Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny
Conference Paper
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Conference Paper
2015WaferBond 2015, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts
: Knechtel, Roy (Ed.); Eichler, Marko
Conference Proceedings
2007Waferbond technologies and quality assesment
Wiemer, M.; Froemel, J.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006Influence of moulding process on strength of glass frit bonded structures
Ebert, M.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
Knechtel, R.; Knaup, M.; Bagdahn, J.
Conference Paper, Journal Article
2006Wafer level encapsulation of microsystems using glass frit bonding
Knechtel, R.; Wiemer, M.; Frömel, J.
Conference Paper, Journal Article
2005Halbleiterwaferbondverbindungen mittels strukturierter Glaszwischenschichten zur Verkapselung oberflächenmikromechanischer Sensoren auf Waferebene
Knechtel, R.
Dissertation
2005NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M.
Conference Paper
2003Silicon wafer bonding for encapsulating surface-micromechanical-systems using intermediate glass layers
Knechtel, R.; Heller, J.; Wiemer, M.; Frömel, J.
Conference Paper