Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
2019Towards low cost and low temperature capacitive CO2 sensors based on amine functionalized silica nanoparticles
Boudaden, J.; Klumpp, A.; Endres, H.-E.; Eisele, I.
Journal Article
2018Enzymatic sensor based on dye sensitized TiO2 electrode for detection of catechol in water
Klumpp, Armin; Adrovic, Asmir; Boudaden, Jamila
Journal Article, Conference Paper
2017Capacitive CO2 sensor
Boudaden, Jamila; Klumpp, Armin; Endres, Hanns-Erik; Eisele, Ignaz
Journal Article, Conference Paper
2017Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism
Siris, R.; Boudaden, J.; Klumpp, A.
Conference Paper
2017Smart HVAC sensors for smart energy
Boudaden, J.; Wenninger, F.; Klumpp, A.; Eisele, I.; Kutter, C.
Conference Paper
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Conference Paper
2016Smart capacitive CO2 sensor
Boudaden, Jamila; Klumpp, Armin; Eisele, Ignaz; Kutter, Christoph
Conference Paper
2015The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Ramm, P.; Klumpp, A.; Weber, J.; Mathewson, A.; Razeeb, K.M.; Pufall, R.
Conference Paper
2015Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
Vitale, W.A.; Fernandez-Bolanos, M.; Klumpp, A.; Weber, J.; Ramm, P.; Ionescu, A.M.
Conference Paper
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Conference Paper
2012Heterogene Systemintegration von Halbleitersensoren
Klumpp, A.; Nebrich, L.; Eisele, I.
Book Article
2012Temporary adhesive bonding with reconfiguration of known good dies for three-dimensional integrated systems
Klumpp, A.; Ramm, P.
Book Article
2012Temporary bonding: Electrostatic
Landesberger, C.; Klumpp, A.; Bock, K.
Book Article
2012Verfahren zur Herstellung eines Chips
Klumpp, Armin; Ramm, Peter
Patent
2011Characterization and failure analysis of 3D integrated systems using a novel plasma-FIB system
Kwakman, L.; Franz, G.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
2011Failure analysis and reliability of 3D integrated systems
Ramm, P.; Klumpp, A.; Franz, G.; Kwakman, L.
Conference Paper
2011Reliability testing and failure analysis of 3D integrated systems
Klumpp, A.; Ramm, P.; Franz, G.; Rue, C.; Kwakman, L.
Conference Paper
20103D integration technology: Status and application development
Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P.
Conference Paper
20103D System-on-Chip technologies for More than Moore systems
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Journal Article
20103D-integration of silicon devices: A key technology for sophisticated products
Klumpp, A.; Ramm, P.; Wieland, R.
Conference Paper
2010Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC
Andricek, L.; Beimforde, M.; Klumpp, A.; Macchiolo, A.; Merkel, K.-R.; Moser, H.-G.; Nisius, R.; Richter, R.H.; Weber, J.; Weigell, P.; Wieland, R.
Conference Paper
2010Enabling technologies for 3D integration
Klumpp, A.; Ramm, P.
Book Article
2010The European 3D technology platform (e-CUBES)
Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M.
Journal Article
2010High performance 3D interconnects based on electrochemical etch and liquid metal fill
Hedler, H.; Scheiter, T.; Schieber, M.; Klumpp, A.; Ramm, P.
Conference Paper
2010Reliability of through silicon via technologies
Klumpp, A.; Ramm, P.
Conference Paper
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D integration technologies
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Conference Paper
20093D integration technologies for MEMS/IC systems
Ramm, P.; Klumpp, A.; Weber, J.
Conference Paper
20093D integration technologies for miniaturized Tire Pressure Monitor System (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Weber, J.; Ramm, P.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Conference Paper
20083D integration technologies for miniaturized tire pressure monitor system (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
20083D wafer level system integration - requirements & technologies
Klumpp, A.; Wolf, M.J.; Ramm, P.; Wunderle, B.; Reichl, H.
Conference Paper
2008Metallization by chemical vapor deposition of W and Cu
Klumpp, A.; Wieland, R.; Ecke, R.; Schulz, S.E.
Book Article
2008Technologies for 3D wafer level heterogeneous integration
Wolf, M.J.; Ramm, P.; Klumpp, A.; Reichl, H.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Through-Silicon Via Technologies for Extreme Miniaturized 3D Integrated Wireless Sensor Systems (e-CUBES)
Ramm, P.; Klumpp, A.
Conference Paper
20073D system integration
Klumpp, A.; Merkel, R.; Ramm, P.; Wieland, R.
Conference Paper
20073D system integration for high density interconnects
Wieland, R.; Klumpp, A.; Ramm, P.
Conference Paper
20073D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P.
Conference Paper
2007Elektronisches System und Verfahren zur Herstellung eines dreidimensionalen elektronischen Systems
Ramm, P.; Klumpp, A.
Patent
20053D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P.
Conference Paper, Journal Article
2005Process integration of infrared-sensitive PIN photodiodes and CMOS transistors in a single-SiGe substrate
Nebrich, L.; Neumeier, K.; Stadler, A.; Weber, J.; Bensch, F.; Kreuzer, S.; Vogg, G.; Herrmann, K.; Klumpp, A.; Wieland, R.; Bonfert, D.; Soldner, W.; Ramm, P.
Conference Paper, Journal Article
2004Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding
Klumpp, A.; Merkel, R.; Ramm, P.; Weber, J.; Wieland, R.
Journal Article
2004Vertical System Integration Technology for High Speed Applications by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding
Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Elst, G.; Ramm, P.
Book Article
20033D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.
Conference Paper
2003Chip-to-wafer stacking technology for 3D system integration
Klumpp, A.; Merkel, R.; Wieland, R.; Ramm, P.
Conference Paper
2003MOBILER HALTER FUER EINEN WAFER
Landesberger, C.; Bleier, M.; Klumpp, A.
Patent
2003Verfahren zum Vereinzeln eines Wafers
Klumpp, A.; Hacker, E.; Feil, M.; Landesberger, C.
Patent
2003Verfahren zur vertikalen Integration von elektrischen Bauelementen mittels Rückseitenkontaktierung
Ramm, P.; Klumpp, A.
Patent
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Conference Paper
2002Verfahren zum dauerhaften Verbinden von anorganischen Substraten
Klumpp, A.; Landesberger, C.
Patent
2002Verfahren zur Kontaktierung von vertikalen Leitern in Halbleiterbauelementen
Huebner, H.; Klumpp, A.
Patent
2001Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.
Conference Paper
2001Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R.
Conference Paper
1999Single step DUV laser based stripping of photoresist with wafer cleaning for key 0.18 micron processes
Klumpp, A.; Ramm, P.
Conference Paper
1999Verfahren zur Kontaktierung eines elektrischen Bauelements und elektrisches Bauelement
Klumpp, A.
Patent
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1998Verfahren zum Aetzen von Strukturen in einer Siliziumschicht
Klumpp, A.; Bollmann, D.; Ramm, P.
Patent
1998Verfahren zum Aufbringen einer UV- und/oder elektronenstrahlempfindlichen Lackschicht
Klumpp, A.; Hacker, E.
Patent
1998Verfahren zum Bilden von Justiermarken in einer Siliziumschicht
Kalus, M.; Bollmann, D.; Klumpp, A.
Patent
1998Verfahren zur Strukturierung von duennen Metallschichten
Bollmann, D.; Klumpp, A.
Patent
1997Conformal copper deposition in deep trenches
Bollmann, D.; Merkel, R.; Klumpp, A.
Journal Article
1997Entwicklung einer Waferverbindungstechnik für vertikal integrierte IC's
Landesberger, C.; Klumpp, A.; Ramm, P.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A.
Conference Paper
1997Verdampfervorrichtung
Hacker, E.; Klumpp, A.
Patent
1997Vertically integrated circuits. A key technology for future high performance systems
Engelhardt, M.; Hübner, H.; Jacobs, H.; Kleiner, M.; Kühn, S.; Pamler, W.; Renner, E.; Sänger, A.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, W.; Braun, R.; Grassl, T.; Hieber, K.; Kawala, G.; Klumpp, A.; Landesberger, C.; Popp, R.; Ramm, P.; Ruhl, G.; Weber, J.
Conference Paper
1996VERFAHREN ZUR TROCKENENTWICKLUNG EINER SILIZIUMHALTIGEN ULTRAVIOLETT- UND/ODER ELEKTRONENSTRAHLEMPFINDLICHEN LACKSCHICHT
Klumpp, A.; Hacker, E.
Patent
1994Verfahren zum Herstellen einer Silikatschicht in einer integrierten Schaltung und Vorrichtung zur Durchfuehrung des Verfahrens
Sigmund, H.; Klumpp, A.
Patent
1994Vorrichtung zum Verdampfen von Fluessigkeiten
Klumpp, A.; Hacker, E.
Patent
1993Mikrokuevette fuer die Infrarotspektroskopie
Klumpp, A.; Hacker, E.
Patent
1993Verfahren zur Abscheidung einer Siliziumnitrid-Polymerschicht auf einem Substrat
Klumpp, A.; Hacker, E.
Patent
1991Verfahren zum Herstellen einer wasserfreien Siliziumdioxidschicht
Klumpp, A.
Patent
1990Laser temperature interlevel SiO2 layers by photoinduced processing
Sigmund, H.; Klumpp, A.; Springholz, G.
Conference Paper
1989Deposition of high quality SiO2 layers from TEOS by excimer laser
Klumpp, A.; Sigmund, H.
Journal Article
1989Photoinduced transformation of polysiloxane layers by SiO2
Klumpp, A.; Sigmund, H.
Journal Article