Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2004Innovative Fertigungsverfahren für neue Produkte auf der Basis dünner Silizium-Bauelemente
Oelgeschläger, D.; Schmid, H.; Kloeser, J.; Monser, H.-P.; God, R.; Schlott, P.; Süss, R.; Feil, M.
: Landesberger, C.
Book
2002Bump formation for flip chip and CSP by solder paste printing
Kloeser, J.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Lead free solders for area array packaging
Klöser, J.; Kallmayer, C.; Jung, E.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Lead free solders for area array packaging
Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Low cost bumping by stencil printing
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
2000PCB-design follows IC-packaging
Scheel, W.; Kloeser, J.
Journal Article
2000Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
1999Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.
Conference Paper
1999Flussmittelfreie Kontaktierung von Bauelementen
Kloeser, J.; Zakel, E.; Reichl, H.
Patent
1999Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H.
Conference Paper
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Chipanordnung und Verfahren zur Herstellung einer Chipanordnung
Reichl, H.; Auersperg, J.; Simon, J.; Aschenbrenner, R.; Kloeser, J.; Jung, E.
Patent
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Jung, E.; Klöser, J.; Heinricht, K.; Lauter, L.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1997Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1997The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H.
Journal Article
1997Low cost flip chip technologies on chemical nickel bumping and solder printing
Kloeser, J.; Gwiasda, J.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bechtold, F.
Journal Article
1997Eine moderne Flip-Chip- und Chip-Size-Package-Fertigungslinie für den industriellen Einsatz in der Aufbau- und Verbindungstechnik
Kloeser, J.
Journal Article
1997A new production line for low cost flip chip assembly
Kutzner, K.; Kloeser, J.; Kappeler, U.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Verfahren zur Herstellung einer Durchkontaktierung sowie Chiptraeger und Chiptraegeranordnung mit einer Durchkontaktierung
Azdasht, G.; Kloeser, J.; Kasulke, P.
Patent
1996Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H.
Journal Article
1996The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A.
Conference Paper
1996Lotpastendruck im Fine-Pitch Bereich für eine kostengünstige Flip Chip Technologie
Klöser, J.; Gwiasda, J.
Book Article
1996Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H.
Conference Paper
1995Alternative flip-chip interconnection technologies
Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper
1995Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper
1995Flip chip soldering on printed wining boards using vapor phase reflow
Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J.
Conference Paper
1995Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H.
Conference Paper
1995Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J.
Conference Paper
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article
1995Reflow properties of electrodeposited PbSn 95/5 solder bumps for FC-assembly
Jung, E.; Zakel, E.; Beutler, U.; Klöser, J.; Reichl, H.
Conference Paper
1995Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates
Klöser, J.; Zakel, E.; Bechtold, F.; Reichl, H.
Conference Paper
1994Cost effective flip chip interconnections on FR-4-boards
Klöser, J.; Zakel, E.; Ostmann, A.; Eldring, J.; Reichl, H.
Conference Paper
1994Development of fluxless flip chip attach technologies on green tape ceramic substrates
Klöser, J.; Zakel, E.; Bechthold, F.; Distler, W.
Conference Paper
1994Flip-Chip-Kontaktierungen auf organischen Substrat-Materialien
Klöser, J.; Zakel, E.; Gwiasda, J.; Ostmann, A.; Reichl, H.
Conference Paper
1994Flußmittelfreie Flip-Chip-Kontaktierungen auf Green-Tape Multilayer-Substraten
Klöser, J.; Zakel, E.; Bechthold, F.; Reichl, H.
Conference Paper
1993Flip-chip bonding on green tape ceramic substrates
Zakel, E.; Klöser, J.; Distler, H.; Reichl, H.
Conference Paper
1993Investigations of flip chip interconnections on green tape ceramic substrates
Klöser, J.; Zakel, E.; Engelmann, G.; Distler, H.
Conference Paper
1993Untersuchungen einer Flip-Chip-Bond-Technologie auf Green-Tape-Keramik-Multilayer-Substraten
Klöser, J.; Zakel, E.; Engelmann, G.; Distler, H.; Reichl, H.
Conference Paper