Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Dielectric strength and aging performance of polybutylene terephthalate (PBT) under the influence of temperature and humidity
Wels, S.; Boettge, B.; Bernhardt, R.; Klengel, S.; Claudi, A.
Conference Paper
2020Effects of alloying elements in high reliability copper wire bond material for high temperature applications
Eto, M.; Araki, N.; Yamada, T.; Klengel, R.; Klengel, S.; Petzold, M.; Sugiyama, M.; Fujimoto, S.
Journal Article
2020How copper wire material additive elements effect the reliability of wire bonded contacts in HAST testing
Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Conference Paper
2020Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Klengel, R.; Klengel, S.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Conference Paper
2020Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger
Conference Paper
2020Microstructure and shear force correlation after reliability testing of bond contacts using alternative al heavy wire materials
Klengel, R.; Groth, A.; Hempel, M.; Schischka, J.; Stephan, T.; Klengel, S.; Schneider-Ramelow, M.
Conference Paper
2020Numerical material design for reliable power electronics with cement-based encapsulation
Naumann, F.; Boettge, B.; Behrendt, S.; Eisele, R.; Klengel, S.
Conference Paper
2019Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Conference Paper
2019Investigation of mechanical and microstructural properties of a new, corrosion resistant gold-palladium coated copper bond wire
Lorenz, G.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Conference Paper
2018Corrosion mechanism in metallization systems for printed circuit boards
Klengel, S.; Stephan, T.; Mühs-Portius, B.; Klengel, R.
Conference Paper
2018The influence of environmental conditions on the properties of housing materials for power electronics
Böttge, B.; Bernhardt, R.; Klengel, S.; Wels, S.; Claudi, A.
Conference Paper
2018Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S.
Conference Paper
2018Limitation of test sample arrangements according to IEC 60243-1: Electrical strength of insulating materials - Test methods
Wels, S.; Obst, J.; Claudi, A.; Böttge, B.; Bernhardt, R.; Klengel, S.
Conference Paper
2018Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
Conference Paper
2018Microstructural and chemical investigation of dielectric breakdown areas in engineering plastics
Bernhardt, R.; Böttge, B.; Klengel, S.; Bron, M.; Wels, S.; Claudi, A.
Conference Paper
2018A new method for prediction of corrosion processes in Aluminum housing materials for electronic components
Klengel, S.; Stephan, T.; Mühs-Portius, B.
Conference Paper
2018A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.
Conference Paper
2017A new method for prediction of corrosion processes in metallization systems for substrates and electrical contacts
Klengel, S.; Stpehan, T.; Spohn, U.
Conference Paper
2016Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization
Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S.
Conference Paper
2016Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
Conference Paper
2016Microstructure and thermophysical characterization of innovative plastic materials for power electronics
Klengel, S.; Böttge, B.; Naumann, F.; Mittag, M.; Hirsch, U.; Ehrich, C.
Conference Paper
2016Potential failure risks causing delamination of sinter joints
Boettge, B.; Reissaus, S.; Klengel, S.
Conference Paper
2014Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B.
Conference Paper
2014High resolution failure analysis of silver-sintered contact interfaces for power electronics
Boettge, B.; Maerz, B.; Schischka, J.; Klengel, S.; Petzold, M.
Conference Paper
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Conference Paper
2014Novel failure diagnostic methods for smart card systems
Klengel, S.; Brand, S.; Große, C.; Altmann, F.; Petzold, M.
Conference Paper
2013Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P.
Conference Paper
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Conference Paper
2013Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M.
Conference Paper
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Conference Paper
2012High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
Conference Paper
2012Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H.
Conference Paper