Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate
Fiore, V.; Battiato, P.; Abdinia, S.; Jacobs, S.; Chartier, I.; Coppard, R.; Klink, G.; Cantatore, E.; Ragonese, E.; Palmisano, G.
Journal Article
2014DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substrate
Ohlander, A.; Hammerle, T.; Klink, G.; Zilio, C.; Damin, F.; Chiari, M.; Russom, A.; Bock, K.
Conference Paper
2014Multifunctional system integration in flexible substrates
Bock, K.; Yacoub-George, E.; Hell, W.; Drost, A.; Wolf, H.; Bollmann, D.; Landesberger, C.; Klink, G.; Gieser, H.; Kutter, C.
Conference Paper
2013Electrical stress on transparent conductive oxide layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2013Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system
Ohlander, A.; Zilio, C.; Hammerle, T.; Zelenin, S.; Klink, G.; Chiari, M.; Bock, K.; Russom, A.
Journal Article
2013Heterointegration technologies for high frequency modules based on film substrates
Bock, K.; Yacoub-George, E.; Wolf, H.; Landesberger, C.; Klink, G.; Gieser, H.
Conference Paper
2013Sensing properties of carbon nanotube based thick film layers on foils
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2012Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.
Conference Paper
2012Electrical stress on intrinsically conductive polymer layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2012Polymer opto-chemical-electronic based module as a detection system for volatile analytes on a foil substrate
Bose, I.; Ohlander, A.; Stich, M.I.J.; Kiesl, C.; Hemmetzberger, D.; Klink, G.; Trupp, S.; Bocka, K.
Conference Paper
2011Electrical stress on film resistive structures on different substrates
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2011Polymer opto-electronic-fluidic detection module on plastic film substrates
Ohlander, A.; Burghart, M.; Strohhöfer, C.; Bollmann, D.; Landesberger, C.; Klink, G.; Bock, K.
Conference Paper
2010Analysis of planar inductors on flexible substrates for RFID antennas
Ionescu, C.; Svasta, P.; Bonfert, D.; Klink, G.
Conference Paper
2010Electrical stress on film resistive structures on flexible substrates
Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2010Mikrofluidikmodul und Verfahren zur Herstellung desselben
Ohlander, A.; Bock, K.; Klink, G.; Strohhöfer, C.; Burghart, M.
Patent
2010Organischer Transistor und Verfahren zur Herstellung desselben, organische Transistoranordnung und Verfahren zur Herstellung derselben
Burghart, M.; Klink, G.
Patent
2010Polymer electronics towards system integration
Bonfert, D.; Klink, G.; Bock, K.
Conference Paper
2009Elektrisch funktionales Foliensystem und Verfahren zur Herstellung eines elektrisch funktionalen Foliensystems
Drost, A.; König, M.; Strohhöfer, C.; Klink, G.
Patent
2009Elektrisch funktionales Mehrschichtfoliensystem und Verfahren zum Herstellen desselben
Drost, A.; König, M.; Strohhöfer, C.; Klink, G.; Hemmetzberger, D.
Patent
2009Elektronische Systemintegration auf Kunststofffolien
Klink, G.; Bock, K.
Journal Article
2009Individualisierung einer Karte
Landesberger, C.; Yacoub-George, E.; Drost, A.; Klink, G.
Patent
2009Integration of two classes of organic electronic devices into one system
Liu, J.; Engquist, I.; Berggren, M.; Norberg, P.; Lögdlund, M.; Nordlinder, S.; Sawatdee, A.; Nilsson, D.; Gold, H.; Stadlober, B.; Haase, A.; Kaker, E.; König, M.; Klink, G.; Bock, K.; Blaudeck, T.; Geyer, U.; Baumann, R.
Conference Paper
2009Micro-contact printing of OTFT on polymer foils
König, M.; Bock, K.; Klink, G.
Conference Paper
2009Pulsed stress behavior of PEDOT:PSS thin films
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2008Luminescent solar concentrators - A review of recent results
Sark, W.G. van; Barnham, K.W.; Slooff, L.H.; Chatten,A.J.; Büchtemann, A.; Meyer, A.; Mc Cormack, S.J.; Koole, J.; Farrell, D.J.; Bose, R.; Bende, E.E.; Burgers, A.R.; Budel, T.; Quilitz, J.; Kennedy, M.; Meyer, T.; Wadman, S.H.; Klink, G.P. van; Koten, G. van; Meijerink, A.; Vanmaekelbergh, D.
Journal Article
2008Microfluidics on foil
Velten, T.; Schuck, H.; Richter, M.; Klink, G.; Bock, K.; Malek, C.K.; Roth, S.; Scho, H.; Bolt, P.J.
Journal Article
2008Plastic based system components and technology for (bio-)chemical sensors
Endres, H.-E.; Klink, G.; Bock, K.
Conference Paper
2008Pulsed stress behavior of flexible thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2008Reliability of polymer electronics on plastic film
Klink, G.; Strohhöfer, C.; Bock, K.
Conference Paper
2007Elektrisch steuerbare Anzeigevorrichung mit elektrisch beheizbarer thermochromer Schicht
Yacoub-George, E.; Klink, G.; Seeboth, A.
Patent
2007High Current Pulse Stress on Flexible Thick Film Resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Hemmetzberger, D.
Conference Paper
2007Large area cost-efficient electronics systems integration
Bock, K.; Klink, G.; Strohhöfer, C.; Hemmetzberger, D.; Feil, M.
Conference Paper
2007Roll-to-roll microfabrication of polymer microsystems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2007Roll-to-roll microfabrication of polymer systems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2007Technologies for functional hetero-system integration on foil
Bock, K.; Adler, C.; Bollmann, D.; Klink, G.; Feil, M.; Strohhöfer, C.
Conference Paper
2007Transmission line pulsing behavior of thin film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Svasta, P.
Conference Paper
2006Design of complex circuits for OFET-technologies on flexible substrates
Todt, U.; Bunk, G.; Amelung, J.; Vogel, U.; Klink, G.; Bock, K.-H.
Conference Paper
2006Design procedure and mask generation for OFET-technologies on rigid and flexible substrates
Todt, U.; Bunk, G.; Vogel, U.; Amelung, J.; Klink, G.; Bock, K.-H.
Conference Paper
2006Polymer Electronic Circuits Based on Reel-to-Reel Photolithography
Klink, G.; Drost, A.; Hammerl, E.; Hemmetzberger, D.; Strohhöfer, C.; Bock, K.
Conference Paper
2006Polytronik - Elektronik von der Rolle
Bock, K.; Klink, G.; Bannert, M.; Slama, A.
Book Article
2006Verfahren zur Herstellung von gemeinsam bereitstellbaren flexiblen integrierten Schaltkreisen
Klink, G.; Landesberger, C.; Feil, M.
Patent
2005FULLSPECTRUM: A new PV wave making more efficient use of the solar spectrum
Marti, A.; Bett, A.; Andreev, V.M.; Jaussaud, C.; Roosmalen, J.A.M. van; Alonso, J.; Räuber, A.; Strobl, G.; Stolz, W.; Algora, C.; Bitnar, B.; Gombert, A.; Stanley, C.; Wahnon, P.; Conesa, J.; Sark, W.G.J.H.M. van; Meijerink, A.; Klink, G. van; Barnham, K.; Danz, R.; Meyer, T.; Luque-Heredia, I.; Kenny, R.; Christodes, C.; Sala, G.; Benítez, P.
Conference Paper, Journal Article
2005Reel-to-reel fabrication of integrated circuits based on soluble polymer semiconductor
Klink, G.; Hammerl, E.; Drost, A.; Hemmetzberger, D.; Bock, K.
Conference Paper
2005Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems
Drost, A.; Klink, G.; Feil, M.; Bock, K.
Conference Paper
2004Polytronics: Technology trends and environmental issues
Bock, K.; Burghart, M.; Klink, G.; Pötter, H.; Müller, J.; Hagelüken, M.
Conference Paper
2004Reel-to-reel manufacturing of polymer electronics for low-cost applications
Klink, G.
Conference Paper
2003Evaluation of reel-to-reel processes for polymer electronics
Burghart, M.; Liemann, G.; Klink, G.; Bock, K.
Conference Paper
2003Innovative packaging concepts for ultrathin ICs
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Journal Article
2003Polymerelektronik - Ziele und Entwicklungen
Klink, G.; Burghart, M.; Bock, K.
Journal Article
2003Ultra thin ICs and MEMS elements. Techniques for wafer thinning, stress-free separation, assembly and interconnection
Feil, M.; Adler, C.; Klink, G.; König, M.; Landesberger, C.; Scherbaum, S.; Schwinn, G.; Spöhrle, H.
Journal Article
2003Verfahren zur Montage eines Chips auf einem Substrat
Klink, G.; Koenig, M.
Patent
2002Entwicklungen in der Smart Label Technologie
Klink, G.
Conference Paper
2002Reliability of thinned silicon ICs
Landesberger, C.; Bollmann, D.; Klink, G.; Bock, H.; Reichl, H.
Conference Paper
2001Fast Flip Chip Assembly for Reel-to-Reel Manufacturing
König, M.; Klink, G.; Feil, M.
Conference Paper
2001Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Interconnection Techniques for Ultra Thin ICs and MEMS Elements
Feil, M.; Adler, C.; Klink, G.; König, M.
Conference Paper
2001New dicing and thinning concept improves mechanical reliability of ultra thin silicon
Landesberger, C.; Klink, G.; Schwinn, R.; Aschenbrenner, R.
Conference Paper
2001Paper-thin ICs for Future Smart Label Applications
Klink, G.; Ansorge, F.
Conference Paper
2000Assembly of Ultra Thin and Flexible ICs
Adler, C.; Klink, G.; Feil, M.; Ansorge, F.; Reichl, H.
Conference Paper
2000Aufbau- und Verbindungstechnik für extrem dünne Chips
Klink, G.; Adler, C.; Hemmetzberger, D.; Feil, M.
Conference Paper
2000Investigations on Fine Line Patterning of Advanced Thick Film Paste
Klink, G.; Richter, H.; Feil, M.
Conference Paper
2000Process Evaluation of Advanced Thick Film Techniques for RF-Applications
Klink, G.; Richter, H.; Feil, M.
Conference Paper
2000Ultra Thin ICs Open New Dimensions for Microelectronic Systems
Klink, G.; Landesberger, C.; Feil, M.; Ansorge, F.; Aschenbrenner,R.
Journal Article
1998A fast switching, low power pneumatic microvalve with electrostatic actuation made by silicon micromachining
Kluge, S.; Klink, G.; Woias, P.
Journal Article
1998On the static and dynamic behaviour of an electrostatically movable plate actuator
Kluge, S.; Klink, G.; Biller, M.; Hillerich, B.; Woias, P.
Conference Paper
1998Simultaneous fabrication of dielectric and electrical joints by wafer bonding
Drost, A.; Klink, G.; Scherbaum, S.; Feil, M.
Conference Paper
1998Thin-film processing on a thick-film multilayer
Klink, G.; Drost, A.; Schmaus, C.; Bechtold, F.; Feil, M.
Journal Article
1998Wafer bonding with an adhesive coating
Klink, G.; Hillerich, B.
Conference Paper
1997Anodic bonding with sputtered Pyrex glass
Drost, A.; Scherbaum, S.; Klink, G.
Conference Paper
1997Full-wafer mounting technologies for silicon micropumps
Linnemann, R.; Richter, M.; Kluge, S.; Klink, G.; Landesberger, C.; Woias, P.
Conference Paper
1997Kombination von Dünnfilm- und Dickschichttechnik
Klink, G.; Schmaus, C.; Bechtold, F.; Feil, M.
Conference Paper
1997Verfahren zum Verbinden von mikromechanischen Wafern
Klink, G.
Patent
1992Zuverlässigkeit in der Mikrosystemtechnik - Methoden, Verfahren, Grenzen
Klink, G.; Sandmaier, H.
Conference Paper

 

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