei, M.; Kozma, I.Z.; Holzwarth, R.
Conference Paper
2007THz time-domain spectrometer based on LT-InGaAs photoconductive antennas exited by a 1.55 µm fibre laser
Wilk, R.; Mikulics, M.; Biermann, K.; Künzel, H.; Kozma, I.Z.; Holzwarth, R.; Sartorius, B.; Mei, M.; Koch, M.
Conference Paper
2006High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2006Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Non-destructive investigation of paintings with THz-radiation
Köhler, W.; Panzner, M.; Klotzbach, U.; Beyer, E.; Winnerl, S.; Helm, M.; Rutz, F.; Jördens, C.; Koch, M.; Leitner, H.
Conference Paper
2006Photomixing with LT-GaAsSb antennas and a two-color Nd:LSB microchiplaser
Wilk, R.; Mikulics, M.; Schippers, W.; Nodop, D.; Willer, U.; Schade, W.; Walther, M.; Niemann, H.; Guittler, B.; Koch, M.
Conference Paper
2006Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Workshop "Entwicklungsperspektiven und Potenziale"
Warschat, J.; Koch, M.; Kinkel, S.
Conference Paper
2005Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Communities and community support systems
Koch, M.; Prinz, W.
Journal Article
2005Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E.
Journal Article
2005Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Film coatings as an encapsulation process for polymer electronics
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Interaktionsvorrichtung, Interaktionssystem und Markersystem
Koch, M.; Graf, H.; Stork, A.; Graf, G.; Barski, O.
Patent
2005A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Reliability potential of epoxy based encapsulants for automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper, Journal Article
2005TAS - ein touristisches Assistenzsystem für den barrierefreien Zugang zu Urlaubs-, Freizeit- und Bildungsaktivitäten im Thüringer Wald
Fröber, U.; Lutherdt, S.; Koch, M.; Witte, H.; Kurtz, P.; Roß, F.; Wernstedt, J.
Conference Paper
2005A touristic assistance system as an example of symbiosis of technologies and strategies from robotics, mechatronics and biomedical engineering
Lutherdt, S.; Fröber, U.; Fetter, R.; Roß, F.; Koch, M.; Seitz, J.; Wernstedt, J.; Witte, H.
Conference Paper
2004Cyberstilo©. Towards an ergonomic and aesthetic wireless 3D-pen
Graf, Holger; Koch, Marianne; Stork, André; Barski, Olaf
Conference Paper
2004Modelling and application of silicon microphone systems
Mammen, H.-T.; Stürmer, U.; Koch, M.; Köhne, H.; Becker, K.-F.; John, W.; Reichl, H.
Conference Paper
2003Flip chip technology for high temperature automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Packaging of micro devices for automotive applications
Jung, E.; Großer, V.; Becker, K.-F.; Koch, M.
Conference Paper
2003Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J.
Conference Paper
2002Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Flip chip molding - Recent progress in flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Fuzzy control of a spin-etching process
Knobloch, J.; Koch, M.
Conference Paper
2002Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000End point detection for spin etching machines
Koch, M.; Knobloch, J.
Book Article
2000Fuzzy end point detection for liquid etching processes
Knobloch, J.; Koch, M.
Conference Paper
2000Intelligente Bildverarbeitung für Naßätzprozesse
Koch, M.; Knobloch, J.
Conference Paper
2000An Internet-Based Information Service to support the Product Development Process in Design Offices
Koch, M.; Koch, B.
Conference Paper
1999Intelligent image processing for liquid etching processes
Koch, M.; Knobloch, J.
Conference Paper
1999A postclinical telematic healthcare network for patients in their homes
Meyer, J.-U.; Schäfer, M.; Koch, M.; Kleer, C.; Kiefer, S.
Conference Paper
1998An environment and an information service for global manufacturing
Jasnoch, U.; Koch, M.
Conference Paper
1998Organizing space in time
Chodura, H.; Koch, M.; Sieverts, T.; Jöckle, K.; Schneiders, M.
Conference Paper
1998SOLING - Software Leasing im Internet
Koch, M.
Conference Paper
1998Soling: Software Leasing im Internet. Neue Märkte durch kundenorientierte Dienstleistungsangebote
Jasnoch, U.; Koch, M.
Conference Paper
1997The design of optimum fuzzy control
Kuhn, T.; Koch, M.; Wernstedt, J.
Book Article
1997A Fuzzy-ASIC for robust signal preprocessing of a laser optical sensor
Jeroch, W.; Koch, M.; Haug, K.
Conference Paper
1997Selected readings in computer graphics 1996. Veröffentlichungen aus dem Haus der Graphischen Datenverarbeitung
: Encarnacao, J.L.; Koch, M.
Book
1997SOLING - Software Leasing im Internet
Koch, M.
Conference Paper
1996Der ISO 9241-Evaluator
Oppermann, R.; Wick, C.; Reiterer, H.; Prümper, J.; Geis, T.; Koch, M.
Journal Article
1996Selected readings in computer graphics 1995. Veröffentlichungen aus dem Haus der Graphischen Datenverarbeitung
: Koch, M.
Book
1995Comparison on evolutionary strategies and genetic algorithms for optimization of a fuzzy controller
Presberger, T.; Koch, M.
Conference Paper
1995On-Chip-Fuzzy-Temperaturregelung
Knobloch, J.; Koch, M.
Book Article
1995Selected readings in computer graphics 1994
: Koch, M.
Book
1995Vergleich von Evolutionsstrategien und Genetischen Algorithmen zur Optimierung eines Fuzzy-Controllers
Presberger, T.; Koch, M.
Conference Paper
1994Chipentwurf für ein Fuzzy-Mikrosystem zur Gasklassifikation
Koch, M.; Jeroch, W.
Conference Paper
1994Konfigurierbare CAD-Applikationen auf der Basis eines flexiblen Benutzungsoberflaechen-Systems
Koch, M.; Haßinger, S.
Conference Paper
1994Konzept eines konfigurierbaren Konstruktionssystems auf Basis des CAD-Referenzmodells
Hassinger, S.; Koch, M.; Rix, J.
Conference Paper
1994On-chip fuzzy temperature control
Knobloch, J.; Koch, M.
Conference Paper
1993Coupling of exciton transitions associated with different quantum-well islands
Koch, M.; Feldmann, J.; Göbel, E.O.; Thomas, P.; Shah, J.; Köhler, K.
Journal Article
1993Intelligente Dialogmethoden für die nächste Generation von CAD-Systemen
Koch, M.
Conference Paper
1993Konstruieren als Gruppenarbeit. Anforderungen an eine zukünftige Softwaregestaltung
Koch, M.; Martin, H.; Siodla, T.
Conference Paper
1993Praktische Erfahrungen in der Organisations -, Aufgaben - und Softwaregestaltung
Koch, M.; Reiterer, H.
Conference Paper
1993Quantum beats versus polarization interference - an experimental distinction
Koch, M.; Feldmann, J.; Plessen, G. von; Göbel, E.O.; Thomas, P.; Köhler, K.
Book Article
1992Optimierung von integrierten Fuzzy-Schaltungen
Jeroch, W.; Knobloch, J.; Koch, M.
Conference Paper
1992Quantum beats versus polarization interference: An experimental distinction
Koch, M.; Feldmann, J.; Plessen, G. von; Göbel, E.O.; Thomas, P.; Köhler, K.
Journal Article
1992Software-ergonomische Evaluation
Oppermann, R.; Murchner, B.; Reiterer, H.; Koch, M.
Book
1992Time-resolved four-wave mixing in GaAs/AlAs quantum well structures.
Koch, M.; Feldmann, J.; Plessen, G. von; Meier, T.; Schulze, A.; Thomas, P.; Göbel, E.O.; Köhler, K.; Ploog, K.; Schmitt-Rink, S.
Journal Article
1991Das High-Tech-Arbeitsmittel CAD
Koch, M.
Journal Article
1990CAD und Animation im Produktentwicklungsprozeß
Koch, M.; Loseries, F.
Journal Article
1990Integration von Animations- und Simulationswerkzeugen in den Design-Prozeß
Koch, M.; Loseries, F.; Tran, T.
Conference Paper
1988A novel approach to CAD of analog cells
Borutzky, W.; Koch, M.; Schwarz, B.; Steinhauer, H.; Wagner, G.
Conference Paper
1987Influence of shot peening on the fatigue of sintered steels under constant and variable amplitude loading
Sonsino, C.M.; Koch, M.
Conference Paper